Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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06/04/2024
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Application #:
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17661695
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Filing Dt:
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05/02/2022
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Publication #:
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Pub Dt:
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11/10/2022
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Inventors:
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Jacob L. Smith, Herng-Jeng Jou, Weiming Huang
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Title:
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COPPER ALLOY FILM WITH HIGH STRENGTH AND HIGH CONDUCTIVITY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ONE APPLE PARK WAY |
| CUPERTINO, CALIFORNIA 95014 |
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| DORSEY & WHITNEY LLP/APPLE INC. |
| 111 MAIN STREET |
| SUITE 2100 |
| SALT LAKE CITY, UT 84111 |
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05/25/2024 04:20 AM
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