Patent Assignment Details
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| Reel/Frame: | 006691/0847 | |
| Pages: | 4 |
| | Recorded: | 09/02/1993 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/17/1996
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Application #:
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08116167
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Filing Dt:
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09/02/1993
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Title:
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ENCAPSULATED SEMICONDUCTOR CHIP MODULE AND METHOD OF FORMING THE SAME
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Assignee
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| OLD ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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LAWRENCE H. MEIER
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INTELLECTUAL PROPERTY, LAW DEPT.
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IBM CORPORATION, DEPT. 915
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1000 RIVER STREET
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ESSEX JUNCTION, VT 05452
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