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Total properties:
17
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Patent #:
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Issue Dt:
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10/18/1994
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Application #:
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07976619
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Filing Dt:
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11/16/1992
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Title:
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METHOD FOR REPLACING SEMICONDUCTOR CHIPS
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Patent #:
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Issue Dt:
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02/21/1995
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Application #:
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08229883
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Filing Dt:
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04/19/1994
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Title:
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LOW TEMPERATURE TERNARY C4 FLIP CHIP BONDING METHOD
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Patent #:
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Issue Dt:
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01/30/1996
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Application #:
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08255596
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Filing Dt:
|
06/08/1994
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Title:
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INTERCONNECT STRUCTURE WITH REPLACED SEMICONDUCTOR CHIPS
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Patent #:
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Issue Dt:
|
02/16/1999
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Application #:
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08510401
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Filing Dt:
|
08/02/1995
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Title:
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PROCESS FOR TRANSFERING MATERIAL TO SEMICONDUCTOR CHIP CONDUCTIVE PADS USING A TRANSFER SUBSTRATE
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Patent #:
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Issue Dt:
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08/19/1997
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Application #:
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08558577
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Filing Dt:
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10/31/1995
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Title:
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METHOD FOR FORMING SOLDER BALLS ON A SUBSTRATE
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Patent #:
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Issue Dt:
|
10/03/2000
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Application #:
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08710992
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Filing Dt:
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09/25/1996
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Title:
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INTERCONNECT FOR LOW TEMPERATURE CHIP ATTACHMENT
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Patent #:
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Issue Dt:
|
02/02/1999
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Application #:
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08734492
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Filing Dt:
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10/21/1996
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Title:
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LEAD FREE CONDUCTIVE COMPOSITES FOR ELECTRICAL INTERCONNECTIONS
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Patent #:
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Issue Dt:
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02/23/1999
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Application #:
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08768907
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Filing Dt:
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12/17/1996
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Title:
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LEAD-FREE, HIGH TIN TERNARY SOLDER ALLOY OF TIN, SILVER, AND INDIUM
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Patent #:
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Issue Dt:
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10/06/1998
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Application #:
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08828205
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Filing Dt:
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03/21/1997
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Title:
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FLEXIBLE THIN FILM BALL GRID ARRAY CONTAINING SOLDER MASK
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|
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Patent #:
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|
Issue Dt:
|
10/10/2000
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Application #:
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08874219
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Filing Dt:
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06/13/1997
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|
Title:
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ENCAPSULATING A SOLDER JOINT WITH A PHOTO CURED EPOXY RESIN OR CYANATE
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Patent #:
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|
Issue Dt:
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04/18/2000
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Application #:
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08882459
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Filing Dt:
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06/25/1997
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Title:
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METHOD OF MAKING A HIGH MELTING POINT SOLDER BALL COATED WITH A LOW MELTING POINT SOLDER
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Patent #:
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Issue Dt:
|
02/16/1999
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Application #:
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08882461
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Filing Dt:
|
06/25/1997
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Title:
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HIGH MELTING POINT SOLDER BALL COATED WITH A LOW MELTING POINT SOLDER
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|
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Patent #:
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Issue Dt:
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05/09/2000
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Application #:
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09035538
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Filing Dt:
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03/05/1998
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Title:
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MICRO GRID ARRAY SOLDER INTERCONNECTION STRUCTURE FOR SECOND LEVEL PACKAGING JOINING A MODULE AND PRINTED CIRCUIT BOARD
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|
|
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Patent #:
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Issue Dt:
|
01/04/2000
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Application #:
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09054375
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Filing Dt:
|
04/02/1998
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Title:
|
LEAD-FREE SOLDER PROCESS
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|
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Patent #:
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|
Issue Dt:
|
12/12/2000
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Application #:
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09070163
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Filing Dt:
|
04/30/1998
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Title:
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METHOD FOR ENHANCING FATIGUE LIFE OF BALL GRID ARRAYS
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|
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Patent #:
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|
Issue Dt:
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10/31/2000
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Application #:
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09104746
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Filing Dt:
|
06/25/1998
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Title:
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METHOD FOR PRODUCING A RELIABLE BGA SOLDER JOINT INTERCONNECTION
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|
|
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Patent #:
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|
Issue Dt:
|
12/21/1999
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Application #:
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09135415
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Filing Dt:
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08/14/1998
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Title:
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LEAD-FREE INTERCONNECTION FOR ELECTRONIC DEVICES
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