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Patent #:
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Issue Dt:
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11/16/1999
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Application #:
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08844543
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Filing Dt:
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04/18/1997
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Title:
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EXHAUST CONTROL FOR WATERCRAFT ENGINE
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Patent #:
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Issue Dt:
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05/21/2002
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Application #:
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09024940
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Filing Dt:
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02/17/1998
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Publication #:
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Pub Dt:
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08/23/2001
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Title:
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METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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12/19/2000
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Application #:
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09078377
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Filing Dt:
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05/13/1998
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Title:
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INTEGRATED CIRCUIT CHIP TO SUBSTRATE INTERCONNECTION
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Patent #:
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Issue Dt:
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11/21/2000
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Application #:
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09083524
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Filing Dt:
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05/22/1998
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Title:
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RF SHIELDED DEVICE
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Patent #:
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Issue Dt:
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11/07/2000
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Application #:
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09103760
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Filing Dt:
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06/24/1998
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Title:
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PLASTIC INTEGRATED CIRCUIT PACKAGE AND METHOD AND LEADFRAME FOR MAKING THE PACKAGE
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Patent #:
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Issue Dt:
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09/26/2000
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Application #:
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09161189
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Filing Dt:
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09/25/1998
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Title:
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CARRIER STRIP AND MOLDED FLEX CIRCUIT BALL GRID ARRAY
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Patent #:
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Issue Dt:
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11/07/2000
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Application #:
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09176048
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Filing Dt:
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10/20/1998
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Title:
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A METHOD OF MAKING AN INTEGRATED CIRCUIT PACKAGE EMPLOYING A TRANSPARENT ENCAPSULANT
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Patent #:
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Issue Dt:
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08/28/2001
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Application #:
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09176614
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Filing Dt:
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10/21/1998
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Title:
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PLASTIC INTEGRATED CIRCUIT DEVICE PACKAGE AND LEADFRAME
HAVING PARTIALLY UNDERCUT LEADS AND DIE PAD
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Patent #:
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Issue Dt:
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03/27/2001
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Application #:
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09199041
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Filing Dt:
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11/24/1998
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Title:
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METHOD OF FORMING TITANIUM SILICIDE
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Patent #:
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Issue Dt:
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09/05/2000
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Application #:
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09199706
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Filing Dt:
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11/24/1998
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Title:
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METHOD FOR FORMING ISOLATION TRENCHES ON A SEMICONDUCTOR SUBSTRATE
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Patent #:
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Issue Dt:
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11/21/2000
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Application #:
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09203720
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Filing Dt:
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12/01/1998
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Title:
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GRID ARRAY TYPE LEAD FRAME HAVING LEAD ENDS IN DIFFERENT PLANES
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Patent #:
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Issue Dt:
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12/11/2001
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Application #:
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09203826
