Patent Assignment Details
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| Reel/Frame: | 018881/0893 | |
| Pages: | 10 |
| | Recorded: | 02/12/2007 | | |
| Attorney Dkt #: | SEPPO-P0006 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/14/2012
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Application #:
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11570673
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Filing Dt:
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06/30/2008
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Publication #:
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Pub Dt:
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10/23/2008
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Title:
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METHOD FOR MANUFACTURING AN ELECTRONICS MODULE COMPRISING A COMPONENT ELECTRICALLY CONNECTED TO A CONDUCTOR-PATTERN LAYER
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Assignee
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| P.O. BOX 74 |
| ESPOO, FINLAND 02151 |
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Correspondence name and address
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KEVIN ERDMAN/KORIE WALTERS
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BAKER & DANIELS LLP
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300 NORTH MERIDIAN STREET, SUITE 2700
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INDIANAPOLIS, IN 46204
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