Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 019672/0536 | |
| Pages: | 6 |
| | Recorded: | 08/09/2007 | | |
| Attorney Dkt #: | FIS920070018US1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/16/2010
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Application #:
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11778678
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Filing Dt:
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07/17/2007
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Publication #:
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Pub Dt:
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01/22/2009
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Title:
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PROCESS FOR MAKING INTERCONNECT SOLDER PB-FREE BUMPS FREE FROM ORGANO-TIN/TIN DEPOSITS ON THE WAFER SURFACE
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Assignee
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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ROSA S. YAGHMOUR
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2070 ROUTE 52
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M/D 482
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HOPEWELL JUNCTION, NY 12533
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