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Reel/Frame:	026632/0405			Pages:	51
		Recorded:	07/22/2011
Attorney Dkt #:	088245-9273 ET AL.
Conveyance:	RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).

Total properties: 92

Patent #:	4304624	Issue Dt:	12/08/1981	Application #:	05855242	Filing Dt:	11/28/1977
Title:	METHOD OF FABRICATION A MULTI-LAYER STRUCTUE FOR DETECTOR ARRAY MODULE

Patent #:	4352715	Issue Dt:	10/05/1982	Application #:	06206993	Filing Dt:	11/17/1980
Title:	DETECTOR ARRAY MODULE FABRICATION

Patent #:	4354107	Issue Dt:	10/12/1982	Application #:	06206994	Filing Dt:	11/14/1980
Title:	DETECTOR ARRAY MODULE - STRUCTURE AND FABRICATION

Patent #:	4403238	Issue Dt:	09/06/1983	Application #:	06213933	Filing Dt:	12/08/1980
Title:	DETECTOR ARRAY FOCAL PLANE CONFIGURATION

Patent #:	4490626	Issue Dt:	12/25/1984	Application #:	06403004	Filing Dt:	07/29/1982
Title:	MULTIPLEXER CIRCUITRY FOR HIGH DENSITY ANALOG SIGNALS

Patent #:	4525921	Issue Dt:	07/02/1985	Application #:	06517221	Filing Dt:	07/25/1983
Title:	HIGH-DENSITY ELECTRONIC PROCESSING PACKAGE-STRUCTURE AND FABRICATION

Patent #:	4555623	Issue Dt:	11/26/1985	Application #:	06558099	Filing Dt:	12/05/1983
Title:	PRE-AMPLIFIER IN FOCAL PLANE DETECTOR ARRAY

Patent #:	4551629	Issue Dt:	11/05/1985	Application #:	06572802	Filing Dt:	01/23/1984
Title:	DETECTOR ARRAY MODULE-STRUCTURE AND FABRICATION

Patent #:	4596948	Issue Dt:	06/24/1986	Application #:	06661727	Filing Dt:	10/17/1984
Title:	CONSTANT CURRENT SOURCE FOR INTEGRATED CIRCUITS

Patent #:	4617160	Issue Dt:	10/14/1986	Application #:	06674096	Filing Dt:	11/23/1984
Title:	METHOD FOR FABRICATING MODULES COMPRISING UNIFORMLY STACKED,ALIGNED CIRCUIT-CARRYING LAYERS

Patent #:	4646128	Issue Dt:	02/24/1987	Application #:	06720902	Filing Dt:	04/08/1985
Title:	HIGH-DENSITY ELECTRONIC PROCESSING PACKAGE - STRUCTURE AND FABRICATION

Patent #:	4672737	Issue Dt:	06/16/1987	Application #:	06761889	Filing Dt:	08/02/1985
Title:	DETECTOR ARRAY MODULE FABRICATION PROCESS

Patent #:	4675532	Issue Dt:	06/23/1987	Application #:	06795988	Filing Dt:	11/06/1985
Title:	COMBINED STARING AND SCANNING PHOTODETECTOR SENSING SYSTEM HAVING BOTH TEMPORAL AND SPATIAL FILTERING

Patent #:	4704319	Issue Dt:	11/03/1987	Application #:	06842159	Filing Dt:	03/21/1986
Title:	APPARATUS AND METHOD FOR FABRICATING MODULES COMPRISING STACKED CIRCUIT-CARRYING LAYERS

Patent #:	4706166	Issue Dt:	11/10/1987	Application #:	06856835	Filing Dt:	04/25/1986
Title:	HIGH-DENSITY ELECTRONIC MODULES - PROCESS & PRODUCT

Patent #:	4764846	Issue Dt:	08/16/1988	Application #:	07000562	Filing Dt:	01/05/1987
Title:	HIGH DENSITY ELECTRONIC PACKAGE COMPRISING STACKED SUB-MODULES

Patent #:	4806761	Issue Dt:	02/21/1989	Application #:	07023644	Filing Dt:	03/09/1987
Title:	THERMAL IMAGER INCORPORATING ELECTRONICS MODULE HAVING FOCAL PLANE SENSOR MOSAIC

Patent #:	4791286	Issue Dt:	12/13/1988	Application #:	07042686	Filing Dt:	04/27/1987
Title:	PRE-AMPLIFIER IN FOCAL PLANE DETECTOR ARRAY