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Filing Dt:
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12/01/1998
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Title:
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GRID ARRAY ASSEMBLY OF CIRCUIT BOARDS WITH SINGULATION GROOVES
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Patent #:
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Issue Dt:
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10/17/2000
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Application #:
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09220987
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Filing Dt:
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12/23/1998
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Title:
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METHOD FOR CALIBRATING OPTICAL SENSOR USED TO MEASURE THE
TEMPERATURE OF A SUBSTRATE DURING RAPID THERMAL PROCESS
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Patent #:
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Issue Dt:
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03/13/2001
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Application #:
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09223236
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Filing Dt:
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12/30/1998
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Title:
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MOS TRANSISTOR THAT INHIBITS PUNCHTHROUGH AND METHOD FOR FABRICATING THE SAME
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Patent #:
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Issue Dt:
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03/20/2001
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Application #:
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09223471
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Filing Dt:
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12/30/1998
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Title:
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TRENCH STRUCTURE FOR ISOLATING SEMICONDUCTOR ELEMENTS AND METHOD FOR FORMING THE SAME
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Patent #:
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Issue Dt:
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10/15/2002
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Application #:
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09233980
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Filing Dt:
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01/20/1999
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Title:
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MICROCIRCUIT DIE-SAWING PROTECTOR AND METHOD
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Patent #:
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Issue Dt:
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06/12/2001
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Application #:
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09240422
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Filing Dt:
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01/29/1999
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Title:
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"PRINTED CIRCUIT BOARD FOR BALL GRID ARRAY SEMICONDUCTOR PACKAGES"
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Patent #:
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Issue Dt:
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04/10/2001
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Application #:
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09240423
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Filing Dt:
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01/29/1999
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Title:
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METHOD OF MOLDING BALL GRID ARRAY SEMICONDUCTOR PACKAGES
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Patent #:
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Issue Dt:
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06/12/2001
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Application #:
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09246574
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Filing Dt:
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02/08/1999
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Title:
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ELECTROSTATIC DISCHARGE PROTECTION PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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06/11/2002
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Application #:
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09261280
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Filing Dt:
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03/02/1999
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Title:
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TEST PATTERN FOR MEASURING VARIATIONS OF CRITICAL DIMENSIONS OF WIRING PATTERNS FORMED IN THE FABRICATION OF SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
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10/02/2001
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Application #:
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09262789
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Filing Dt:
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03/04/1999
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Title:
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METHOD FOR FORMING A MENTAL WIRING PATTERN ON A SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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10/16/2001
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Application #:
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09287711
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Filing Dt:
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04/07/1999
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Title:
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THIN, STACKABLE SEMICONDUCTOR PACKAGES
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Patent #:
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Issue Dt:
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07/31/2001
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Application #:
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09305170
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Filing Dt:
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05/04/1999
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Title:
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PRINTED CIRCUIT BOARD WITH OVAL SOLDER BALL LANDS FOR BGA SEMICONDUCTOR PACKAGES
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Patent #:
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Issue Dt:
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01/08/2002
