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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
NONE
Issue Dt:
06/11/2024
Application #:
17504284
Filing Dt:
10/18/2021
Publication #:
Pub Dt:
04/20/2023
Inventors:
Soon Lee Liew, Eng Wah Woo, Alexander Komposch
Title:
METHODS OF FORMING PACKAGED SEMICONDUCTOR DEVICES AND LEADFRAMES FOR SEMICONDUCTOR DEVICE PACKAGES
Assignment: 1
Reel/Frame:
057962/0460Recorded: 10/28/2021Pages: 5
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/01/2021
Assignee:
4600 SILICON DRIVE
DURHAM, NORTH CAROLINA 27703
Correspondent:
SAGE PATENT GROUP
PO BOX 30789
RALEIGH, NC 27622-0789
Assignment: 2
Reel/Frame:
057946/0255Recorded: 10/28/2021Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/22/2021
Exec Dt:
10/20/2021
Exec Dt:
10/21/2021
Assignee:
4600 SILICON DRIVE
DURHAM, NORTH CAROLINA 27703
Correspondent:
SAGE PATENT GROUP/WOLFSPEED
PO BOX 30789
RALEIGH, NC 27622-0789
Assignment: 3
Reel/Frame:
066236/0086Recorded: 12/29/2023Pages: 65
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/06/2023
Assignee:
100 CHELMSFORD STREET
LOWELL, MASSACHUSETTS 01851
Correspondent:
ROB WINDER
4000 MACARTHUR BLVD
NEWPORT BEACH, CA 92660

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