Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/11/2023
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Application #:
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17223739
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Filing Dt:
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04/06/2021
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Publication #:
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Pub Dt:
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11/25/2021
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Inventors:
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Shunbo WANG, Lei ZHONG
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Title:
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IC PACKAGING STRUCTURE AND IC PACKAGING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 22, XINGSHUN ROAD, YUYAO CITY |
| NINGBO CITY, ZHEJIANG, CHINA 315400 |
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| CASIMIR JONES, S.C. |
| 2275 DEMING WAY STE 310 |
| MIDDLETON, WI 53562 |
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