Patent #:	4779005	Issue Dt:	10/18/1988	Application #:	07048551	Filing Dt:	05/11/1987
Title:	MULTIPLE DETECTOR VIEWING OF PIXELS USING PARALLEL TIME DELAY AND INTEGRATION CIRCUITRY

Patent #:	4912545	Issue Dt:	03/27/1990	Application #:	07097797	Filing Dt:	09/16/1987
Title:	BONDING OF ALIGNED CONDUCTIVE BUMPS ON ADJACENT SURFACES

Patent #:	4814629	Issue Dt:	03/21/1989	Application #:	07107352	Filing Dt:	10/13/1987
Title:	PIXEL DISPLACEMENT BY SERIES- PARALLEL ANALOG SWITCHING

Patent #:	4983533	Issue Dt:	01/08/1991	Application #:	07114415	Filing Dt:	10/28/1987
Title:	HIGH-DENSITY ELECTRONIC MODULES - PROCESS & PRODUCT

Patent #:	5045685	Issue Dt:	09/03/1991	Application #:	07534969	Filing Dt:	06/06/1990
Title:	ANALOG TO DIGITAL CONVERSION ON MULTIPLE CHANNEL IC CHIPS

Patent #:	5235672	Issue Dt:	08/10/1993	Application #:	07651477	Filing Dt:	02/06/1991
Title:	HARDWARE FOR ELECTRONIC NEURAL NETWORK

Patent #:	5104820	Issue Dt:	04/14/1992	Application #:	07720025	Filing Dt:	06/24/1991
Title:	METHOD OF FABRICATING ELECTRONIC CIRCUITRY UNIT CONTAINING STACKED IC LAYERS HAVING LEAD REROUTING

Patent #:	5304790	Issue Dt:	04/19/1994	Application #:	07956914	Filing Dt:	10/05/1992
Title:	APPARATUS AND SYSTEM FOR CONTROLLABLY VARYING IMAGE RESOLUTION TO REDUCE DATA OUTPUT

Patent #:	5347428	Issue Dt:	09/13/1994	Application #:	07985837	Filing Dt:	12/03/1992
Title:	MODULE COMPRISING IC MEMORY STACK DEDICATED TO AN STRUCTURALLY COMBINED WITH AN IC MICROPROCESSOR CHIP

Patent #:	5279991	Issue Dt:	01/18/1994	Application #:	07996794	Filing Dt:	12/24/1992
Title:	A METHOD FOR FABRICATING STACKS OF IC CHIPS BY SEGMENTING A LARGER STACK

Patent #:	5406701	Issue Dt:	04/18/1995	Application #:	08120675	Filing Dt:	09/13/1993
Title:	FABRICATION OF DENSE PARALLEL SOLDER BUMP CONNECTIONS

Patent #:	5432318	Issue Dt:	07/11/1995	Application #:	08178923	Filing Dt:	01/07/1994
Title:	APPARATUS FOR SEGMENTING STACKED IC CHIPS

Patent #:	5424920	Issue Dt:	06/13/1995	Application #:	08232739	Filing Dt:	04/25/1994
Title:	NON-CONDUCTIVE END LAYER FOR INTEGRATED STACK OF IC CHIPS

Patent #:	5432729	Issue Dt:	07/11/1995	Application #:	08255465	Filing Dt:	06/08/1994
Title:	ELECTRONIC MODULE COMPRISING A STACK OF IC CHIPS EACH INTERACTING WITH AN IC CHIP SECURED TO THE STACK

Patent #:	5508836	Issue Dt:	04/16/1996	Application #:	08305066	Filing Dt:	09/13/1994
Title:	INFRARED WIRELESS COMMUNICATION BETWEEN ELECTRONIC SYSTEM COMPONENTS

Patent #:	5581498	Issue Dt:	12/03/1996	Application #:	08326645	Filing Dt:	10/20/1994
Title:	STACK OF IC CHIPS IN LIEU OF SINGLE IC CHIP

Patent #:	5635010	Issue Dt:	06/03/1997	Application #:	08421848	Filing Dt:	04/14/1995
Title:	DRY ADHESIVE JOINING OF LAYERS OF ELECTRONIC DEVICES

