Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/26/2021
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Application #:
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16787241
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Filing Dt:
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02/11/2020
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Publication #:
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Pub Dt:
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08/12/2021
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Inventors:
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David J. Lewison, Hongqing Zhang, Jay A. Bunt, Jeffrey A. Zitz, Sushumna Iruvanti
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Title:
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CONFORMAL INTEGRATED CIRCUIT (IC) DEVICE PACKAGE LID
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| ZIP GROUP PLLC - IBM FIS |
| 610 KINGSVIEW LN N |
| MINNEAPOLIS, MN 55447 |
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