Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17843195
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Filing Dt:
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06/17/2022
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Publication #:
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Pub Dt:
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12/21/2023
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Inventors:
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Kuan-Neng CHEN, Hao-Tung CHUNG, Yu-Ming PAN, Chenming HU, Po-Tsang HUANG, Bo-Jheng SHIH
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Title:
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THREE DIMENSIONAL INTEGRATED CIRCUIT AND FABRICATION THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| NO.1001, DAXUE RD., EAST DIST. |
| HSINCHU CITY, TAIWAN 300 |
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| BIRCH STEWART KOLASCH & BIRCH LLP |
| 8110 GATEHOUSE ROAD, SUITE 100E |
| FALLS CHURCH, VA 22042-0747 |
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