Patent #:	5635705	Issue Dt:	06/03/1997	Application #:	08526415	Filing Dt:	09/11/1995
Title:	SENSING AND SELECTING OBSERVED EVENTS FOR SIGNAL PROCESSING

Patent #:	5745631	Issue Dt:	04/28/1998	Application #:	08592691	Filing Dt:	01/26/1996
Title:	SELF-ALIGNING OPTICAL BEAM SYSTEM

Patent #:	5688721	Issue Dt:	11/18/1997	Application #:	08622671	Filing Dt:	03/26/1996
Title:	3D STACK OF IC CHIPS HAVING LEADS REACHED BY VIAS THROUGH PASSIVATION COVERING ACCESS PLANE

Patent #:	5953588	Issue Dt:	09/14/1999	Application #:	08777747	Filing Dt:	12/21/1996
Title:	STACKABLE LAYERS CONTAINING ENCAPSULATED IC CHIPS

Patent #:	6119138	Issue Dt:	09/12/2000	Application #:	08807283	Filing Dt:	02/27/1997
Title:	WIRELESS COMPUTER COMMUNICATION APPARATUS, AND RELATED METHOD

Patent #:	6028352	Issue Dt:	02/22/2000	Application #:	09095415	Filing Dt:	06/10/1998
Title:	IC STACK UTILIZING SECONDARY LEADFRAMES

Patent #:	6014316	Issue Dt:	01/11/2000	Application #:	09095416	Filing Dt:	06/10/1998
Title:	IC STACK UTILIZING BGA CONTACTS

Patent #:	5955668	Issue Dt:	09/21/1999	Application #:	09166458	Filing Dt:	10/05/1998
Title:	MULTI- ELEMENT MICRO GYRO

Patent #:	6389404	Issue Dt:	05/14/2002	Application #:	09223476	Filing Dt:	12/30/1998
Publication #:	US20020059152	Pub Dt:	05/16/2002
Title:	NEURAL PROCESSING MODULE WITH INPUT ARCHITECTURES THAT MAKE MAXIMAL USE OF A WEIGHTED SYNAPSE ARRAY

Patent #:	6117704	Issue Dt:	09/12/2000	Application #:	09282704	Filing Dt:	03/31/1999
Title:	STACKABLE LAYERS CONTAINING ENCAPSULATED CHIPS

Patent #:	6089089	Issue Dt:	07/18/2000	Application #:	09301847	Filing Dt:	04/29/1999
Title:	MULTI-ELEMENT MICRO GYRO

Patent #:	6072234	Issue Dt:	06/06/2000	Application #:	09316740	Filing Dt:	05/21/1999
Title:	STACK OF EQUAL LAYER NEO-CHIPS CONTAINING ENCAPSULATED IC CHIPS OF DIFFERENT SIZES

Patent #:	6650704	Issue Dt:	11/18/2003	Application #:	09427384	Filing Dt:	10/25/1999
Title:	METHOD OF PRDUCING A HIGH QUALITY, HIGH RESOLUTION IMAGE FROM A SEQUENCE OF LOW QUALITY, LOW RESOLUTION IMAGES THAT ARE UNDERSAMPLED AND SUBJECT TO JITTER

Patent #:	6578420	Issue Dt:	06/17/2003	Application #:	09604782	Filing Dt:	06/26/2000
Title:	MULTI-AXIS MICRO GYRO STRUCTURE

Patent #:	6370937	Issue Dt:	04/16/2002	Application #:	09812147	Filing Dt:	03/19/2001
Publication #:	US20010039834	Pub Dt:	11/15/2001
Title:	METHOD OF CANCELING QUADRATURE ERROR IN AN ANGULAR RATE SENSOR

Patent #:	6476392	Issue Dt:	11/05/2002	Application #:	09853819	Filing Dt:	05/11/2001
Publication #:	US20020166967	Pub Dt:	11/14/2002
Title:	METHOD AND APPARATUS FOR TEMPERATURE COMPENSATION OF AN UNCOOLED FOCAL PLANE ARRAY

Patent #:	6513380	Issue Dt:	02/04/2003	Application #:	09884880	Filing Dt:	06/19/2001
Publication #:	US20020189352	Pub Dt:	12/19/2002
Title:	MEMS SENSOR WITH SINGLE CENTRAL ANCHOR AND MOTION-LIMITING CONNECTION GEOMETRY

