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Total properties:
20
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Patent #:
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Issue Dt:
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04/04/1995
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Application #:
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07889832
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Filing Dt:
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05/27/1992
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Title:
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FABRICATING A SEMICONDUCTOR WITH AN INSULATIVE COATING
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Patent #:
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Issue Dt:
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01/18/1994
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Application #:
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07940763
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Filing Dt:
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09/04/1992
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Title:
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ELECTRICAL APPARATUS WITH A METALLIC LAYER COUPLED TO A LOWER REGION OF A SUBSTRATE AND METALLIC LAYER COUPLED TO A LOWER REGION OF A SEMICONDUCTOR DEVICE
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Patent #:
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|
Issue Dt:
|
08/12/1997
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Application #:
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08241602
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Filing Dt:
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05/11/1994
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Title:
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METHOD FOR MAKING A LEADLESS SURFACE MOUNTED DEVICE WITH WRAP-AROUND FLANGE INTERFACE CONTACTS
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Patent #:
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Issue Dt:
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05/28/1996
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Application #:
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08270784
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Filing Dt:
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07/05/1994
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Title:
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FABRICATING A SEMICONDUCTOR WITH AN INSULATIVE COATING
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Patent #:
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|
Issue Dt:
|
01/07/1997
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Application #:
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08270939
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Filing Dt:
|
07/05/1994
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Title:
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FABRICATING A SEMICONDUCTOR WITH AN INSULATIVE COATING
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Patent #:
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|
Issue Dt:
|
10/03/1995
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Application #:
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08331783
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Filing Dt:
|
11/01/1994
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Title:
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METHOD OF MAKING A SEMICONDUCTOR DEVICE WITH A METALLIC LAYER COUPLED TO A LOWER REGION OF A SUBSTRATE AND METALLIC LAYER COUPLED TO A LOWER REGION OF A SEMICONDUCTOR DEVICE
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Patent #:
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|
Issue Dt:
|
08/15/1995
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Application #:
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08363732
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Filing Dt:
|
12/23/1994
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|
Title:
|
FABRICATING A SEMICONDUCTOR WITH AN INSULATIVE COATING
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|
|
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Patent #:
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|
Issue Dt:
|
08/22/1995
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Application #:
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08363733
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Filing Dt:
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12/23/1994
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Title:
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FABRICATING A SEMICONDUCTOR WITH AN INSULATIVE COATING
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|
|
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Patent #:
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|
Issue Dt:
|
09/17/1996
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Application #:
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08409994
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Filing Dt:
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03/24/1995
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Title:
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SEMICONDUCTOR FABRICATION WITH CONTACT PROCESSING FOR WRAP-AROUND FLANGE INTERFACE
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|
|
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Patent #:
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|
Issue Dt:
|
08/04/1998
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Application #:
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08749422
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Filing Dt:
|
11/15/1996
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|
Title:
|
ELECTRICAL APPARATUS WITH A METALLIC LAYER COUPLED TO A LOWER REGION OF A SUBSTRATE AND A METALLIC LAYER COUPLED TO A LOWER REGION OF A SEMICONDUCTOR DEVICE
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|
|
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Patent #:
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|
Issue Dt:
|
06/08/1999
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Application #:
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08788762
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Filing Dt:
|
01/24/1997
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Title:
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WAFER FABRICATION OF DIE-BOTTOM CONTACTS FOR ELECTRONIC DEVICES
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|
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Patent #:
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Issue Dt:
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05/18/1999
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Application #:
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08788764
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Filing Dt:
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01/24/1997
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Title:
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WAFER FABRICATION OF INSIDE-WRAPPED CONTACTS FOR ELECTRONIC DEVICES
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|
|
|
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Patent #:
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|
Issue Dt:
|
07/02/2002
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Application #:
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08855105
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Filing Dt:
|
05/13/1997
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Title:
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INTEGRATED PASSIVE COMPONENTS AND PACKAGE WITH POSTS
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|
|
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Patent #:
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|
Issue Dt:
|
04/18/2000
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Application #:
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08855106
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Filing Dt:
|
05/13/1997
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|
Title:
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ELECTRONIC COMPONENT PACKAGE WITH POSTS ON THE ACTIVE SIDE OF THE SUBSTRATE
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|
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Patent #:
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|
Issue Dt:
|
09/19/2000
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Application #:
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08865357
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Filing Dt:
|
05/29/1997
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Title:
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RESISTOR FABRICATION
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|
|
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Patent #:
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|
Issue Dt:
|
04/24/2001
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Application #:
|
09105504
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Filing Dt:
|
06/26/1998
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|
Title:
|
WAFER FABRICATION OF DIE BOTTOM CONTACTS FOR ELECTRONIC DEVICES
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|
|
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|
Patent #:
|
|
Issue Dt:
|
03/12/2002
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Application #:
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09235135
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Filing Dt:
|
01/21/1999
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Title:
|
WAFER FABRICATION OF INSIDE-WRAPPED CONTACTS FOR ELECTRONIC DEVICES
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|
|
|
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Patent #:
|
|
Issue Dt:
|
10/11/2005
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Application #:
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10071581
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Filing Dt:
|
02/07/2002
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Publication #:
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Pub Dt:
|
08/01/2002
| | | | |
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Title:
|
INTEGRATED PASSIVE COMPONENTS AND PACKAGE WITH POSTS
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|
|
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Patent #:
|
|
Issue Dt:
|
12/21/2004
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Application #:
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10783673
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Filing Dt:
|
02/20/2004
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|
Publication #:
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|
Pub Dt:
|
08/19/2004
| | | | |
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Title:
|
INTEGRATED PASSIVE COMPONENTS AND PACKAGE WITH POSTS
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|
|
|
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Patent #:
|
|
Issue Dt:
|
09/20/2005
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Application #:
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10783676
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Filing Dt:
|
02/20/2004
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|
Publication #:
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Pub Dt:
|
08/19/2004
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Title:
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INTEGRATED PASSIVE COMPONENTS AND PACKAGE WITH POSTS
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