Patent Assignment Details
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| Reel/Frame: | 007001/0862 | |
| Pages: | 3 |
| | Recorded: | 05/02/1994 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/28/1995
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Application #:
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08236320
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Filing Dt:
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05/02/1994
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Title:
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SEMICONDUCTOR DEVICE SOLDER BUMP HAVING INTRINSIC POTENTIAL FOR FORMING AN EXTENDED EUTECTIC REGION AND METHOD FOR MAKING AND USING THE SAME
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Assignee
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| 1303 EAST ALGONQUIN ROAD |
| SCHAUMBURG, ILLINOIS 60196 |
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Correspondence name and address
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MINH-HIEN N. CLARK
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MOTOROLA, INC.
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INTELLECTUAL PROPERTY DEPT.
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505 BARTON SPRINGS RD., STE. 500
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AUSTIN, TX 78704
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