Patent #:	6715352	Issue Dt:	04/06/2004	Application #:	09893329	Filing Dt:	06/26/2001
Publication #:	US20030000305	Pub Dt:	01/02/2003
Title:	METHOD OF DESIGNING A FLEXURE SYSTEM FOR TUNING THE MODAL RESPONSE OF A DECOUPLED MICROMACHINED GYROSCOPE AND A GYROSCOPED DESIGNED ACCORDING TO THE METHOD

Patent #:	6596997	Issue Dt:	07/22/2003	Application #:	09921525	Filing Dt:	08/03/2001
Publication #:	US20030025083	Pub Dt:	02/06/2003
Title:	RETRO-REFLECTOR WARM STOP FOR UNCOOLED THERMAL IMAGING CAMERAS AND METHOD OF USING THE SAME

Patent #:	6797537	Issue Dt:	09/28/2004	Application #:	09938686	Filing Dt:	10/30/2001
Publication #:	US20030080419	Pub Dt:	05/01/2003
Title:	METHOD OF MAKING STACKABLE LAYERS CONTAINING ENCAPSULATED INTEGRATED CIRCUIT CHIPS WITH ONE OR MORE OVERLAYING INTERCONNECT LAYERS

Patent #:	6734370	Issue Dt:	05/11/2004	Application #:	09948950	Filing Dt:	09/07/2001
Publication #:	US20030047353	Pub Dt:	03/13/2003
Title:	MULTILAYER MODULES WITH FLEXIBLE SUBSTRATES

Patent #:	6560109	Issue Dt:	05/06/2003	Application #:	09949024	Filing Dt:	09/07/2001
Publication #:	US20030048609	Pub Dt:	03/13/2003
Title:	STACK OF MULTILAYER MODULES WITH HEAT-FOCUSSING METAL LAYER

Patent #:	6717061	Issue Dt:	04/06/2004	Application #:	09949512	Filing Dt:	09/07/2001
Publication #:	US20030049424	Pub Dt:	03/13/2003
Title:	STACKING OF MULTILAYER MODULES

Patent #:	6829237	Issue Dt:	12/07/2004	Application #:	09973857	Filing Dt:	10/09/2001
Publication #:	US20020159449	Pub Dt:	10/31/2002
Title:	HIGH SPEED MULTI-STAGE SWITCHING NETWORK FORMED FROM STACKED SWITCHING LAYERS

Patent #:	6731121	Issue Dt:	05/04/2004	Application #:	10110889	Filing Dt:	08/19/2002
Title:	HIGHLY CONFIGUARABLE CAPACITIVE TRANSDUCER INTERFACE CIRCUIT

Patent #:	6806559	Issue Dt:	10/19/2004	Application #:	10128728	Filing Dt:	04/22/2002
Publication #:	US20030197253	Pub Dt:	10/23/2003
Title:	METHOD AND APPARATUS FOR CONNECTING VERTICALLY STACKED INTEGRATED CIRCUIT CHIPS

Patent #:	6706971	Issue Dt:	03/16/2004	Application #:	10142557	Filing Dt:	05/10/2002
Publication #:	US20020126459	Pub Dt:	09/12/2002
Title:	STACKABLE MICROCIRCUIT LAYER FORMED FROM A PLASTIC ENCAPSULATED MICROCIRCUIT AND METHOD OF MAKING THE SAME

Patent #:	8934627	Issue Dt:	01/13/2015	Application #:	10178390	Filing Dt:	06/24/2002
Publication #:	US20030009773	Pub Dt:	01/09/2003
Title:	Video event capture, storage and processing method and apparatus

Patent #:	NONE	Issue Dt:		Application #:	10197006	Filing Dt:	07/16/2002
Publication #:	US20020180605	Pub Dt:	12/05/2002
Title:	Wearable biomonitor with flexible thinned integrated circuit

Patent #:	6891160	Issue Dt:	05/10/2005	Application #:	10281393	Filing Dt:	10/25/2002
Publication #:	US20030122077	Pub Dt:	07/03/2003
Title:	METHOD AND APPARATUS FOR TEMPERATURE COMPENSATION OF AN UNCOOLED FOCAL PLANE ARRAY

Patent #:	6784547	Issue Dt:	08/31/2004	Application #:	10302680	Filing Dt:	11/21/2002
Publication #:	US20030127735	Pub Dt:	07/10/2003
Title:	STACKABLE LAYERS CONTAINING ENCAPSULATED INTEGRATED CIRCUIT CHIPS WITH ONE OR MORE OVERLYING INTERCONNECT LAYERS AND A METHOD OF MAKING THE SAME

