Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 025466/0973 | |
| Pages: | 11 |
| | Recorded: | 12/07/2010 | | |
| Conveyance: | MERGER (SEE DOCUMENT FOR DETAILS). |
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Total properties:
10
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Patent #:
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Issue Dt:
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09/24/2002
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Application #:
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09271179
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Filing Dt:
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03/17/1999
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Title:
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ARRANGEMENT AND METHOD FOR IMPROVED DOWNWARD SCALING OF HIGHER CONDUCTIVITY METAL-BASED INTERCONNECTS
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Patent #:
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Issue Dt:
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02/18/2003
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Application #:
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09619587
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Filing Dt:
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07/19/2000
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Title:
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METHOD FOR MAKING INTEGRATED CIRCUIT INCLUDING INTERCONNECTS WITH ENHANCED ELECTROMIGRATION RESISTANCE
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Patent #:
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Issue Dt:
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08/27/2002
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Application #:
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09672473
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Filing Dt:
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09/28/2000
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Title:
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DIFFUSION BARRIERS FOR COPPER INTERCONNECT SYSTEMS
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Patent #:
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Issue Dt:
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04/11/2006
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Application #:
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10803475
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Filing Dt:
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03/18/2004
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Publication #:
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Pub Dt:
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12/02/2004
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Title:
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COPPER INTERCONNECT SYSTEMS WHICH USE CONDUCTIVE, METAL-BASED CAP LAYERS
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Patent #:
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Issue Dt:
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08/17/2010
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Application #:
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11113454
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Filing Dt:
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04/22/2005
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Title:
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METHOD FOR MAKING INTEGRATED CIRCUIT INCLUDING INTERCONNECTS WITH ENHANCED ELECTROMIGRATION RESISTANCE USING DOPED SEED LAYER AND INTEGRATED CIRCUITS PRODUCED THEREBY
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Patent #:
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Issue Dt:
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05/13/2008
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Application #:
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11278914
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Filing Dt:
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04/06/2006
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Publication #:
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Pub Dt:
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07/27/2006
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Title:
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COPPER INTERCONNECT SYSTEMS
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Patent #:
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Issue Dt:
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04/22/2008
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Application #:
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11468998
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Filing Dt:
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08/31/2006
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Publication #:
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Pub Dt:
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08/09/2007
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Title:
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COPPER INTERCONNECT SYSTEMS WHICH USE CONDUCTIVE, METAL-BASED CAP LAYERS
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Patent #:
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Issue Dt:
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04/01/2008
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Application #:
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11469003
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Filing Dt:
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08/31/2006
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Publication #:
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Pub Dt:
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08/09/2007
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Title:
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COPPER INTERCONNECT SYSTEMS WHICH USE CONDUCTIVE, METAL-BASED CAP LAYERS
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Patent #:
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Issue Dt:
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09/08/2009
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Application #:
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12056163
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Filing Dt:
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03/26/2008
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Publication #:
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Pub Dt:
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07/24/2008
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Title:
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METHODS OF MANUFACTURING COPPER INTERCONNECT SYSTEMS
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12782092
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Filing Dt:
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05/18/2010
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Publication #:
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Pub Dt:
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09/09/2010
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Title:
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METHODS OF MANUFACTURING COPPER INTERCONNECT SYSTEMS
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Assignee
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| 2711 CENTERVILLE RD, SUITE 400 |
| WILMINGTON, DELAWARE 19808 |
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Correspondence name and address
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WOODCOCK WASHBURN
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999 THIRD AVENUE, SUITE 3600
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SEATTLE, WA 98104
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