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Reel/Frame:013360/0407   Pages: 5
Recorded: 01/15/2003
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/14/2008
Application #:
10248380
Filing Dt:
01/15/2003
Publication #:
Pub Dt:
07/15/2004
Title:
AN ARRANGEMENT FOR TESTING SEMICONDUCTOR CHIPS WHILE INCORPORATED ON A SEMICONDUCTOR WAFER
Assignors
1
Exec Dt:
12/06/2002
2
Exec Dt:
12/06/2002
3
Exec Dt:
11/26/2002
4
Exec Dt:
12/04/2002
Assignee
1
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondence name and address
IBM MICROELECTRONICS
INTELLECTUAL PROPERTY LAW
1000 RIVER STREET
972 E
ESSEX JUNCTION, VT 05452

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