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Total properties:
16
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Patent #:
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Issue Dt:
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06/16/1998
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Application #:
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08781568
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Filing Dt:
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01/09/1997
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Title:
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PLASMA GENERATION AND PLASMA PROCESSING OF MATERIALS
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Patent #:
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Issue Dt:
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10/31/2000
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Application #:
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08975403
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Filing Dt:
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11/20/1997
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Title:
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PLASMA PROCESSING METHODS AND APPARATUS
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Patent #:
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Issue Dt:
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01/02/2001
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Application #:
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09038642
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Filing Dt:
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03/10/1998
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Title:
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HOLDERS SUITABLE TO HOLD ARTICLES DURING PROCESSING AND ARTICLE PROCESSING METHODS
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Patent #:
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Issue Dt:
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08/01/2000
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Application #:
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09041284
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Filing Dt:
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03/11/1998
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Title:
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ARTICLE HOLDERS AND HOLDING METHODS
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Patent #:
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Issue Dt:
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02/06/2001
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Application #:
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09083927
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Filing Dt:
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05/22/1998
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Title:
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INTEGRATED CIRCUITS AND METHODS FOR THEIR FABRICATION
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Patent #:
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Issue Dt:
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09/11/2001
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Application #:
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09315122
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Filing Dt:
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05/19/1999
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Title:
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PLASMA PROCESSING METHODS AND APPARATUS
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Patent #:
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|
Issue Dt:
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06/04/2002
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Application #:
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09456094
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Filing Dt:
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12/07/1999
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Title:
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DYNAMIC BREAK FOR NON-CONTACT WAFER HOLDER
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Patent #:
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Issue Dt:
|
06/11/2002
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Application #:
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09456135
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Filing Dt:
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12/07/1999
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Title:
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NON-CONTACT WORKPIECE HOLDER
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Patent #:
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Issue Dt:
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11/27/2001
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Application #:
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09456225
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Filing Dt:
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12/06/1999
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Title:
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PACKAGING OF INTEGRATED CIRCUITS AND VERTICAL INTEGRATION
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Patent #:
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Issue Dt:
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03/20/2001
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Application #:
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09457042
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Filing Dt:
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12/07/1999
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Title:
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BRIM AND GAS ESCAPE FOR NON-CONTACT WAFER HOLDER
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|
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Patent #:
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Issue Dt:
|
09/19/2000
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Application #:
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09465989
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Filing Dt:
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12/16/1999
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Title:
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PLASMA GENERATOR IGNITION CIRCUIT
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Patent #:
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Issue Dt:
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10/14/2003
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Application #:
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09632236
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Filing Dt:
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08/04/2000
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Title:
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DETECTION AND HANDLING OF SEMICONDUCTOR WAFER AND WAFER-LIKE OBJECTS
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Patent #:
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Issue Dt:
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08/06/2002
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Application #:
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09633086
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Filing Dt:
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08/04/2000
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Title:
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NON-CONTACT WORKPIECE HOLDER USING VORTEX CHUCK WITH CENTRAL GAS FLOW
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Patent #:
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Issue Dt:
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06/15/2004
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Application #:
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09713137
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Filing Dt:
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11/14/2000
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Title:
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PLASMA PROCESSING COMPRISING THREE ROTATIONAL MOTIONS OF AN ARTICLE BEING PROCESSED
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Patent #:
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Issue Dt:
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12/24/2002
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Application #:
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09876888
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Filing Dt:
|
06/06/2001
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Publication #:
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Pub Dt:
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01/31/2002
| | | | |
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Title:
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THINNING AND DICING OF SEMICONDUCTOR WAFERS USING DRY ETCH, AND OBTAINING SEMICONDUCTOR CHIPS WITH ROUNDED BOTTOM EDGES AND CORNERS
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Patent #:
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Issue Dt:
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04/19/2005
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Application #:
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10059898
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Filing Dt:
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01/28/2002
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Publication #:
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Pub Dt:
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07/04/2002
| | | | |
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Title:
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INTEGRATED CIRCUIT STRUCTURES WITH A CONDUCTOR FORMED IN A THROUGH HOLE IN A SEMICONDUCTOR SUBSTRATE AND PROTRUDING FROM A SURFACE OF THE SUBSTRATE
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