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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18334466
Filing Dt:
06/14/2023
Publication #:
Pub Dt:
10/12/2023
Inventors:
Alexander Komposch, Eng Wah Woo, Basim Noori
Title:
RF AMPLIFIER DEVICES AND METHODS OF MANUFACTURING INCLUDING MODULARIZED DESIGNS WITH FLIP CHIP INTERCONNECTIONS AND INTEGRATION INTO PACKAGING
Assignment: 1
Reel/Frame:
063944/0644Recorded: 06/14/2023Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/08/2023
Exec Dt:
06/06/2023
Exec Dt:
06/13/2023
Assignee:
4600 SILICON DRIVE
DURHAM, NORTH CAROLINA 27703
Correspondent:
MYERS BIGEL, P.A.
4140 PARKLAKE AVENUE
SUITE 600
RALEIGH, NC 27612

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