Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17693604
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Filing Dt:
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03/14/2022
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Publication #:
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Pub Dt:
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01/26/2023
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Inventor:
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Hung-Te LIN
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Title:
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Semiconductor Arrangement and Method of Manufacture
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN ROAD 6, |
| HSINCHU, TAIWAN 300-78 |
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| COOPER LEGAL GROUP LLC |
| 1388 RIDGE ROAD, UNIT 1 |
| HINCKLEY, OH 44233 |
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05/26/2024 02:52 AM
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