Patent Assignment Details
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Reel/Frame: | 016630/0850 | |
| Pages: | 17 |
| | Recorded: | 10/13/2005 | | |
Attorney Dkt #: | 153325.00012 |
Conveyance: | SECURITY AGREEMENT |
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Total properties:
10
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Patent #:
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Issue Dt:
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08/27/2002
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Application #:
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08954426
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Filing Dt:
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10/20/1997
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Publication #:
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Pub Dt:
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08/09/2001
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Title:
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CHIP SCALE PACKAGE USING LARGE DUCTILE SOLDER BALLS
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Patent #:
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Issue Dt:
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09/11/2001
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Application #:
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09114204
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Filing Dt:
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07/13/1998
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Title:
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METHOD FOR FORMING CHIP SCALE PACKAGE
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Patent #:
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Issue Dt:
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06/06/2006
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Application #:
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09575298
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Filing Dt:
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05/19/2000
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Title:
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SOLDER BAR FOR HIGH POWER FLIP CHIPS
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Patent #:
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Issue Dt:
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06/17/2003
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Application #:
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09668450
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Filing Dt:
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09/22/2000
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Title:
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POLYMER COLLAR FOR SOLDER BUMPS
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Patent #:
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Issue Dt:
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09/03/2002
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Application #:
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09766798
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Filing Dt:
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01/22/2001
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Publication #:
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Pub Dt:
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07/25/2002
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Title:
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ELECTROLESS NI/PD/AU METALLIZATION STRUCTURE FOR COPPER INTERCONNECT SUBSTRATE AND METHOD THEREFOR
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Patent #:
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Issue Dt:
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06/15/2004
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Application #:
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09885846
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Filing Dt:
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06/20/2001
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Publication #:
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Pub Dt:
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10/18/2001
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Title:
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METHOD FOR FORMING CHIP SCALE PACKAGE
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Patent #:
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Issue Dt:
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10/24/2006
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Application #:
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10672165
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Filing Dt:
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09/26/2003
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Publication #:
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Pub Dt:
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03/31/2005
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Title:
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WAFER-LEVEL MOAT STRUCTURES
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Patent #:
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Issue Dt:
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10/10/2006
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Application #:
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10672201
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Filing Dt:
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09/26/2003
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Publication #:
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Pub Dt:
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03/31/2005
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Title:
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FORMING PARTIAL-DEPTH FEATURES IN POLYMER FILM
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Patent #:
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Issue Dt:
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07/19/2005
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Application #:
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10704131
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Filing Dt:
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11/10/2003
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Publication #:
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Pub Dt:
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04/28/2005
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Title:
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BUILD-UP STRUCTURES WITH MULTI-ANGLE VIAS FOR CHIP TO CHIP INTERCONNECTS AND OPTICAL BUSSING
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Patent #:
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Issue Dt:
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03/14/2006
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Application #:
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11145948
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Filing Dt:
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06/07/2005
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Publication #:
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Pub Dt:
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12/08/2005
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Title:
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BUILD-UP STRUCTURES WITH MULTI-ANGLE VIAS FOR CHIP TO CHIP INTERCONNECTS AND OPTICAL BUSSING
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Assignee
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100 WASHINGTON STREET, 15TH FLOOR |
WELLS FARGO PLAZA, MACS S4101-158 |
PHOENIX, ARIZONA 85003 |
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Correspondence name and address
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SEAN D. JOHNSON, ESQ.
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TWO NORTH CENTRAL AVENUE
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ONE RENAISSANCE SQUARE
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PHOENIX, AZ 85004
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