Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 017604/0872 | |
| Pages: | 4 |
| | Recorded: | 05/11/2006 | | |
| Attorney Dkt #: | 27-118 |
| Conveyance: | ASSIGNMENT OF UNDIVIDED HALF INTEREST |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/09/2007
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Application #:
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11257894
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Filing Dt:
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10/24/2005
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Publication #:
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Pub Dt:
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08/10/2006
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Title:
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NESTED INTEGRATED CIRCUIT PACKAGE ON PACKAGE SYSTEM
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Assignees
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE 768442 |
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| 47400 KATO ROAD |
| FREMONT, CALIFORNIA 94538 |
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Correspondence name and address
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MIKIO ISHIMARU
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THE LAW OFFICES OF MIKIO ISHIMARU
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333 W. EL CAMINO REAL, SUITE # 330
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SUNNYVALE, CA 94087
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