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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17350371
Filing Dt:
06/17/2021
Publication #:
20220406752
Pub Dt:
12/22/2022
Inventors:
Shin-Puu JENG, Po-Chen LAI, Ming-Chih YEW, Chin-Hua WANG, Po-Yao LIN, Shu-Shen YEH et al
Title:
SEMICONDUCTOR DIE WITH TAPERED SIDEWALL IN PACKAGE AND FABRICATING METHOD THEREOF
Assignment: 1
Reel/Frame:
056575/0147Recorded: 06/17/2021Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
WANG, CHIN-HUA
Exec Dt:
11/30/2020
JENG, SHIN-PUU
Exec Dt:
11/16/2020
LIN, PO-YAO
Exec Dt:
11/18/2020
LAI, PO-CHEN
Exec Dt:
11/17/2020
YEH, SHU-SHEN
Exec Dt:
11/16/2020
YEW, MING-CHIH
Exec Dt:
11/16/2020
LIN, YU-SHENG
Exec Dt:
11/16/2020
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
MCCLURE, QUALEY & RODACK, LLP
280 INTERSTATE NORTH CIRCLE SE
SUITE 550
ATLANTA, GA 30339

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