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Patent #:
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Issue Dt:
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03/07/2006
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Application #:
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09513067
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Filing Dt:
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02/24/2000
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Title:
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NONEXPOSED HEAT SINK FOR SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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09/05/2006
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Application #:
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09687048
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Filing Dt:
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10/13/2000
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Title:
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LEADFRAME AND SEMICONDUCTOR PACKAGE WITH IMPROVED SOLDER JOINT STRENGTH
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Patent #:
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Issue Dt:
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06/13/2006
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Application #:
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09764196
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Filing Dt:
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01/16/2001
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Title:
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OPTICAL MODULE WITH LENS INTEGRAL HOLDER FABRICATION METHOD
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Patent #:
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Issue Dt:
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05/09/2006
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Application #:
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09845601
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Filing Dt:
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04/27/2001
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Publication #:
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Pub Dt:
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02/10/2005
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Title:
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LEADFRAME AND SEMICONDUCTOR PACKAGE MADE USING THE LEADFRAME
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Patent #:
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Issue Dt:
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10/24/2006
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Application #:
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09923834
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Filing Dt:
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08/07/2001
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Title:
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EMBEDDED HEAT SPREADER BALL GRID ARRAY
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Patent #:
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Issue Dt:
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09/05/2006
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Application #:
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09932290
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Filing Dt:
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08/17/2001
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Title:
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SEMICONDUCTOR PACKAGE AND LEADFRAME WITH HORIZONTAL LEADS SPACED IN THE VERTICAL DIRECTION AND METHOD OF MAKING
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Patent #:
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Issue Dt:
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03/28/2006
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Application #:
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10076896
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Filing Dt:
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02/14/2002
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Title:
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LEAD-FRAME CONNECTOR AND CIRCUIT MODULE ASSEMBLY
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Patent #:
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Issue Dt:
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12/26/2006
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Application #:
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10082472
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Filing Dt:
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02/22/2002
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Title:
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STACKING STRUCTURE FOR SEMICONDUCTOR DEVICES USING A FOLDED OVER FLEXIBLE SUBSTRATE AND METHOD THEREFOR
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Patent #:
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Issue Dt:
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02/07/2006
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Application #:
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10107656
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Filing Dt:
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03/25/2002
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Publication #:
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Pub Dt:
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10/03/2002
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Title:
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SEMICONDUCTOR PACKAGE INCLUDING PASSIVE ELEMENTS AND METHOD OF MANUFACTURE
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Patent #:
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Issue Dt:
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05/09/2006
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Application #:
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10212496
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Filing Dt:
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08/02/2002
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME WHICH REDUCES WARPAGE
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Patent #:
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Issue Dt:
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12/05/2006
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Application #:
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10227051
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Filing Dt:
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08/23/2002
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Publication #:
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Pub Dt:
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02/26/2004
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Title:
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OPTIC SEMICONDUCTOR MODULE AND MANUFACTURING METHOD
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Patent #:
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Issue Dt:
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01/17/2006
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Application #:
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10319022
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Filing Dt:
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12/12/2002
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Title:
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INTEGRATED CIRCUIT SUBSTRATE HAVING EMBEDDED PASSIVE COMONENTS AND METHODS THEREFOR
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Patent #:
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Issue Dt:
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08/22/2006
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Application #:
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10427117
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Filing Dt:
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05/01/2003
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Title:
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LEADFRAME BASED MEMORY CARD
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Patent #:
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Issue Dt:
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05/16/2006
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Application #:
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10439671
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Filing Dt:
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05/16/2003
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Publication #:
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Pub Dt:
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10/23/2003
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Title:
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STACKABLE SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME
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Patent #:
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Issue Dt:
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03/07/2006
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Application #:
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10445754
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Filing Dt:
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05/27/2003
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Title:
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LEADFRAME STRIP HAVING ENHANCED TESTABILITY
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Patent #:
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Issue Dt:
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02/27/2007
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Application #:
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10459230
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Filing Dt:
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06/11/2003
