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Patent Assignment Details
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Reel/Frame:010437/0905   Pages: 15
Recorded: 12/06/1999
Conveyance: SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 6
1
Patent #:
Issue Dt:
09/29/1981
Application #:
06122527
Filing Dt:
02/19/1980
Title:
CERAMIC LID ASSEMBLY FOR HERMETIC SEALING OF A SEMICONDUCTOR CHIP
2
Patent #:
Issue Dt:
06/07/1994
Application #:
07934258
Filing Dt:
08/25/1992
Title:
AUTOMATIC WIRE DE-SPOOLER FOR WIRE BONDING MACHINES
3
Patent #:
Issue Dt:
05/09/1995
Application #:
08064255
Filing Dt:
05/20/1993
Title:
METHOD FOR MAKING HEAT-DISSIPATING ELEMENTS FOR MICRO-ELECTRONIC DEVICES
4
Patent #:
Issue Dt:
03/23/1999
Application #:
08654974
Filing Dt:
05/28/1996
Title:
HEAT-DISSIPATING PACKAGE FOR MICROCIRCUIT DEVICES
5
Patent #:
Issue Dt:
05/29/2001
Application #:
08819290
Filing Dt:
03/18/1997
Title:
ISOTROPIC CARBON/COPPER COMPOSITES
6
Patent #:
Issue Dt:
03/02/1999
Application #:
08947478
Filing Dt:
10/10/1997
Title:
HEAT-DISSIPATING SUBSTRATE FOR MICRO-ELECTRONIC DEVICES AND FABRICATION METHOD
Assignors
1
Exec Dt:
11/01/1999
2
Exec Dt:
11/01/1999
Assignee
1
TWO TOWER CENTER BOULEVARD
EAST BRUNSWICK, NEW JERSEY 08816
Correspondence name and address
PRYOR CASHMAN SHERMAN & FLYNN LLP
LORA A. MOFFATT
410 PARK AVENUE
NEW YORK, NY 10022

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