Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/16/2024
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Application #:
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17130182
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Filing Dt:
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12/22/2020
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Publication #:
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Pub Dt:
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08/03/2023
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Inventors:
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Byong Jin KIM, Ji Young CHUNG, Won Bae BANG, Gi Jeong KIM
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Title:
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METHOD OF FORMING A MOLDED SUBSTRATE ELECTRONIC PACKAGE AND STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2045 E. TECHNOLOGY CIRCLE |
| TEMPE, ARIZONA 85284 |
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| LAW OFFICE OF KEVIN JACKSON |
| 6315 E. CACTUS WREN RD |
| PARADISE VALLEY, AZ 85253 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 491B RIVER VALLEY ROAD |
| VALLEY POINT #12-03, SINGAPORE 248373 |
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| LAW OFFICE OF KEVIN B JACKSON |
| 6315 E CACTUS WREN RD |
| PARADISE VALLEY, AZ 85253-8006 |
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