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Patent Assignment Details
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Reel/Frame:010395/0105   Pages: 5
Recorded: 11/15/1999
Conveyance: SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 3
1
Patent #:
Issue Dt:
09/29/1981
Application #:
06122527
Filing Dt:
02/19/1980
Title:
CERAMIC LID ASSEMBLY FOR HERMETIC SEALING OF A SEMICONDUCTOR CHIP
2
Patent #:
Issue Dt:
10/26/1982
Application #:
06235094
Filing Dt:
02/17/1981
Title:
METHOD OF MAKING CERAMIC LID ASSEMBLY FOR HERMETIC SEALING OF A SEMICONDUCTOR CHIP
3
Patent #:
Issue Dt:
05/09/1995
Application #:
08064255
Filing Dt:
05/20/1993
Title:
METHOD FOR MAKING HEAT-DISSIPATING ELEMENTS FOR MICRO-ELECTRONIC DEVICES
Assignor
1
Exec Dt:
10/28/1999
Assignee
1
TWO TOWER CENTER BOULEVARD
EAST BRUNSWICK, NEW JERSEY 08816
Correspondence name and address
PRYOR CASHMAN SHERMAN & FLYNN LLP
LORA A. MOFFATT
410 PARK AVENUE
NEW YORK, NEW YORK 10022

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