Patent #:	7174627	Issue Dt:	02/13/2007	Application #:	10338974	Filing Dt:	01/09/2003
Publication #:	US20030094704	Pub Dt:	05/22/2003
Title:	METHOD OF FABRICATING KNOWN GOOD DIES FROM PACKAGED INTEGRATED CIRCUITS

Patent #:	NONE	Issue Dt:		Application #:	10339023	Filing Dt:	01/09/2003
Publication #:	US20030221313	Pub Dt:	12/04/2003
Title:	HIGH-DENSITY STACKED PRINTED CIRCUIT BOARD ASSEMBLY

Patent #:	7082591	Issue Dt:	07/25/2006	Application #:	10346363	Filing Dt:	01/17/2003
Publication #:	US20040040005	Pub Dt:	02/26/2004
Title:	METHOD FOR EFFECTIVELY EMBEDDING VARIOUS INTEGRATED CIRCUITS WITHIN FIELD PROGRAMMABLE GATE ARRAYS

Patent #:	6856167	Issue Dt:	02/15/2005	Application #:	10347038	Filing Dt:	01/17/2003
Publication #:	US20030223295	Pub Dt:	12/04/2003
Title:	FIELD PROGRAMMABLE GATE ARRAY WITH A VARIABLY WIDE WORD WIDTH MEMORY

Patent #:	6967411	Issue Dt:	11/22/2005	Application #:	10360244	Filing Dt:	02/07/2003
Publication #:	US20040004286	Pub Dt:	01/08/2004
Title:	STACKABLE LAYERS CONTAINING BALL GRID ARRAY PACKAGES

Patent #:	7127807	Issue Dt:	10/31/2006	Application #:	10431914	Filing Dt:	05/07/2003
Publication #:	US20040040743	Pub Dt:	03/04/2004
Title:	MULTILAYER MODULES WITH FLEXIBLE SUBSTRATES

Patent #:	6912862	Issue Dt:	07/05/2005	Application #:	10615641	Filing Dt:	07/08/2003
Publication #:	US20040007004	Pub Dt:	01/15/2004
Title:	CRYOPUMP PISTON POSITION TRACKING

Patent #:	NONE	Issue Dt:		Application #:	10663371	Filing Dt:	09/16/2003
Publication #:	US20040113222	Pub Dt:	06/17/2004
Title:	Stacked microelectronic module with vertical interconnect vias

Patent #:	6998328	Issue Dt:	02/14/2006	Application #:	10701783	Filing Dt:	11/05/2003
Publication #:	US20040140533	Pub Dt:	07/22/2004
Title:	METHOD FOR CREATING NEO-WAFERS FROM SINGULATED INTEGRATED CIRCUIT DIE AND A DEVICE MADE ACCORDING TO THE METHOD

Patent #:	7417323	Issue Dt:	08/26/2008	Application #:	10703177	Filing Dt:	11/06/2003
Publication #:	US20040147064	Pub Dt:	07/29/2004
Title:	NEO-WAFER DEVICE AND METHOD

Patent #:	6993835	Issue Dt:	02/07/2006	Application #:	10726888	Filing Dt:	12/04/2003
Publication #:	US20050121227	Pub Dt:	06/09/2005
Title:	METHOD FOR ELECTRICAL INTERCONNECTION OF ANGULARLY DISPOSED CONDUCTIVE PATTERNS

Patent #:	NONE	Issue Dt:		Application #:	10805849	Filing Dt:	03/22/2004
Publication #:	US20040188596	Pub Dt:	09/30/2004
Title:	Three-dimensional imaging device incorporating stacked layers containing microelectronic circuits

Patent #:	7180579	Issue Dt:	02/20/2007	Application #:	10806037	Filing Dt:	03/22/2004
Publication #:	US20070052947	Pub Dt:	03/08/2007
Title:	THREE-DIMENSIONAL IMAGING PROCESSING MODULE INCORPORATING STACKED LAYERS CONTAINING MICROELECTRONIC CIRCUITS

Patent #:	7239012	Issue Dt:	07/03/2007	Application #:	10951990	Filing Dt:	09/28/2004
Publication #:	US20050037540	Pub Dt:	02/17/2005
Title:	THREE-DIMENSIONAL MODULE COMPRISED OF LAYERS CONTAINING IC CHIPS WITH OVERLYING INTERCONNECT LAYERS

