Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18155878
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Filing Dt:
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01/18/2023
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Publication #:
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Pub Dt:
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05/18/2023
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Inventors:
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HunTeak Lee, Wanil Lee, DeokKyung Yang, HeeSoo Lee, SangDuk Lee
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Title:
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Molded Laser Package with Electromagnetic Interference Shield and Method of Making
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE 768442 |
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| PATENT LAW GROUP: ATKINS AND ASSOCIATES, P.C. |
| 123 W. CHANDLER HEIGHTS ROAD, #12535 |
| CHANDLER, AZ 85248 |
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05/25/2024 08:38 PM
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