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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18378052
Filing Dt:
10/09/2023
Publication #:
Pub Dt:
02/15/2024
Inventors:
Franz Zach, Mark D. Smith, Roel Gronheid
Title:
SYSTEM AND METHOD FOR MITIGATING OVERLAY DISTORTION PATTERNS CAUSED BY A WAFER BONDING TOOL
Assignment: 1
Reel/Frame:
065163/0039Recorded: 10/09/2023Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/27/2022
Exec Dt:
03/28/2022
Exec Dt:
03/01/2022
Assignee:
ONE TECHNOLOGY DRIVE
MILPITAS, CALIFORNIA 95035
Correspondent:
SUITER SWANTZ/KLA JOINT CUSTOMER NUMBER
14301 FNB PARKWAY
SUITE 220
OMAHA, NE 68154-5299

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