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Patent Assignment Details
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Reel/Frame:020794/0961   Pages: 12
Recorded: 04/15/2008
Conveyance: SECURITY AGREEMENT
Total properties: 2
1
Patent #:
Issue Dt:
06/08/1999
Application #:
08788762
Filing Dt:
01/24/1997
Title:
WAFER FABRICATION OF DIE-BOTTOM CONTACTS FOR ELECTRONIC DEVICES
2
Patent #:
Issue Dt:
04/24/2001
Application #:
09105504
Filing Dt:
06/26/1998
Title:
WAFER FABRICATION OF DIE BOTTOM CONTACTS FOR ELECTRONIC DEVICES
Assignors
1
Exec Dt:
12/14/2007
2
Exec Dt:
12/14/2007
3
Exec Dt:
12/14/2007
Assignee
1
335 CHATHAM WAY
MOUNTAIN VIEW, CALIFORNIA 94040
Correspondence name and address
PHIL MARCOUX
335 CHATHAM WAY
MOUNTAIN VIEW, CA 94040

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