skip navigationU S P T O SealUnited States Patent and Trademark Office AOTW logo
Home|Site Index|Search|Guides|Contacts|eBusiness|eBiz alerts|News|Help
Assignments on the Web > Patent Query
Patent Assignment Details
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:022068/0770   Pages: 8
Recorded: 01/07/2009
Attorney Dkt #:90886
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 16
1
Patent #:
Issue Dt:
11/16/1999
Application #:
08897968
Filing Dt:
07/21/1997
Title:
POLYMERIZABLE FLUXING AGENTS AND FLUXING ADHESIVE COMPOSITIONS THEREFROM
2
Patent #:
Issue Dt:
11/16/1999
Application #:
08926159
Filing Dt:
09/09/1997
Title:
CARBOXYL-CONTAINING POLYUNSATURATED FLUXING ADHESIVE FOR ATTACHING INTEGRATED CIRCUITS
3
Patent #:
Issue Dt:
01/25/2000
Application #:
09012382
Filing Dt:
01/23/1998
Title:
CARBOXYL-CONTAINING POLYUNSATURATED FLUXING AGENT AND CARBOXYL-REACTIVE NEUTRALIZING AGENT AS ADHESIVE
4
Patent #:
Issue Dt:
09/19/2000
Application #:
09120172
Filing Dt:
07/21/1998
Title:
SEMICONDUCTOR FLIP-CHIP PACKAGE AND METHOD FOR THE FABRICATION THEREOF
5
Patent #:
Issue Dt:
10/02/2001
Application #:
09137971
Filing Dt:
08/21/1998
Title:
SEMICONDUCTOR FLIP-CHIP ASSEMBLY WITH PRE-APPLIED ENCAPSULATING LAYERS
6
Patent #:
Issue Dt:
10/17/2000
Application #:
09372709
Filing Dt:
08/11/1999
Title:
POLMERIZABLE FLUXING AGENTS AND FLUXING ADHESIVE COMPOSITIONS THEREFROM
7
Patent #:
Issue Dt:
01/01/2002
Application #:
09517839
Filing Dt:
03/02/2000
Title:
Semiconductor flip-chip package and method for the fabrication thereof
8
Patent #:
Issue Dt:
02/11/2003
Application #:
09662641
Filing Dt:
09/15/2000
Title:
SEMICONDUCTOR FLIP-CHIP PACKAGE AND METHOD FOR THE FABRICATION THEREOF
9
Patent #:
Issue Dt:
05/20/2003
Application #:
09662642
Filing Dt:
09/15/2000
Title:
SEMICONDUCTOR FLIP-CHIP PACKAGE AND METHOD FOR THE FABRICATION THEREOF
10
Patent #:
Issue Dt:
06/04/2002
Application #:
09948921
Filing Dt:
09/07/2001
Publication #:
Pub Dt:
03/14/2002
Title:
SEMICONDUCTOR FLIP-CHIP PACKAGE AND METHOD FOR THE FABRICATION THEREOF
11
Patent #:
NONE
Issue Dt:
Application #:
10550408
Filing Dt:
09/23/2005
Publication #:
Pub Dt:
08/31/2006
Title:
Conductive Adhesive of Metal (Alloy) Powders, Polymerizable Fluxing Agent and Inerting Agent
12
Patent #:
Issue Dt:
05/29/2007
Application #:
10725442
Filing Dt:
12/03/2003
Publication #:
Pub Dt:
06/14/2007
Title:
GAMMA RAY DETECTOR MODULES
13
Patent #:
Issue Dt:
05/12/2009
Application #:
11783505
Filing Dt:
04/10/2007
Publication #:
Pub Dt:
10/11/2007
Title:
GAMMA RAY DETECTOR MODULES
14
Patent #:
Issue Dt:
02/15/2011
Application #:
12071280
Filing Dt:
02/19/2008
Publication #:
Pub Dt:
08/28/2008
Title:
THERMALLY CONDUCTIVE ADHESIVE COMPOSITION AND PROCESS FOR DEVICE ATTACHMENT
15
Patent #:
NONE
Issue Dt:
Application #:
12073170
Filing Dt:
02/29/2008
Publication #:
Pub Dt:
01/08/2009
Title:
Electric field steering cap, steering electrode, and modular configurations for a radiation detector
16
Patent #:
NONE
Issue Dt:
Application #:
12230061
Filing Dt:
08/22/2008
Publication #:
Pub Dt:
02/25/2010
Title:
Bonding material treatment using sonification
Assignor
1
Exec Dt:
11/07/2008
Assignee
1
2710 GLASGOW DRIVE
CARLSBAD, CALIFORNIA 92010
Correspondence name and address
ROSS EPSTEIN
2794 GATEWAY ROAD
CARLSBAD, CA 92009

Search Results as of: 05/17/2024 03:38 PM
If you have any comments or questions concerning the data displayed, contact PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified: August 25, 2017 v.2.6
| .HOME | INDEX| SEARCH | eBUSINESS | CONTACT US | PRIVACY STATEMENT