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Total properties:
11
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Patent #:
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Issue Dt:
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08/20/1996
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Application #:
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08408792
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Filing Dt:
|
03/23/1995
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Title:
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SOLDERABLE CONTACTS FOR FLIP CHIP INTEGRATED CIRCUIT DEVICES
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Patent #:
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Issue Dt:
|
03/04/1997
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Application #:
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08426861
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Filing Dt:
|
04/24/1995
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Title:
|
SOLDER BUMP TRANSFER DEVICE FOR FLIP CHIP INTEGRATED CIRCUIT DEVICES
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Patent #:
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Issue Dt:
|
05/27/1997
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Application #:
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08496333
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Filing Dt:
|
06/29/1995
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Title:
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NO COAT BACKSIDE WAFER GRINDING PROCESS
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Patent #:
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|
Issue Dt:
|
09/08/1998
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Application #:
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08536592
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Filing Dt:
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09/29/1995
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Title:
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COMPOSITE SOLDER PASTE FOR FLIP CHIP BUMPING
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Patent #:
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Issue Dt:
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08/27/2002
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Application #:
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08954426
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Filing Dt:
|
10/20/1997
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Publication #:
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Pub Dt:
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08/09/2001
| | | | |
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Title:
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CHIP SCALE PACKAGE USING LARGE DUCTILE SOLDER BALLS
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Patent #:
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Issue Dt:
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09/11/2001
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Application #:
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09114204
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Filing Dt:
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07/13/1998
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Title:
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METHOD FOR FORMING CHIP SCALE PACKAGE
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|
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Patent #:
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|
Issue Dt:
|
06/06/2006
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Application #:
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09575298
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Filing Dt:
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05/19/2000
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Title:
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SOLDER BAR FOR HIGH POWER FLIP CHIPS
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|
|
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Patent #:
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|
Issue Dt:
|
06/17/2003
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Application #:
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09668450
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Filing Dt:
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09/22/2000
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Title:
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POLYMER COLLAR FOR SOLDER BUMPS
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|
|
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Patent #:
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|
Issue Dt:
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06/15/2004
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Application #:
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09885846
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Filing Dt:
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06/20/2001
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Publication #:
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Pub Dt:
|
10/18/2001
| | | | |
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Title:
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METHOD FOR FORMING CHIP SCALE PACKAGE
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|
|
|
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Patent #:
|
|
Issue Dt:
|
10/24/2006
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Application #:
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10672165
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Filing Dt:
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09/26/2003
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Publication #:
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|
Pub Dt:
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03/31/2005
| | | | |
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Title:
|
WAFER-LEVEL MOAT STRUCTURES
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|
|
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Patent #:
|
|
Issue Dt:
|
10/10/2006
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Application #:
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10672201
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Filing Dt:
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09/26/2003
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Publication #:
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Pub Dt:
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03/31/2005
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Title:
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FORMING PARTIAL-DEPTH FEATURES IN POLYMER FILM
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