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Title:
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LEAD FRAME WITH PLATED END LEADS
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Patent #:
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Issue Dt:
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04/18/2006
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Application #:
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10603878
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Filing Dt:
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06/24/2003
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Title:
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INTEGRATED CIRCUIT SUBSTRATE HAVING LASER-EXPOSED TERMINALS
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Patent #:
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Issue Dt:
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02/03/2009
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Application #:
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10607324
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Filing Dt:
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06/26/2003
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Title:
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DROP RESISTANT BUMPERS FOR FULLY MOLDED MEMORY CARDS
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Patent #:
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Issue Dt:
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05/23/2006
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Application #:
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10621780
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Filing Dt:
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07/16/2003
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Title:
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MULTI-CHIP SEMICONDUCTOR PACKAGE WITH INTEGRAL SHIELD AND ANTENNA
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Patent #:
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Issue Dt:
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09/05/2006
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Application #:
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10625290
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Filing Dt:
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07/23/2003
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Title:
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CIRCUIT MODULE HAVING INTERCONNECTS FOR CONNECTING FUNCTIONING AND NON-FUNCTIONING ADD ONS AND METHOD THEREFOR
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Patent #:
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Issue Dt:
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07/04/2006
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Application #:
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10626150
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Filing Dt:
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07/24/2003
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Title:
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PLASTIC INTEGRATED CIRCUIT PACKAGE AND METHOD AND LEADFRAME FOR MAKING THE PACKAGE
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Patent #:
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Issue Dt:
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09/04/2012
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Application #:
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10634541
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Filing Dt:
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08/04/2003
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Title:
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SEMICONDUCTOR MEMORY CARD
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Patent #:
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Issue Dt:
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04/10/2012
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Application #:
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10662248
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Filing Dt:
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09/15/2003
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Publication #:
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Pub Dt:
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03/25/2004
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Title:
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NEAR CHIP SIZE SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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07/17/2007
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Application #:
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10667226
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Filing Dt:
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09/18/2003
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Title:
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EXPOSED LEAD INTERPOSER LEADFRAME PACKAGE
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Patent #:
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Issue Dt:
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06/06/2006
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Application #:
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10667227
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Filing Dt:
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09/18/2003
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Publication #:
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Pub Dt:
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05/20/2004
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Title:
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LEADFRAME HAVING LEAD LOCKS TO SECURE LEADS TO ENCAPSULANT
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Patent #:
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Issue Dt:
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02/14/2006
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Application #:
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10680281
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Filing Dt:
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10/07/2003
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Title:
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FRONT EDGE CHAMFER FEATURE FOR FULLY-MOLDED MEMORY CARDS
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Patent #:
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Issue Dt:
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11/21/2006
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Application #:
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10690193
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Filing Dt:
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10/21/2003
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Title:
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Semiconductor package including leads and conductive posts for providing increased functionality
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Patent #:
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Issue Dt:
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12/05/2006
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Application #:
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10703301
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Filing Dt:
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11/07/2003
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Title:
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MANUFACTURING METHOD FOR LEADFRAME AND FOR SEMICONDUCTOR PACKAGE USING THE LEADFRAME
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Patent #:
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Issue Dt:
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05/01/2007
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Application #:
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10706468
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Filing Dt:
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11/12/2003
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Title:
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SEMICONDUCTOR PACKAGE WITH CHAMFERED CORNERS AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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10/10/2006
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Application #:
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10728562
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Filing Dt:
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12/05/2003
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Publication #:
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Pub Dt:
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07/15/2004
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Title:
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PHOTODETECTORS AND OPTICALLY PUMPED EMITTERS BASED ON III-NITRIDE MULTIPLE-QUANTUM-WELL STRUCTURES
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Patent #:
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Issue Dt:
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08/15/2006
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Application #:
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10735184
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Filing Dt:
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12/11/2003
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Title:
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IMAGE SENSOR PACKAGE AND METHOD FOR MANUFACTURE THEREOF
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Patent #:
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Issue Dt:
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03/07/2006
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Application #:
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10759990
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Filing Dt:
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01/15/2004
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Title:
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SEMICONDUCTOR PACKAGE WITH SUBSTRATE COUPLED TO A PERIPHERAL SIDE SURFACE OF A SEMICONDUCTOR DIE
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Patent #:
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Issue Dt:
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10/03/2006
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Application #:
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10763859
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Filing Dt:
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01/23/2004
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Publication #:
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Pub Dt:
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08/05/2004
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Title:
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SEMICONDUCTOR PACKAGE HAVING REDUCED THICKNESS
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Patent #:
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Issue Dt:
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06/06/2006
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Application #:
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10765397
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Filing Dt:
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01/27/2004
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Title:
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CAVITY CASE WITH CLIP/PLUG FOR USE ON MULTI-MEDIA CARD
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Patent #:
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Issue Dt:
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08/15/2006
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Application #:
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10766046
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Filing Dt:
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01/28/2004
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Title:
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LEADFRAME TYPE SEMICONDUCTOR PACKAGE HAVING REDUCED INDUCTANCE AND ITS MANUFACTURING METHOD
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Patent #:
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Issue Dt:
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12/15/2009
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Application #:
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10766101
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Filing Dt:
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01/28/2004
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Title:
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DOUBLE MOLD MEMORY CARD AND ITS MANUFACTURING METHOD
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Patent #:
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Issue Dt:
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01/30/2007
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Application #:
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10774893
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Filing Dt:
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02/09/2004
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Publication #:
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Pub Dt:
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08/19/2004
| | | | |
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Title:
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LEAD FRAME FOR SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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03/13/2007
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Application #:
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10785528
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Filing Dt:
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02/24/2004
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Publication #:
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Pub Dt:
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08/26/2004
| | | | |
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
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Patent #:
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Issue Dt:
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06/13/2006
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Application #:
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10803333
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Filing Dt:
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03/17/2004
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Publication #:
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Pub Dt:
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09/09/2004
| | | | |
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Title:
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STACKABLE SEMICONDUCTOR PACKAGE HAVING SEMICONDUCTOR CHIP WITHIN CENTRAL THROUGH HOLE OF SUBSTRATE
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Patent #:
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Issue Dt:
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03/06/2007
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Application #:
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10806640
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Filing Dt:
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03/23/2004
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Title:
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METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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02/26/2008
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Application #:
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10825670
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Filing Dt:
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04/14/2004
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
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Patent #:
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Issue Dt:
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07/11/2006
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Application #:
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10828616
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Filing Dt:
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04/21/2004
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Title:
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TAPE SUPPORTED MEMORY CARD LEADFRAME STRUCTURE
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Patent #:
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Issue Dt:
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12/05/2006
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Application #:
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10839647
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Filing Dt:
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05/05/2004
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Title:
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SEMICONDUCTOR PACKAGE AND SUBSTRATE HAVING MULTI-LEVEL VIAS
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Patent #:
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Issue Dt:
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02/28/2006
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Application #:
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10847742
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Filing Dt:
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05/18/2004
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Title:
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METHOD OF MAKING AN INTEGRATED CIRCUIT PACKAGE
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Patent #:
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Issue Dt:
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12/05/2006
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Application #:
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10865096
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Filing Dt:
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06/09/2004
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Title:
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SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
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Patent #:
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Issue Dt:
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03/13/2007
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Application #:
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10868244
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Filing Dt:
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06/15/2004
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Title:
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EMBEDDED LEADFRAME SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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06/27/2006
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Application #:
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10868643
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Filing Dt:
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06/15/2004
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Publication #:
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Pub Dt:
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11/18/2004
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Title:
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SEMICONDUCTOR PACKAGE HAVING IMPROVED ADHESIVENESS AND GROUND BONDING
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Patent #:
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Issue Dt:
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05/01/2007
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Application #:
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10881846
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Filing Dt:
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06/30/2004
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Title:
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EXPOSED LEAD QFP PACKAGE FABRICATED THROUGH THE USE OF A PARTIAL SAW PROCESS
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Patent #:
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Issue Dt:
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01/17/2006
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Application #:
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10883593
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Filing Dt:
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06/30/2004
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Title:
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STACKABLE SEMICONDUCTOR PACKAGE WITH SOLDER ON PADS ON WHICH SECOND SEMICONDUCTOR PACKAGE IS STACKED
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Patent #:
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Issue Dt:
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04/18/2006
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Application #:
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10884082
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Filing Dt:
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07/01/2004
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Publication #:
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Pub Dt:
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01/06/2005
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Title:
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SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND WIRE BONDING METHOD USING THEREOF
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Patent #:
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Issue Dt:
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05/16/2006
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Application #:
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10892625
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Filing Dt:
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07/15/2004
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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10/06/2009
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Application #:
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10910089
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Filing Dt:
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08/03/2004
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Title:
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OFFSET ETCHED CORNER LEADS FOR SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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04/10/2007
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Application #:
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10921642
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Filing Dt:
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08/19/2004
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Title:
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SEMICONDUCTOR PACKAGE AND ITS MANUFACTURING METHOD
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Patent #:
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Issue Dt:
|
09/05/2006
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Application #:
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10923575
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Filing Dt:
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08/20/2004
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Title:
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PRE-MOLDED LEADFRAME
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Patent #:
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Issue Dt:
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05/16/2006
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Application #:
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10944314
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Filing Dt:
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09/17/2004
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Publication #:
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Pub Dt:
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02/10/2005
| | | | |
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Title:
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SEMICONDUCTOR PACKAGE INCLUDING FLIP CHIP
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Patent #:
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Issue Dt:
|
07/15/2008
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Application #:
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10947124
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Filing Dt:
|
09/22/2004
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Publication #:
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Pub Dt:
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02/24/2005
| | | | |
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Title:
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METHOD FOR MAKING AN INTEGRATED CIRCUIT SUBSTRATE HAVING EMBEDDED BACK-SIDE ACCESS CONDUCTORS AND VIAS
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Patent #:
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Issue Dt:
|
04/15/2008
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Application #:
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10962221
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Filing Dt:
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10/08/2004
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Title:
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IMAGE SENSOR PACKAGE AND ITS MANUFACTURING METHOD
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Patent #:
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Issue Dt:
|
04/10/2007
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Application #:
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10967462
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Filing Dt:
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10/18/2004
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Title:
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MEMORY CARD AND ITS MANUFACTURING METHOD
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Patent #:
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Issue Dt:
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05/15/2007
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Application #:
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10971408
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Filing Dt:
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10/22/2004
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Title:
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FAN-IN LEADFRAME SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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03/20/2007
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Application #:
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10980355
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Filing Dt:
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11/03/2004
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Title:
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MEMORY CARD ESC SUBSTRATE INSERT
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Patent #:
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Issue Dt:
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08/07/2007
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Application #:
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10986634
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Filing Dt:
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11/12/2004
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Title:
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INTEGRATED CIRCUIT DEVICE PACKAGES AND SUBSTRATES FOR MAKING THE PACKAGES
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Patent #:
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Issue Dt:
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04/15/2008
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Application #:
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10990265
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Filing Dt:
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11/16/2004
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Title:
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INTERPOSER FOR INTERCONNECTING COMPONENTS IN A MEMORY CARD
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Patent #:
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Issue Dt:
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07/04/2006
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Application #:
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10991631
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Filing Dt:
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11/17/2004
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Title:
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STACKED-DIE EXTENSION SUPPORT STRUCTURE AND METHOD THEREOF
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Patent #:
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Issue Dt:
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12/08/2009
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Application #:
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10992036
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Filing Dt:
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11/17/2004
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Title:
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SHIELDED PACKAGE HAVING SHIELD FENCE
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Patent #:
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Issue Dt:
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01/17/2006
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Application #:
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11006210
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Filing Dt:
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12/06/2004
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Title:
