Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 023714/0364 | |
| Pages: | 2 |
| | Recorded: | 12/29/2009 | | |
| Attorney Dkt #: | T5057-B170 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/21/2012
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Application #:
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12648954
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Filing Dt:
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12/29/2009
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Publication #:
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Pub Dt:
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06/30/2011
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Title:
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FLIP CHIP PACKAGE HAVING ENHANCED THERMAL AND MECHANICAL PERFORMANCE
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Assignee
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| NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-77 |
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Correspondence name and address
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LOWE HAUPTMAN HAM & BERNER, LLP
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1700 DIAGONAL ROAD
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SUITE 300
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ALEXANDRIA, VA 22314
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