Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18469374
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Filing Dt:
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09/18/2023
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Publication #:
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Pub Dt:
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01/04/2024
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Inventors:
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Boon Teik Chan, Zheng Tao, Efrain Altamirano Sanchez, Anshul Gupta, Basoene Briggs
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Title:
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Method for Forming a Buried Metal Line in a Semiconductor Substrate
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| KAPELDREEF 75 |
| LEUVEN, BELGIUM 3001 |
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| MCDONNELL BOEHNEN HULBERT & BERGHOFF LLP |
| 300 SOUTH WACKER DRIVE |
| 3100 |
| CHICAGO, IL 60606 |
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05/25/2024 03:41 PM
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