Patent Assignment Details
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Reel/Frame: | 006208/0188 | |
| Pages: | 3 |
| | Recorded: | 08/03/1992 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/09/1994
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Application #:
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07890898
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Filing Dt:
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05/29/1992
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Title:
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CERAMIC VIA COMPOSITION, MULTILAYER CERAMIC CIRCUIT CONTAINING SAME, AND PROCESS FOR USING SAME
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Correspondence name and address
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IBM CORPORATION
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IRA DAVID BLECKER
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DEPARTMENT 18G/BLDG. 300-482
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1580 ROUTE 52
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HOPEWELL JUNCTION, NEW YORK 12533-6531
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