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Application #:
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09310660
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Filing Dt:
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05/12/1999
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Title:
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LOW-COST PRINTED CIRCUIT BOARD WITH INTEGRAL HEAT SINK FOR SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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08/14/2001
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Application #:
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09324710
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Filing Dt:
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06/03/1999
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Title:
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PLASTIC PACKAGE FOR AN OPTICAL INTEGRATED CIRCUIT DEVICE AND METHOD OF MAKING
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Patent #:
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Issue Dt:
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05/08/2001
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Application #:
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09348772
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Filing Dt:
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07/07/1999
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Title:
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NEAR CHIP SIZE INTEGRATED CIRCUIT PACKAGE
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Patent #:
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Issue Dt:
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07/10/2001
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Application #:
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09370600
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Filing Dt:
|
08/09/1999
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Title:
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METHOD OF MAKING AN ELECTRONIC DEVICE PACKAGE AND LEADFRAME
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Patent #:
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|
Issue Dt:
|
06/19/2001
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Application #:
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09383022
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Filing Dt:
|
08/25/1999
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Title:
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METHOD OF FORMING AN INTEGRATED CIRCUIT DEVICE PACKAGE USING A PLASTIC TAPE AS A BASE
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Patent #:
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Issue Dt:
|
07/08/2003
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Application #:
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09385694
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Filing Dt:
|
08/30/1999
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Title:
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WAFER-SCALE PRODUCTION OF CHIP-SCALE SEMICONDUCTOR PACKAGES USING WAFER MAPPING TECHNIQUES
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Patent #:
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Issue Dt:
|
08/06/2002
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Application #:
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09385695
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Filing Dt:
|
08/30/1999
|
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Title:
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METHOD FOR LAMINATING CIRCUIT PATTERN TAPE ON SEMICONDUCTOR WAFER
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Patent #:
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Issue Dt:
|
09/10/2002
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Application #:
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09385696
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Filing Dt:
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08/30/1999
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Title:
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SURFACE ACOUSTICAL WAVE FLIP CHIP
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Patent #:
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Issue Dt:
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11/12/2002
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Application #:
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09387377
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Filing Dt:
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08/30/1999
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Title:
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CIRCUIT PATTERN TAPE FOR WAFER-SCALE PRODUCTION OF CHIP SIZE SEMICONDUCTOR PACKAGES
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Patent #:
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Issue Dt:
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08/20/2002
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Application #:
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09391792
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Filing Dt:
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09/08/1999
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Title:
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LEAD FRAME USED FOR THE FABRICATION OF SEMICONDUCTOR PACKAGES AND SEMICONDUCTOR PACKAGE FABRICATED USING THE SAME
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Patent #:
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Issue Dt:
|
09/24/2002
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Application #:
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09395875
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Filing Dt:
|
09/14/1999
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Title:
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METHOD FOR MOLDING A LEADFRAME IN PLASTIC INTEGRATED CIRCUIT DEVICES
|
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Patent #:
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Issue Dt:
|
02/11/2003
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Application #:
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09412889
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Filing Dt:
|
10/05/1999
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Title:
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METHOD OF MAKING AN INTEGRATED CIRCUIT PACKAGE USING A BATCH STEP FOR CURING A DIE ATTACHMENT FILM AND A TOOL SYSTEM FOR PERFORMING THE METHOD
|
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Patent #:
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Issue Dt:
|
03/06/2001
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Application #:
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09420065
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Filing Dt:
|
10/18/1999
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Title:
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THIN LEADFRAME-TYPE SEMICONDUCTOR PACKAGE HAVING HEAT SINK WITH RECESS AND EXPOSED SURFACE
|
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Patent #:
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Issue Dt:
|
07/30/2002
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Application #:
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09421454
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Filing Dt:
|
10/19/1999
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Title:
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METHODS AND A DEVICE FOR HEAT TREATMENT A SEMICONDUCTOR WAFER HAVING DIFFERENT KINDS OF IMPURITIES
|
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Patent #:
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Issue Dt:
|
10/08/2002
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Application #:
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09422027
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Filing Dt:
|
10/20/1999
|
|
Title:
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CHIP-SCALE SEMICONDUCTOR PACKAGE OF THE FAN-OUT TYPE AND METHOD OF MANUFACTURING SUCH PACKAGES
|
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|
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Patent #:
|
|
Issue Dt:
|
12/03/2002
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Application #:
|
09422115
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Filing Dt:
|
10/20/1999
|
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SUCH DEVICE
|
|
|
|
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Patent #:
|
|
Issue Dt:
|
12/18/2001
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Application #:
|
09434546
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Filing Dt:
|
11/05/1999
|
|
Title:
|
METHODS OF MAKING THIN INTEGRATED CIRCUIT DEVICE PACKAGES WITH IMPROVED THERMAL PERFORMANCE AND SUBSTRATES FOR MAKING THE PACKAGES
|
|
|
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Patent #:
|
|
Issue Dt:
|
06/17/2003
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Application #:
|
09434589
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Filing Dt:
|
11/05/1999
|
|
Title:
|
INTEGRATED CIRCUIT DEVICE PACKAGES AND SUBSTRATES FOR MAKING THE PACKAGES
|
|
|
|
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Patent #:
|
|
Issue Dt:
|
01/25/2005
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Application #:
|
09436158
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Filing Dt:
|
11/09/1999
|
|
Title:
|
SEMICONDUCTOR PACKAGE WITH EXPOSED DIE PAD AND BODY-LOCKING LEADFRAME
|
|
|
|
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Patent #:
|
|
Issue Dt:
|
09/18/2001
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Application #:
|
09437013
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Filing Dt:
|
11/09/1999
|
|
Title:
|
CHIP-SIZE SEMICONDUCTOR PACKAGES
|
|
|
|
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Patent #:
|
|
Issue Dt:
|
07/31/2001
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Application #:
|
09437574
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Filing Dt:
|
11/09/1999
|
|
Title:
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INTEGRATED CIRCUIT PACKAGE HAVING ADHESIVE BEAD SUPPORTING PLANAR LID ABOVE PLANAR SUBSTRATE
|
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Patent #:
|
|
Issue Dt:
|
11/05/2002
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Application #:
|
09439917
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Filing Dt:
|
11/12/1999
|
|
Title:
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CAVITY SEMICONDUCTOR PACKAGE WITH EXPOSED LEADS AND DIE PAD AND METHOD FOR MAKING THE SAME
|
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|
|
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Patent #:
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|
Issue Dt:
|
07/09/2002
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Application #:
|
09440808
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Filing Dt:
|
11/15/1999
|
|
Title:
|
MICROMACHINE PACKAGE FABRICATION METHOD
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Patent #:
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|
Issue Dt:
|
10/30/2001
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Application #:
|
09441115
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Filing Dt:
|
11/17/1999
|
|
Title:
|
METHOD OF MOLDING PLASTIC SEMICONDUCTOR PACKAGES
|
|
|
|
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Patent #:
|
|
Issue Dt:
|
09/10/2002
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Application #:
|
09444035
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Filing Dt:
|
11/19/1999
|
|
Title:
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SEMICONDUCTOR PACKAGE AND METHOD OF MAKING USING LEADFRAME HAVING LEAD LOCKS TO SECURE LEADS TO ENCAPSULANT
|
|
|
|
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Patent #:
|
|
Issue Dt:
|
09/30/2003
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Application #:
|
09447202
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Filing Dt:
|
11/22/1999
|
|
Title:
|
THIN IMAGE SENSOR PACKAGE HAVING TRANSPARENT SUBSTRATE
|
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Patent #:
|
|
Issue Dt:
|
05/28/2002
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Application #:
|
09448538
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Filing Dt:
|
11/22/1999
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Title:
|
THIN IMAGE SENSOR PACKAGE FABRICATION METHOD
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09449070
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Filing Dt:
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11/23/1999
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Publication #:
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Pub Dt:
|
07/25/2002
| | | | |
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Title:
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METHOD OF ATTACHING A SHEET OF AN ADHESIVE FILM TO A SUBSTRATE IN THE COURSE OF MAKING INTEGRATED CIRCUIT PACKAGES
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Patent #:
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|
Issue Dt:
|
10/31/2000
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Application #:
|
09452454
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Filing Dt:
|
12/02/1999
|
|
Title:
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SOFT TOY STRUCTURE CONTAINING THEREIN A FLUID MATERIAL AND A METHOD FOR MANUFACTURING THE SOFT TOY
|
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Patent #:
|
|
Issue Dt:
|
09/24/2002
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Application #:
|
09457505
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Filing Dt:
|
12/08/1999
|
|
Title:
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MOLDED IMAGE SENSOR PACKAGE
|
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|
|
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Patent #:
|
|
Issue Dt:
|
11/19/2002
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Application #:
|
09457513