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WAFER-LEVEL CHIP-SCALE PACKAGE
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Patent #:
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Issue Dt:
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02/21/2006
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Application #:
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11009262
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Filing Dt:
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12/09/2004
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Title:
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METHOD OF MAKING A LEADFRAME FOR SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
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06/20/2006
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Application #:
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11018731
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Filing Dt:
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12/21/2004
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Title:
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THERMALLY ENHANCED CHIP SCALE LEAD ON CHIP SEMICONDUCTOR PACKAGE AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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04/18/2006
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Application #:
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11021340
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Filing Dt:
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12/22/2004
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Title:
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PLASTIC INTEGRATED CIRCUIT PACKAGE AND METHOD AND LEADFRAME FOR MAKING THE PACKAGE
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Patent #:
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Issue Dt:
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12/25/2007
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Application #:
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11021977
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Filing Dt:
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12/22/2004
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Title:
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METHOD FOR MAKING AN INTEGRATED CIRCUIT SUBSTRATE HAVING LASER-EMBEDDED CONDUCTIVE PATTERNS
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Patent #:
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Issue Dt:
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02/13/2007
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Application #:
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11035239
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Filing Dt:
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01/13/2005
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Title:
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LEAD-FRAME METHOD AND ASSEMBLY FOR INTERCONNECTING CIRCUITS WITHIN A CIRCUIT MODULE
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Patent #:
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Issue Dt:
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12/05/2006
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Application #:
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11038756
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Filing Dt:
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01/19/2005
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Publication #:
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Pub Dt:
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07/21/2005
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Title:
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COLORED CONDUCTIVE WIRES FOR A SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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05/08/2007
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Application #:
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11039434
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Filing Dt:
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01/19/2005
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Title:
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INCREASED CAPACITY LEADFRAME AND SEMICONDUCTOR PACKAGE USING THE SAME
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Patent #:
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Issue Dt:
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07/24/2007
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Application #:
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11047848
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Filing Dt:
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01/31/2005
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Title:
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TWO-SIDED WAFER ESCAPE PACKAGE
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Patent #:
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Issue Dt:
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05/22/2007
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Application #:
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11060263
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Filing Dt:
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02/17/2005
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Title:
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MEMORY CARD AND ITS MANUFACTURING METHOD
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Patent #:
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Issue Dt:
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09/26/2006
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Application #:
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11060264
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Filing Dt:
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02/17/2005
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Title:
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SECURE DIGITAL MEMORY CARD USING LAND GRID ARRAY STRUCTURE
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Patent #:
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Issue Dt:
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02/07/2006
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Application #:
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11063299
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Filing Dt:
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02/22/2005
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Publication #:
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Pub Dt:
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06/30/2005
| | | | |
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Title:
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SEMICONDUCTOR PACKAGE WITH INCREASED NUMBER OF INPUT AND OUTPUT PINS
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Patent #:
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Issue Dt:
|
02/26/2008
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Application #:
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11078833
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Filing Dt:
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03/11/2005
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Title:
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METHOD FOR MAKING AN INTEGRATED CIRCUIT SUBSTRATE HAVING EMBEDDED PASSIVE COMPONENTS
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11079836
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Filing Dt:
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03/14/2005
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Publication #:
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Pub Dt:
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07/21/2005
| | | | |
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Title:
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Reduced size semiconductor package with stacked dies
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Patent #:
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Issue Dt:
|
09/09/2014
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Application #:
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11098995
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Filing Dt:
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04/05/2005
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Title:
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Method for making an integrated circuit substrate having laminated laser-embedded circuit layers
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Patent #:
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Issue Dt:
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04/15/2008
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Application #:
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11103690
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Filing Dt:
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04/12/2005
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Publication #:
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Pub Dt:
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11/03/2005
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Title:
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METHODS OF FORMING SOLDER BUMPS ON EXPOSED METAL PADS
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|
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Patent #:
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Issue Dt:
|
04/22/2008
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Application #:
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11108359
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Filing Dt:
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04/18/2005
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Title:
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SURFACE ACOUSTIC WAVE (SAW) DEVICE PACKAGE AND METHOD FOR PACKAGING A SAW DEVICE
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Patent #:
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Issue Dt:
|
03/14/2006
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Application #:
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11109329
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Filing Dt:
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04/19/2005
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Title:
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DIE DOWN MULTI-MEDIA CARD AND METHOD OF MAKING SAME
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|
|
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Patent #:
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Issue Dt:
|
07/13/2010
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Application #:
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11111316
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Filing Dt:
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04/21/2005
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Title:
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DIE-MOUNTING SUBSTRATE AND METHOD INCORPORATING DUMMY TRACES FOR IMPROVING MOUNTING FILM PLANARITY
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|
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Patent #:
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Issue Dt:
|
06/05/2007
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Application #:
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11115574
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Filing Dt:
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04/26/2005
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Title:
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IMAGE SENSOR PACKAGE AND ITS MANUFACTURING METHOD
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|
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Patent #:
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Issue Dt:
|
11/04/2008
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Application #:
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11115579
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Filing Dt:
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04/26/2005
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Title:
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WAFER LEVEL CHIP SCALE PACKAGE AND MANUFACTURING METHOD FOR THE SAME
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|
|
|
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Patent #:
|
|
Issue Dt:
|
11/07/2006
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Application #:
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11115706
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Filing Dt:
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04/26/2005
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Title:
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STACKED DIE ASSEMBLY HAVING SEMICONDUCTOR DIE OVERHANGING SUPPORT
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|
|
|
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Patent #:
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|
Issue Dt:
|
10/24/2006
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Application #:
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11119234
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Filing Dt:
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04/28/2005
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Publication #:
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Pub Dt:
|
11/03/2005
| | | | |
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Title:
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CAMERA MODULE HAVING A THREADED LENS BARREL AND A BALL GRID ARRAY CONNECTING DEVICE
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|
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Patent #:
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|
Issue Dt:
|
11/13/2007
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Application #:
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11120087
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Filing Dt:
|
05/02/2005
|
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Title:
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SECURE DIGITAL MEMORY CARD USING LAND GRID ARRAY STRUCTURE
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|
|
|
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Patent #:
|
|
Issue Dt:
|
03/20/2007
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Application #:
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11123605
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Filing Dt:
|
05/05/2005
|
|
Title:
|
WAFER LEVEL PACKAGE AND FABRICATION METHOD
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|
|
|
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Patent #:
|
|
Issue Dt:
|
01/30/2007
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Application #:
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11128633
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Filing Dt:
|
05/13/2005
|
|
Title:
|
WAFER LEVEL STACKED PACKAGE
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|
|
|
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Patent #:
|
|
Issue Dt:
|
05/01/2007
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Application #:
|
11129596
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Filing Dt:
|
05/13/2005
|
|
Publication #:
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Pub Dt:
|
09/22/2005
| | | | |
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Title:
|
THIN SEMICONDUCTOR PACKAGE INCLUDING STACKED DIES
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|
|
|
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Patent #:
|
|
Issue Dt:
|
11/20/2007
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Application #:
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11166005
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Filing Dt:
|
06/24/2005
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|
Title:
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CIRCUIT-ON-FOIL PROCESS FOR MANUFACTURING A LAMINATED SEMICONDUCTOR PACKAGE SUBSTRATE HAVING EMBEDDED CONDUCTIVE PATTERNS
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|
|
|
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Patent #:
|
|
Issue Dt:
|
06/29/2010
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Application #:
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11168168
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Filing Dt:
|
06/27/2005
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Title:
|
PACKAGE IN PACKAGE (PIP)
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/18/2009
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Application #:
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11177904
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Filing Dt:
|
07/07/2005
|
|
Title:
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DIRECT GLASS ATTACHED ON DIE OPTICAL MODULE
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|
|
|
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Patent #:
|
|
Issue Dt:
|
06/10/2008
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Application #:
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11180463
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Filing Dt:
|
07/12/2005
|
|
Title:
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APPARATUS AND METHOD FOR TESTING INTEGRATED CIRCUIT DEVICES HAVING CONTACTS ON MULTIPLE SURFACES
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|
|
|
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Patent #:
|
|
Issue Dt:
|
06/10/2008
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Application #:
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11180463
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Filing Dt:
|
07/12/2005
|
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Title:
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APPARATUS AND METHOD FOR TESTING INTEGRATED CIRCUIT DEVICES HAVING CONTACTS ON MULTIPLE SURFACES
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|
|
|
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Patent #:
|
|
Issue Dt:
|
09/30/2008
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Application #:
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11190596
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Filing Dt:
|
07/27/2005
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Title:
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LAND PATTERNS FOR A SEMICONDUCTOR STACKING STRUCTURE AND METHOD THEREFOR
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|
|
|
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Patent #:
|
|
Issue Dt:
|
01/29/2008
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Application #:
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11192193
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Filing Dt:
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07/27/2005
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Publication #:
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Pub Dt:
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08/03/2006
| | | | |
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Title:
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TRANSDUCER ASSEMBLY, CAPILLARY AND WIRE BONDING METHOD USING THE SAME
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|
|
|
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Patent #:
|
|
Issue Dt:
|
05/16/2006
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Application #:
|
11198074
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Filing Dt:
|
08/05/2005
|
|
Title:
|
THERMALLY ENHANCED CHIP SCALE LEAD ON CHIP SEMICONDUCTOR PACKAGE AND METHOD OF MAKING SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/16/2008
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Application #:
|
11206513
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Filing Dt:
|
08/17/2005
|
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Publication #:
|
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Pub Dt:
|
02/09/2006
| | | | |
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Title:
|
SNAP LID CAMERA MODULE
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