Patent #:	7440449	Issue Dt:	10/21/2008	Application #:	10960712	Filing Dt:	10/06/2004
Publication #:	US20050058128	Pub Dt:	03/17/2005
Title:	HIGH SPEED SWITCHING MODULE COMPRISED OF STACKED LAYERS INCORPORATING T-CONNECT STRUCTURES

Patent #:	7265579	Issue Dt:	09/04/2007	Application #:	11037490	Filing Dt:	01/18/2005
Publication #:	US20050122758	Pub Dt:	06/09/2005
Title:	FIELD PROGRAMMABLE GATE ARRAY INCORPORATING DEDICATED MEMORY STACKS

Patent #:	7235785	Issue Dt:	06/26/2007	Application #:	11048634	Filing Dt:	01/31/2005
Publication #:	US20050205785	Pub Dt:	09/22/2005
Title:	IMAGING DEVICE WITH MULTIPLE FIELDS OF VIEW INCORPORATING MEMORY-BASED TEMPERATURE COMPENSATION OF AN UNCOOLED FOCAL PLANE ARRAY

Patent #:	7511369	Issue Dt:	03/31/2009	Application #:	11062507	Filing Dt:	02/22/2005
Publication #:	US20070158805	Pub Dt:	07/12/2007
Title:	BGA-SCALE STACKS COMPRISED OF LAYERS CONTAINING INTEGRATED CIRCUIT DIE AND A METHOD FOR MAKING THE SAME

Patent #:	7335576	Issue Dt:	02/26/2008	Application #:	11197828	Filing Dt:	08/05/2005
Publication #:	US20060079072	Pub Dt:	04/13/2006
Title:	METHOD FOR PRECISION INTEGRATED CIRCUIT DIE SINGULATION USING DIFFERENTIAL ETCH RATES

Patent #:	7242082	Issue Dt:	07/10/2007	Application #:	11229351	Filing Dt:	09/15/2005
Publication #:	US20060055039	Pub Dt:	03/16/2006
Title:	STACKABLE LAYER CONTAINING BALL GRID ARRAY PACKAGE

Patent #:	8074082	Issue Dt:	12/06/2011	Application #:	11248659	Filing Dt:	10/11/2005
Publication #:	US20060087883	Pub Dt:	04/27/2006
Title:	ANTI-TAMPER MODULE

Patent #:	NONE	Issue Dt:		Application #:	11301645	Filing Dt:	12/12/2005
Publication #:	US20060126307	Pub Dt:	06/15/2006
Title:	Cornerbond assembly comprising three-dimensional electronic modules

Patent #:	NONE	Issue Dt:		Application #:	11302480	Filing Dt:	12/12/2005
Publication #:	US20060094240	Pub Dt:	05/04/2006
Title:	Neo-wafer device comprised of multiple singulated integrated circuit die

Patent #:	7198965	Issue Dt:	04/03/2007	Application #:	11354370	Filing Dt:	02/14/2006
Publication #:	US20060134835	Pub Dt:	06/22/2006
Title:	METHOD FOR MAKING A NEO-LAYER COMPRISING EMBEDDED DISCRETE COMPONENTS

Patent #:	7516339	Issue Dt:	04/07/2009	Application #:	11415891	Filing Dt:	05/01/2006
Publication #:	US20070074056	Pub Dt:	03/29/2007
Title:	LOW POWER ELECTRONIC CIRCUIT INCORPORATING REAL TIME CLOCK

Patent #:	NONE	Issue Dt:		Application #:	11499403	Filing Dt:	08/04/2006
Publication #:	US20070052084	Pub Dt:	03/08/2007
Title:	High density interconnect assembly comprising stacked electronic module

Assignors

LONGVIEW FUND, L.P.

Exec Dt:

02/27/2009

ALPHA CAPITAL ANSTALT

Exec Dt:

02/27/2009

Assignee

IRVINE SENSORS CORPORATION

C/O W. ERIC BOYD

3001 REDHILL AVE. BLDG. 4/108

COSTA MESA, CALIFORNIA 92626

Correspondence name and address
	PAUL S. HUNTER
	FOLEY & LARDNER LLP
	150 EAST GILMAN STREET
	MADISON, WI 53703

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