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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17303524
Filing Dt:
06/01/2021
Publication #:
Pub Dt:
09/08/2022
Inventors:
Yu-Wen CHEN, Chun-Wei CHANG, Feng-Jia SHIU, Wei-Chao CHIU, Yong-Jin LIOU, Ching-Sen KUO
Title:
METHOD FOR FORMING DEEP TRENCH ISOLATION IN AN IMAGING SENSOR BY SEPARATELY FORMING FIRST SET OF DEEP TRENCHES IN FIRST DIRECTION THEN FORMING SECOND SET OF DEEP TRENCHES IN SECOND DIRECTION
Assignment: 1
Reel/Frame:
056404/0733Recorded: 06/01/2021Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/02/2021
Exec Dt:
05/03/2021
Exec Dt:
05/03/2021
Exec Dt:
05/31/2021
Exec Dt:
05/02/2021
Exec Dt:
05/02/2021
Assignee:
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
HARRITY AND HARRITY, LLP
11350 RANDOM HILLS ROAD
SUITE 600
FAIRFAX, VA 22030

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