Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17564170
|
Filing Dt:
|
12/28/2021
|
|
Publication #:
|
|
Pub Dt:
|
06/29/2023
| | | | |
|
Inventors:
|
Timothy J. Chainer, Mark D. Schultz, Russell A. Budd, Todd Edward Takken, Matthew Doyle
|
|
Title:
|
WAFER TO WAFER HIGH DENSITY INTERCONNECTS
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
|
|
|
|
| GABRIEL DANIEL |
| INTELLETEK LAW GROUP, PLLC |
| 800 2ND AVE, SUITE 804 |
| NEW YORK, NY 10017 |
|
|
Search Results as of:
05/20/2024 11:47 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
