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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
02/20/2024
Application #:
17550479
Filing Dt:
12/14/2021
Publication #:
Pub Dt:
03/31/2022
Inventors:
Arthur H. Depoi, John Robert Masotta, Boris Rozenfeld, Daniel Wright, Anthony E. Yap
Title:
INTEGRATED ENVELOPE SEALER AND FLIP MODULE
Assignment: 1
Reel/Frame:
058538/0479Recorded: 01/04/2022Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/09/2020
Exec Dt:
03/09/2020
Exec Dt:
03/09/2020
Exec Dt:
03/09/2020
Exec Dt:
03/12/2020
Assignee:
37 EXECUTIVE DRIVE
DANBURY, CONNECTICUT 06810
Correspondent:
BROWN RUDNICK LLP
ONE FINANCIAL CENTER
BOSTON, MA 02111
Assignment: 2
Reel/Frame:
064784/0295Recorded: 08/30/2023Pages: 28
Conveyance:
SECURITY AGREEMENT
Assignors:
Exec Dt:
08/30/2023
Exec Dt:
08/30/2023
Assignee:
ONE BRYANT PARK
NEW YORK, NEW YORK 10036
Correspondent:
CT CORPORATION
4400 EASTON COMMONS WAY
SUITE 125
COLUMBUS, OH 43219
Assignment: 3
Reel/Frame:
064819/0445Recorded: 09/06/2023Pages: 33
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/30/2023
Exec Dt:
08/30/2023
Assignee:
321 N CLARK ST STE 350
CHICAGO, ILLINOIS 60654
Correspondent:
NOREEN GOSSELIN
KIRKLAND & ELLIS LLP
300 NORTH LASALLE
CHICAGO, IL 60654

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