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Total properties:
21
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Patent #:
|
|
Issue Dt:
|
10/31/2000
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Application #:
|
08975403
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Filing Dt:
|
11/20/1997
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Title:
|
PLASMA PROCESSING METHODS AND APPARATUS
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|
|
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Patent #:
|
|
Issue Dt:
|
08/01/2000
|
Application #:
|
09041284
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Filing Dt:
|
03/11/1998
|
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Title:
|
ARTICLE HOLDERS AND HOLDING METHODS
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|
|
|
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Patent #:
|
|
Issue Dt:
|
02/06/2001
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Application #:
|
09083927
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Filing Dt:
|
05/22/1998
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Title:
|
INTEGRATED CIRCUITS AND METHODS FOR THEIR FABRICATION
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|
|
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Patent #:
|
|
Issue Dt:
|
09/11/2001
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Application #:
|
09315122
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Filing Dt:
|
05/19/1999
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|
Title:
|
PLASMA PROCESSING METHODS AND APPARATUS
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|
|
|
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Patent #:
|
|
Issue Dt:
|
11/27/2001
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Application #:
|
09456225
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Filing Dt:
|
12/06/1999
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|
Title:
|
PACKAGING OF INTEGRATED CIRCUITS AND VERTICAL INTEGRATION
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|
|
|
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Patent #:
|
|
Issue Dt:
|
10/14/2003
|
Application #:
|
09632236
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Filing Dt:
|
08/04/2000
|
|
Title:
|
DETECTION AND HANDLING OF SEMICONDUCTOR WAFER AND WAFER-LIKE OBJECTS
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|
|
|
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Patent #:
|
|
Issue Dt:
|
07/23/2002
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Application #:
|
09632485
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Filing Dt:
|
08/04/2000
|
|
Title:
|
MONITORING AND CONTROLLING SEPARATE PLASMA JETS TO ACHIEVE DESIRED PROPERTIES IN A COMBINED STREAM
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/15/2004
|
Application #:
|
09713137
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Filing Dt:
|
11/14/2000
|
|
Title:
|
PLASMA PROCESSING COMPRISING THREE ROTATIONAL MOTIONS OF AN ARTICLE BEING PROCESSED
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|
|
|
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Patent #:
|
|
Issue Dt:
|
04/06/2004
|
Application #:
|
09791977
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Filing Dt:
|
02/22/2001
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|
Publication #:
|
|
Pub Dt:
|
08/22/2002
| | | | |
|
Title:
|
DEVICES HAVING SUBSTRATES WITH OPENING PASSING THROUGH THE SUBSTRATES AND CONDUCTORS IN THE OPENINGS, AND METHODS OF MANUFACTURE
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|
|
|
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Patent #:
|
|
Issue Dt:
|
12/24/2002
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Application #:
|
09792311
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Filing Dt:
|
02/22/2001
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|
Publication #:
|
|
Pub Dt:
|
08/22/2002
| | | | |
|
Title:
|
SEMICONDUCTOR STRUCTURES HAVING MULTIPLE CONDUCTIVE LAYERS IN AN OPENING, AND METHODS FOR FABRICATING SAME
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/24/2002
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Application #:
|
09876888
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Filing Dt:
|
06/06/2001
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|
Publication #:
|
|
Pub Dt:
|
01/31/2002
| | | | |
|
Title:
|
THINNING AND DICING OF SEMICONDUCTOR WAFERS USING DRY ETCH, AND OBTAINING SEMICONDUCTOR CHIPS WITH ROUNDED BOTTOM EDGES AND CORNERS
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|
|
|
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Patent #:
|
|
Issue Dt:
|
10/28/2003
|
Application #:
|
09904700
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Filing Dt:
|
07/13/2001
|
|
Publication #:
|
|
Pub Dt:
|
01/16/2003
| | | | |
|
Title:
|
ARTICLE HOLDERS AND ARTICLE POSITIONING METHODS
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/19/2005
|
Application #:
|
10059898
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Filing Dt:
|
01/28/2002
|
|
Publication #:
|
|
Pub Dt:
|
07/04/2002
| | | | |
|
Title:
|
INTEGRATED CIRCUIT STRUCTURES WITH A CONDUCTOR FORMED IN A THROUGH HOLE IN A SEMICONDUCTOR SUBSTRATE AND PROTRUDING FROM A SURFACE OF THE SUBSTRATE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/04/2004
|
Application #:
|
10127144
|
Filing Dt:
|
04/18/2002
|
|
Publication #:
|
|
Pub Dt:
|
10/23/2003
| | | | |
|
Title:
|
CLOCK DISTRIBUTION NETWORKS AND CONDUCTIVE LINES IN SEMICONDUCTOR INTEGRATED
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/24/2005
|
Application #:
|
10410929
|
Filing Dt:
|
04/09/2003
|
|
Publication #:
|
|
Pub Dt:
|
10/14/2004
| | | | |
|
Title:
|
ELECTROPLATING AND ELECTROLESS PLATING OF CONDUCTIVE MATERIALS INTO OPENINGS, AND STRUCTURES OBTAINED THEREBY
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/06/2004
|
Application #:
|
10412978
|
Filing Dt:
|
04/09/2003
|
|
Title:
|
WAFERING METHOD COMPRISING A PLASMA ETCH WITH A GAS EMITTING WAFER HOLDER
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/13/2006
|
Application #:
|
10739707
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Filing Dt:
|
12/17/2003
|
|
Publication #:
|
|
Pub Dt:
|
06/23/2005
| | | | |
|
Title:
|
PACKAGING SUBSTRATES FOR INTEGRATED CIRCUITS AND SOLDERING METHODS
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/23/2006
|
Application #:
|
10739788
|
Filing Dt:
|
12/17/2003
|
|
Publication #:
|
|
Pub Dt:
|
06/23/2005
| | | | |
|
Title:
|
INTEGRATED CIRCUITS AND PACKAGING SUBSTRATES WITH CAVITIES, AND ATTACHMENT METHODS INCLUDING INSERTION OF PROTRUDING CONTACT PADS INTO CAVITIES
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/10/2007
|
Application #:
|
10798540
|
Filing Dt:
|
03/10/2004
|
|
Publication #:
|
|
Pub Dt:
|
06/23/2005
| | | | |
|
Title:
|
ATTACHMENT OF INTEGRATED CIRCUIT STRUCTURES AND OTHER SUBSTRATES TO SUBSTRATES WITH VIAS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/31/2009
|
Application #:
|
11418801
|
Filing Dt:
|
05/05/2006
|
|
Publication #:
|
|
Pub Dt:
|
11/08/2007
| | | | |
|
Title:
|
DIELECTRIC TRENCHES, NICKEL/TANTALUM OXIDE STRUCTURES,AND CHEMICAL MECHANICAL POLISHING TECHNIQUES
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11744046
|
Filing Dt:
|
05/03/2007
|
|
Publication #:
|
|
Pub Dt:
|
11/06/2008
| | | | |
|
Title:
|
AGITATION OF ELECTROLYTIC SOLUTION IN ELECTRODEPOSITION
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|
