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Patent Assignment Details

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Reel/Frame:	008752/0948			Pages:	4
		Recorded:	04/30/1997
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 1

Patent #:	5881944	Issue Dt:	03/16/1999	Application #:	08846929	Filing Dt:	04/30/1997
Title:	MULTI-LAYER SOLDER SEAL BAND FOR SEMICONDUCTOR SUBSTRATES

Assignors

EDWARDS, DAVID L.

Exec Dt:

04/30/1997

CAMMARANO, ARMANDO S.

Exec Dt:

04/29/1997

COFFIN, JEFFREY T.

Exec Dt:

04/30/1997

COURTNEY, MARK G.

Exec Dt:

04/29/1997

DROFITZ, STEPHEN S., JR.

Exec Dt:

04/29/1997

ELLSWORTH, MICHAEL J., JR.

Exec Dt:

04/29/1997

GOLDMANN, LEWIS S.

Exec Dt:

04/29/1997

IRUVANTI, SUSHUMNA

Exec Dt:

04/29/1997

POMPEO, FRANK L.

Exec Dt:

04/30/1997

SABLINSKI, WILLIAM E.

Exec Dt:

04/30/1997

SHERIF, RAED A.

Exec Dt:

04/29/1997

TOY, HILTON T.

Exec Dt:

04/29/1997

Assignee

INTERNATIONAL BUSINESS MACHINES CORPORATION

OLD ORCHARD ROAD

ARMONK, NEW YORK 10504

Correspondence name and address
	IBM CORPORATION
	AZIZ M. AHSAN, ESQ.
	D/18G, B/300, Z/482
	1580 ROUTE 52
	HOPEWELL JCT., NY 112533-6531

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