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Patent Assignment Details
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Reel/Frame:013221/0887   Pages: 3
Recorded: 08/27/2002
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
01/24/1995
Application #:
08170473
Filing Dt:
12/20/1993
Title:
AN INTEGRATED CIRCUIT CHIP INCLUDING SUPERIMPOSED UPPER AND LOWER PRINTED CIRCUIT BOARDS
Assignor
1
Exec Dt:
07/01/2002
Assignee
1
NO. 60, LANE 328, LI-SHAN ST.
NEI-HU DIST
TAIPEI CITY, TAIWAN
Correspondence name and address
AKIN, GUMP, STRAUSS, ET AL.
LESLIE L. KASTEN, JR.
ONE COMMERCE SQUARE-2005 MARKET STREET
SUITE 2200
PHILADELPHIA, PA 19103

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