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Patent Assignment Details

NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:	023832/0471			Pages:	2
		Recorded:	01/22/2010
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 12

Patent #:	6136707	Issue Dt:	10/24/2000	Application #:	09410898	Filing Dt:	10/02/1999
Title:	SEED LAYERS FOR INTERCONNECTS AND METHODS FOR FABRICATING SUCH SEED LAYERS

Patent #:	6610151	Issue Dt:	08/26/2003	Application #:	09563733	Filing Dt:	05/03/2000
Title:	SEED LAYERS FOR INTERCONNECTS AND METHODS AND APPARATUS FOR THEIR FABRICATION

Patent #:	6518668	Issue Dt:	02/11/2003	Application #:	09730220	Filing Dt:	12/04/2000
Publication #:	US20010005056	Pub Dt:	06/28/2001
Title:	MULTIPLE SEED LAYERS FOR METALLIC INTERCONNECTS

Patent #:	6924226	Issue Dt:	08/02/2005	Application #:	10328629	Filing Dt:	12/23/2002
Publication #:	US20030129828	Pub Dt:	07/10/2003
Title:	METHODS FOR MAKING MULTIPLE SEED LAYERS FOR METALLIC INTERCONNECTS

Patent #:	6903016	Issue Dt:	06/07/2005	Application #:	10640846	Filing Dt:	08/14/2003
Publication #:	US20040087171	Pub Dt:	05/06/2004
Title:	COMBINED CONFORMAL/NON-CONFORMAL SEED LAYERS FOR METALLIC INTERCONNECTS

Patent #:	7105434	Issue Dt:	09/12/2006	Application #:	11023833	Filing Dt:	12/28/2004
Publication #:	US20050124153	Pub Dt:	06/09/2005
Title:	ADVANCED SEED LAYERY FOR METALLIC INTERCONNECTS

Patent #:	7199052	Issue Dt:	04/03/2007	Application #:	11057485	Filing Dt:	02/14/2005
Publication #:	US20050148172	Pub Dt:	07/07/2005
Title:	SEED LAYERS FOR METALLIC INTERCONNECTS

Patent #:	7682496	Issue Dt:	03/23/2010	Application #:	11391035	Filing Dt:	03/28/2006
Publication #:	US20060166448	Pub Dt:	07/27/2006
Title:	APPARATUS FOR DEPOSITING SEED LAYERS

Patent #:	7282445	Issue Dt:	10/16/2007	Application #:	11654478	Filing Dt:	01/17/2007
Publication #:	US20070117379	Pub Dt:	05/24/2007
Title:	MULTIPLE SEED LAYERS FOR INTERCONNECTS

Patent #:	7550386	Issue Dt:	06/23/2009	Application #:	11868435	Filing Dt:	10/05/2007
Publication #:	US20080026569	Pub Dt:	01/31/2008
Title:	ADVANCED SEED LAYERS FOR INTERCONNECTS

Patent #:	NONE	Issue Dt:		Application #:	12471557	Filing Dt:	05/26/2009
Publication #:	US20090239372	Pub Dt:	09/24/2009
Title:	Seed Layers for Electroplated Interconnects

Patent #:	9673090	Issue Dt:	06/06/2017	Application #:	12471571	Filing Dt:	05/26/2009
Publication #:	US20090233440	Pub Dt:	09/17/2009
Title:	Seed Layers for Metallic Interconnects

Assignor

Exec Dt:

01/21/2010

Assignee

MONTELBELLO PARK

75 MONTEBELLO PARK

SUFFERN, NEW YORK 10901-3746

Correspondence name and address
	PAUL J. LERNER
	SEED LAYERS TECHNOLOGY LLC
	MONTEBELLO PARK
	75 MONTEBELLO ROAD
	SUFFERN, NY 10901-3746

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