Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 016325/0547 | |
| Pages: | 3 |
| | Recorded: | 06/10/2005 | | |
| Attorney Dkt #: | 5319-007 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/10/2007
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Application #:
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11046514
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Filing Dt:
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01/28/2005
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Publication #:
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Pub Dt:
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10/13/2005
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Title:
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SEMICONDUCTOR PACKAGE WITH HEAT DISSIPATING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
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Assignee
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| 416, MAETAN-DONG, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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MARGER JOHNSON & MCCOLLOM, P.C.
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1030 S.W. MORRISON STREET
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PORTLAND, OREGON 97205
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