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Patent Assignment Details

NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:	021719/0219			Pages:	25
		Recorded:	10/22/2008
Attorney Dkt #:	16110-1
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 14

Patent #:	7170306	Issue Dt:	01/30/2007	Application #:	10386875	Filing Dt:	03/12/2003
Publication #:	US20040178812	Pub Dt:	09/16/2004
Title:	CONNECTING A PROBE CARD AND AN INTERPOSER USING A COMPLIANT CONNECTOR

Patent #:	NONE	Issue Dt:		Application #:	10387216	Filing Dt:	03/12/2003
Publication #:	US20040177995	Pub Dt:	09/16/2004
Title:	Structures for testing circuits and methods for fabricating the structures

Patent #:	NONE	Issue Dt:		Application #:	10418440	Filing Dt:	04/16/2003
Publication #:	US20040177985	Pub Dt:	09/16/2004
Title:	Structures for testing circuits and methods for fabricating the structures

Patent #:	6924654	Issue Dt:	08/02/2005	Application #:	10418441	Filing Dt:	04/16/2003
Publication #:	US20040179343	Pub Dt:	09/16/2004
Title:	PROBE STRUCTURES USING COMPLIANT ADHESIVE BETWEEN FLEXIBLE AND RIGID SUBSTRATES

Patent #:	6946859	Issue Dt:	09/20/2005	Application #:	10418512	Filing Dt:	04/16/2003
Publication #:	US20040177996	Pub Dt:	09/16/2004
Title:	PROBE STRUCTURES USING CLAMPED SUBSTRATES WITH COMPLIANT INTERCONNECTORS

Patent #:	NONE	Issue Dt:		Application #:	10418561	Filing Dt:	04/16/2003
Publication #:	US20040180561	Pub Dt:	09/16/2004
Title:	Structures for testing circuits and methods for fabricating the structures

Patent #:	6984996	Issue Dt:	01/10/2006	Application #:	10428572	Filing Dt:	05/01/2003
Publication #:	US20040217767	Pub Dt:	11/04/2004
Title:	WAFER PROBING THAT CONDITIONS DEVICES FOR FLIP-CHIP BONDING

Patent #:	7405581	Issue Dt:	07/29/2008	Application #:	10718031	Filing Dt:	11/19/2003
Publication #:	US20040217769	Pub Dt:	11/04/2004
Title:	A PROBING SYSTEM USES A PROBE DEVICE INCLUDING PROBE TIPS ON A SURFACE OF A SEMICONDUCTOR DIE

Patent #:	6975127	Issue Dt:	12/13/2005	Application #:	10718503	Filing Dt:	11/19/2003
Publication #:	US20040217770	Pub Dt:	11/04/2004
Title:	PLANARIZING AND TESTING OF BGA PACKAGES

Patent #:	NONE	Issue Dt:		Application #:	11153018	Filing Dt:	06/14/2005
Publication #:	US20050231222	Pub Dt:	10/20/2005
Title:	Wafer probing that conditions devices for flip-chip bonding

Patent #:	NONE	Issue Dt:		Application #:	11165679	Filing Dt:	06/24/2005
Publication #:	US20050289415	Pub Dt:	12/29/2005
Title:	Intelligent probe chips/heads

Patent #:	6998864	Issue Dt:	02/14/2006	Application #:	11169987	Filing Dt:	06/28/2005
Publication #:	US20050237074	Pub Dt:	10/27/2005
Title:	STRUCTURES FOR TESTING CIRCUITS AND METHODS FOR FABRICATING THE STRUCTURES

Patent #:	NONE	Issue Dt:		Application #:	11223378	Filing Dt:	09/08/2005
Publication #:	US20060006890	Pub Dt:	01/12/2006
Title:	Interconnect structure that controls spacing between a probe card and a contact substrate

Patent #:	NONE	Issue Dt:		Application #:	11977698	Filing Dt:	10/24/2007
Publication #:	US20080079450	Pub Dt:	04/03/2008
Title:	Intelligent probe chips/heads

Assignor

Exec Dt:

10/20/2008

Assignee

4000 N. 1ST STREET

SAN JOSE, CALIFORNIA 95134

Correspondence name and address
	VINCENT J. NOVAK
	425 MARKET STREET
	MORRISON & FOERSTER LLP
	SAN FRANCISCO, CA 94105

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