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Filing Dt:
|
12/08/1999
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Title:
|
MOLDED IMAGE SENSOR PACKAGE HAVING LENS HOLDER
|
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|
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Patent #:
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Issue Dt:
|
03/04/2003
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Application #:
|
09457515
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Filing Dt:
|
12/08/1999
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|
Title:
|
METHOD OF ASSEMBLING A SNAP LID IMAGE SENSOR PACKAGE
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Patent #:
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Issue Dt:
|
11/19/2002
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Application #:
|
09457516
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Filing Dt:
|
12/08/1999
|
|
Title:
|
SNAP LID IMAGE SENSOR PACKAGE
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|
|
|
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Patent #:
|
|
Issue Dt:
|
05/21/2002
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Application #:
|
09457517
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Filing Dt:
|
12/08/1999
|
|
Title:
|
METHOD OF FABRICATING IMAGE SENSOR PACKAGES IN AN ARRAY
|
|
|
|
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Patent #:
|
|
Issue Dt:
|
07/24/2001
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Application #:
|
09458033
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Filing Dt:
|
12/08/1999
|
|
Title:
|
MOLDED WINDOW ARRAY FOR IMAGE SENSOR PACKAGES
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|
|
|
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Patent #:
|
|
Issue Dt:
|
07/23/2002
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Application #:
|
09460175
|
Filing Dt:
|
12/10/1999
|
|
Title:
|
A MICROELECTRONIC DEVICE PACKAGE HAVING A HEAT SINK STRUCTURE FOR INCREASING THE THERMAL CONDUCTIVITY OF THE PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/09/2002
|
Application #:
|
09461523
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Filing Dt:
|
12/14/1999
|
|
Title:
|
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
|
|
|
|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
09483212
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Filing Dt:
|
01/14/2000
|
|
Publication #:
|
|
Pub Dt:
|
05/01/2003
| | | | |
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Title:
|
Package for multiple integrated circuits and method of making
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|
|
|
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Patent #:
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|
Issue Dt:
|
11/20/2001
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Application #:
|
09484192
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Filing Dt:
|
01/18/2000
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Title:
|
Stackable package for an integrated circuit
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Patent #:
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|
Issue Dt:
|
07/02/2002
|
Application #:
|
09490317
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Filing Dt:
|
01/24/2000
|
|
Title:
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PACKAGE FOR STACKED INTEGRATED CIRCUITS
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Patent #:
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Issue Dt:
|
02/04/2003
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Application #:
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09490717
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Filing Dt:
|
01/25/2000
|
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Title:
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PROTECTED IMAGE SENSOR PACKAGE
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Patent #:
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Issue Dt:
|
01/28/2003
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Application #:
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09491112
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Filing Dt:
|
01/25/2000
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Title:
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PROTECTED IMAGE SENSOR PACKAGE FABRICATION METHOD
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Patent #:
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Issue Dt:
|
12/02/2003
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Application #:
|
09496991
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Filing Dt:
|
02/02/2000
|
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Title:
|
FABRICATING VERY THIN CHIP SIZE SEMICONDUCTOR PACKAGES
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|
|
|
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Patent #:
|
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Issue Dt:
|
06/11/2002
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Application #:
|
09497377
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Filing Dt:
|
02/03/2000
|
|
Title:
|
MODULE OF STACKED INTEGRATED CIRCUIT PACKAGES INCLUDING AN INTERPOSER
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|
|
|
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Patent #:
|
|
Issue Dt:
|
01/15/2002
|
Application #:
|
09498144
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Filing Dt:
|
02/04/2000
|
|
Title:
|
Making chip size semiconductor packages
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Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
09504007
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Filing Dt:
|
02/14/2000
|
|
Publication #:
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Pub Dt:
|
08/01/2002
| | | | |
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Title:
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Method of forming an integrated circuit device package using a temporary substrate
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Patent #:
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|
Issue Dt:
|
09/10/2002
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Application #:
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09505395
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Filing Dt:
|
02/16/2000
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Title:
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PRINTED CIRCUIT BOARD WITH HEAT SPREADER AND METHOD OF MAKING
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Patent #:
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|
Issue Dt:
|
03/07/2006
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Application #:
|
09513067
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Filing Dt:
|
02/24/2000
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Title:
|
NONEXPOSED HEAT SINK FOR SEMICONDUCTOR PACKAGE
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Patent #:
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|
Issue Dt:
|
07/23/2002
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Application #:
|
09513232
