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Patent Assignment Details

NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:	023985/0422			Pages:	4
		Recorded:	02/22/2010
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 22

Patent #:	6390890	Issue Dt:	05/21/2002	Application #:	09498265	Filing Dt:	02/03/2000
Title:	FINISHING SEMICONDUCTOR WAFERS WITH A FIXED ABRASIVE FINISHING ELEMENT

Patent #:	6346202	Issue Dt:	02/12/2002	Application #:	09533473	Filing Dt:	03/23/2000
Title:	Finishing with partial organic boundary layer

Patent #:	6291349	Issue Dt:	09/18/2001	Application #:	09533846	Filing Dt:	03/23/2000
Title:	Abrasive finishing with partial organic boundary layer

Patent #:	6568989	Issue Dt:	05/27/2003	Application #:	09538409	Filing Dt:	03/29/2000
Title:	IMPROVED SEMICONDUCTOR WAFER FINISHING CONTROL

Patent #:	6634927	Issue Dt:	10/21/2003	Application #:	09840423	Filing Dt:	04/23/2001
Title:	FINISHING ELEMENT USING FINISHING AIDS

Patent #:	6739947	Issue Dt:	05/25/2004	Application #:	09939957	Filing Dt:	08/27/2001
Title:	IN SITU FRICTION DETECTOR METHOD AND APPARATUS

Patent #:	6551933	Issue Dt:	04/22/2003	Application #:	09954394	Filing Dt:	09/17/2001
Title:	ABRASIVE FINISHING WITH LUBRICANT AND TRACKING

Patent #:	6656023	Issue Dt:	12/02/2003	Application #:	09956687	Filing Dt:	09/20/2001
Title:	IN SITU CONTROL WITH LUBRICANT AND TRACKING

Patent #:	6641463	Issue Dt:	11/04/2003	Application #:	10151515	Filing Dt:	05/20/2002
Title:	FINISHING COMPONENTS AND ELEMENTS

Patent #:	6796883	Issue Dt:	09/28/2004	Application #:	10211796	Filing Dt:	08/03/2002
Title:	CONTROLLED LUBRICATED FINISHING

Patent #:	6719615	Issue Dt:	04/13/2004	Application #:	10218740	Filing Dt:	08/14/2002
Title:	VERSATILE WAFER REFINING

Patent #:	7037172	Issue Dt:	05/02/2006	Application #:	10260458	Filing Dt:	09/30/2002
Title:	ADVANCED WAFER PLANARIZING

Patent #:	7008300	Issue Dt:	03/07/2006	Application #:	10261113	Filing Dt:	09/30/2002
Title:	ADVANCED WAFER REFINING

Patent #:	7156717	Issue Dt:	01/02/2007	Application #:	10724535	Filing Dt:	11/29/2003
Publication #:	US20040115841	Pub Dt:	06/17/2004
Title:	IN SITU FINISHING AID CONTROL

Patent #:	7131890	Issue Dt:	11/07/2006	Application #:	10730631	Filing Dt:	12/08/2003
Title:	IN SITU FINISHING CONTROL

Patent #:	7377836	Issue Dt:	05/27/2008	Application #:	10822515	Filing Dt:	04/12/2004
Title:	VERSATILE WAFER REFINING

Patent #:	7575501	Issue Dt:	08/18/2009	Application #:	11368295	Filing Dt:	03/03/2006
Title:	ADVANCED WORKPIECE FINISHING

Patent #:	7220164	Issue Dt:	05/22/2007	Application #:	11593307	Filing Dt:	11/06/2006
Title:	ADVANCED FINISHING CONTROL

Patent #:	7572169	Issue Dt:	08/11/2009	Application #:	11801031	Filing Dt:	05/08/2007
Title:	ADVANCED FINISHING CONTROL

Patent #:	8357286	Issue Dt:	01/22/2013	Application #:	11978346	Filing Dt:	10/29/2007
Title:	VERSATILE WORKPIECE REFINING

Patent #:	7878882	Issue Dt:	02/01/2011	Application #:	11978367	Filing Dt:	10/29/2007
Publication #:	US20080057830	Pub Dt:	03/06/2008
Title:	ADVANCED WORKPIECE FINISHING

Assignor

Exec Dt:

02/19/2010

Assignee

701 WEST BEALEY ST.

ST MARYS, GEORGIA 31558

Correspondence name and address
	CHARLES J. MOLNAR
	701 W BEALEY ST.
	ST. MARYS, GA 31558

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