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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
11908779
Issue Dt:
02/20/2024
Application #:
17233778
Filing Dt:
04/19/2021
Publication #:
20210242113
Pub Dt:
08/05/2021
Inventors:
Byong Jin KIM, Hyung Il JEON, Ji Young CHUNG, Kyoung Yeon LEE, Jae Min BAE, Gi Jeong KIM
Title:
LAND STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD THEREFOR
Assignment: 1
Reel/Frame:
055956/0935Recorded: 04/19/2021Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LEE, KYOUNG YEON
Exec Dt:
11/01/2013
KIM, BYONG JIN
Exec Dt:
11/01/2013
BAE, JAE MIN
Exec Dt:
10/30/2013
JEON, HYUNG IL
Exec Dt:
11/01/2013
KI, GI JEONG
Exec Dt:
11/01/2013
CHUNG, JI YOUNG
Exec Dt:
11/01/2013
Assignee:
AMKOR TECHNOLOGY, INC.
2045 E. TECHNOLOGY CIRCLE
TEMPE, ARIZONA 85284
Correspondent:
LAW OFFICE OF KEVIN B JACKSON
6315 E CACTUS WREN RD
PARADISE VALLEY, 85253-8006 UNITED STATES
Assignment: 2
Reel/Frame:
055966/0207Recorded: 04/19/2021Pages: 43
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
AMKOR TECHNOLOGY, INC.
Exec Dt:
01/01/2019
Assignee:
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
491B RIVER VALLEY ROAD
VALLEY POINT #12-03, SINGAPORE 248373
Correspondent:
LAW OFFICE OF KEVIN B JACKSON
6315 E CACTUS WREN RD
PARADISE VALLEY, AZ 85253-8006

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