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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17389142
Filing Dt:
07/29/2021
Publication #:
Pub Dt:
02/02/2023
Inventors:
Chih-Chung Chang, Sung-En Lin, Chung-Ting Ko, You-Ting Lin, Yi-Hsiu Liu, Po-Wei Liang et al
Title:
Semiconductor Device With A Core-Shell Feature And Method For Forming The Same
Assignment: 1
Reel/Frame:
058420/0667Recorded: 12/17/2021Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/28/2021
Exec Dt:
07/28/2021
Exec Dt:
07/28/2021
Exec Dt:
08/15/2021
Exec Dt:
07/28/2021
Exec Dt:
11/03/2021
Exec Dt:
08/01/2021
Exec Dt:
07/28/2021
Exec Dt:
07/28/2021
Exec Dt:
07/28/2021
Exec Dt:
11/11/2021
Assignee:
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
HAYNES AND BOONE, LLP (24061) IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219

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