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Patent Assignment Details
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Reel/Frame:023802/0565   Pages: 5
Recorded: 01/15/2010
Attorney Dkt #:TIPI 5.2-007
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 7
1
Patent #:
Issue Dt:
09/19/2000
Application #:
09120172
Filing Dt:
07/21/1998
Title:
SEMICONDUCTOR FLIP-CHIP PACKAGE AND METHOD FOR THE FABRICATION THEREOF
2
Patent #:
Issue Dt:
10/02/2001
Application #:
09137971
Filing Dt:
08/21/1998
Title:
SEMICONDUCTOR FLIP-CHIP ASSEMBLY WITH PRE-APPLIED ENCAPSULATING LAYERS
3
Patent #:
Issue Dt:
01/01/2002
Application #:
09517839
Filing Dt:
03/02/2000
Title:
Semiconductor flip-chip package and method for the fabrication thereof
4
Patent #:
Issue Dt:
02/11/2003
Application #:
09662641
Filing Dt:
09/15/2000
Title:
SEMICONDUCTOR FLIP-CHIP PACKAGE AND METHOD FOR THE FABRICATION THEREOF
5
Patent #:
Issue Dt:
05/20/2003
Application #:
09662642
Filing Dt:
09/15/2000
Title:
SEMICONDUCTOR FLIP-CHIP PACKAGE AND METHOD FOR THE FABRICATION THEREOF
6
Patent #:
Issue Dt:
06/04/2002
Application #:
09948921
Filing Dt:
09/07/2001
Publication #:
Pub Dt:
03/14/2002
Title:
SEMICONDUCTOR FLIP-CHIP PACKAGE AND METHOD FOR THE FABRICATION THEREOF
7
Patent #:
Issue Dt:
08/10/2004
Application #:
10390603
Filing Dt:
03/19/2003
Publication #:
Pub Dt:
11/27/2003
Title:
SEMICONDUCTOR FLIP-CHIP PACKAGE AND METHOD FOR THE FABRICATION THEREOF
Assignor
1
Exec Dt:
11/16/2009
Assignee
1
3025 ORCHARD PARKWAY
SAN JOSE, CALIFORNIA 95134
Correspondence name and address
DARYL K. NEFF
LERNER, DAVID, LITTENBERG ET AL.
600 SOUTH AVENUE WEST
WESTFIELD, NJ 07090

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