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Filing Dt:
|
02/24/2000
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Title:
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LEADFRAME FOR MOLDED SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MADE USING THE LEADFRAME
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Patent #:
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|
Issue Dt:
|
10/01/2002
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Application #:
|
09536236
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Filing Dt:
|
03/27/2000
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Title:
|
ATTACHING SEMICONDUCTOR DIES TO SUBSTRATES WITH CONDUCTIVE STRAPS
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|
|
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Patent #:
|
|
Issue Dt:
|
06/03/2003
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Application #:
|
09536830
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Filing Dt:
|
03/27/2000
|
|
Title:
|
FLIP CHIP IMAGE SENSOR PACKAGE FABRICATION METHPD
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|
|
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Patent #:
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|
Issue Dt:
|
09/03/2002
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Application #:
|
09539314
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Filing Dt:
|
03/30/2000
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Title:
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METHOD FOR FABRICATING A SNAPABLE MULTI-PACKAGE ARRAY SUBSTRATE, SNAPABLE MULTI-PACKAGE ARRAY AND SNAPABLE PACKAGED ELECTRONIC COMPONENTS
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Patent #:
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Issue Dt:
|
10/29/2002
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Application #:
|
09548702
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Filing Dt:
|
04/13/2000
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Title:
|
ELECTROMAGNETIC INTERFERENCE SHIELD DEVICE AND METHOD
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|
|
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Patent #:
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|
Issue Dt:
|
06/17/2003
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Application #:
|
09548705
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Filing Dt:
|
04/13/2000
|
|
Title:
|
MATRIX TYPE PRINTED CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGES
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|
|
|
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Patent #:
|
|
Issue Dt:
|
08/05/2003
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Application #:
|
09551416
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Filing Dt:
|
04/18/2000
|
|
Title:
|
METHOD OF MAKING AN ELECTROMAGNETIC INTERFERENCE SHIELD DEVICE
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|
|
|
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Patent #:
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|
Issue Dt:
|
10/30/2001
|
Application #:
|
09558392
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Filing Dt:
|
04/25/2000
|
|
Title:
|
Precision marking and singulation method
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|
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Patent #:
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|
Issue Dt:
|
04/16/2002
|
Application #:
|
09561180
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Filing Dt:
|
04/27/2000
|
|
Title:
|
Moisture-resistant integrated circuit chip package and method
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/18/2002
|
Application #:
|
09565586
|
Filing Dt:
|
05/04/2000
|
|
Title:
|
MOISTURE-RESISTANT INTEGRATED CIRCUIT CHIP PACKAGE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/06/2002
|
Application #:
|
09565881
|
Filing Dt:
|
05/05/2000
|
|
Title:
|
LONG WIRE IC PACKAGE
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|
|
|
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Patent #:
|
|
Issue Dt:
|
02/04/2003
|
Application #:
|
09566069
|
Filing Dt:
|
05/05/2000
|
|
Title:
|
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/11/2003
|
Application #:
|
09566658
|
Filing Dt:
|
05/08/2000
|
|
Title:
|
STACKABLE PACKAGE HAVING A CAVITY AND A LID FOR AN ELECTRONIC DEVICE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/23/2002
|
Application #:
|
09566680
|
Filing Dt:
|
05/08/2000
|
|
Title:
|
STACKABLE PACKAGE WITH HEAT SINK
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/04/2001
|
Application #:
|
09566849
|
Filing Dt:
|
05/05/2000
|
|
Title:
|
Lowwire ic package fabrication method
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/27/2002
|
Application #:
|
09569716
|
Filing Dt:
|
05/11/2000
|
|
Title:
|
APPARATUS FOR ELECTRICALLY MOUNTING AN ELECTRONIC DEVICE TO A SUBSTRATE WITHOUT SOLDERING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/31/2002
|
Application #:
|
09574006
|
Filing Dt:
|
05/19/2000
|
|
Title:
|
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/10/2002
|
Application #:
|
09577692
|
Filing Dt:
|
05/22/2000
|
|
Title:
|
IMAGE SENSOR PACKAGE HAVING SEALED CAVITY OVER ACTIVE AREA
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/04/2002
|
Application #:
|
09585506
|
Filing Dt:
|
06/01/2000
|
|
Title:
|
REINFORCING SOLDER CONNECTIONS OF ELECTRONIC DEVICES
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
09585704
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Filing Dt:
|
05/31/2000
|
|
Publication #:
|
|
Pub Dt:
|
05/01/2003
| | | | |
|
Title:
|
Reverse contrast marked package
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/11/2003
|
Application #:
|
09585915
|
Filing Dt:
|
06/02/2000
|
|
Title:
|
SEMICONDUCTOR PACKAGE WITH SPACER STRIPS
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/18/2003
|
Application #:
|
09587136
|
Filing Dt:
|
06/02/2000
|
|
Title:
|
PACKAGING HIGH POWER INTEGRATED CIRCUIT DEVICES
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/13/2001
|
Application #:
|
09591705
|
Filing Dt:
|
06/09/2000
|
|
Title:
|
Making solder ball mounting pads on substrates
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/15/2002
|
Application #:
|
09593269
|
Filing Dt:
|
06/13/2000
|
|
Title:
|
Electronic device package and leadframe
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/10/2005
|
Application #:
|
09602162
|
Filing Dt:
|
06/22/2000
|
|
Title:
|
MATERIAL TRANSPORT METHOD
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/24/2004
|
Application #:
|
09602195
|
Filing Dt:
|
06/22/2000
|
|
Title:
|
ASSEMBLY FOR TRANSPORTING MATERIAL
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/11/2003
|
Application #:
|
09602196
|
Filing Dt:
|
06/22/2000
|
|
Title:
|
GRIPPER ASSEMBLY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/17/2002
|
Application #:
|
09608197
|
Filing Dt:
|
06/30/2000
|
|
Title:
|
LOW PROFILE PACKAGE FOR PLURAL SEMICONDUCTOR DIES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/15/2003
|
Application #:
|
09608357
|
Filing Dt:
|
06/29/2000
|
|
Title:
|
FLIP CHIP INTEGRATED CIRCUIT AND PASSIVE CHIP COMPONENT PACKAGE FABRICATION METHOD
|
|
