skip navigationU S P T O SealUnited States Patent and Trademark Office AOTW logo
Home|Site Index|Search|Guides|Contacts|eBusiness|eBiz alerts|News|Help
Assignments on the Web > Patent Query
Patent Assignment Details
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:029389/0672   Pages: 18
Recorded: 12/02/2012
Attorney Dkt #:6757-38500
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 132
Page 1 of 2
Pages: 1 2
1
Patent #:
5448450
Issue Dt:
09/05/1995
Application #:
07783737
Filing Dt:
10/28/1991
Title:
LEAD-ON-CHIP INTEGRATED CIRCUIT APPARATUS
2
Patent #:
5371866
Issue Dt:
12/06/1994
Application #:
07891609
Filing Dt:
06/01/1992
Title:
SIMULCAST STANDARD MULTICHIP MEMORY ADDRESSING SYSTEM
3
Patent #:
5484959
Issue Dt:
01/16/1996
Application #:
07990334
Filing Dt:
12/11/1992
Title:
HIGH DENSITY LEAD-ON-PACKAGE FABRICATION METHOD AND APPARATUS
4
Patent #:
5369056
Issue Dt:
11/29/1994
Application #:
08037830
Filing Dt:
03/29/1993
Title:
WARP-RESISTENT ULTRA-THIN INTEGRATED CIRCUIT PACKAGE FABRICATION METHOD
5
Patent #:
5369058
Issue Dt:
11/29/1994
Application #:
08206301
Filing Dt:
03/04/1994
Title:
WARP-RESISTENT ULTRA-THIN INTEGRATED CIRCUIT PACKAGE FABRICATION METHOD
6
Patent #:
5455740
Issue Dt:
10/03/1995
Application #:
08206829
Filing Dt:
03/07/1994
Title:
BUS COMMUNICATION SYSTEM FOR STACKED HIGH DENSITY INTEGRATED CIRCUIT PACKAGES
7
Patent #:
5581121
Issue Dt:
12/03/1996
Application #:
08280968
Filing Dt:
07/27/1994
Title:
WARP-RESISTANT ULTRA-THIN INTEGRATED CIRCUIT PACKAGE
8
Patent #:
5702985
Issue Dt:
12/30/1997
Application #:
08325719
Filing Dt:
10/19/1994
Title:
HERMETICALLY SEALED CERAMIC INTEGRATED CIRCUIT HEAT DISSIPATING PACKAGE FABRICATION METHOD
9
Patent #:
5572065
Issue Dt:
11/05/1996
Application #:
08328338
Filing Dt:
10/24/1994
Title:
HERMETICALLY SEALED CERAMIC INTEGRATED CIRCUIT HEAT DISSIPATING PACKAGE
10
Patent #:
5528075
Issue Dt:
06/18/1996
Application #:
08375874
Filing Dt:
01/20/1995
Title:
LEAD-ON-CHIP INTEGRATED CIRCUIT APPARATUS
11
Patent #:
5592364
Issue Dt:
01/07/1997
Application #:
08377578
Filing Dt:
01/24/1995
Title:
HIGH DENSITY INTEGRATED CIRCUIT MODULE WITH COMPLEX ELECTRICAL INTERCONNECT RAILS
12
Patent #:
5804870
Issue Dt:
09/08/1998
Application #:
08380541
Filing Dt:
01/30/1995
Title:
HERMETICALLY SEALED INTEGRATED CIRCUIT LEAD-ON PACKAGE CONFIGURATION
13
Patent #:
5612570
Issue Dt:
03/18/1997
Application #:
08421801
Filing Dt:
04/13/1995
Title:
CHIP STACK AND METHOD OF MAKING SAME
14
Patent #:
5479318
Issue Dt:
12/26/1995
Application #:
08440500
Filing Dt:
05/12/1995
Title:
BUS COMMUNICATION SYSTEM FOR STACKED HIGH DENSITY INTEGRATED CIRCUIT PACKAGES WITH TRIFURCATED DISTAL LEAD ENDS
15
Patent #:
5493476
Issue Dt:
02/20/1996
Application #:
08445848
Filing Dt:
05/22/1995
Title:
BUS COMMUNICATION SYSTEM FOR STACKED HIGH DENSITY INTEGRATED CIRCUIT PACKAGES WITH BIFURCATED DISTAL LEAD ENDS
16
Patent #:
RE36229
Issue Dt:
06/15/1999
Application #:
08510729
Filing Dt:
11/20/1995
Title:
SIMULCAST STANDARD MULTICHIP MEMORY ADDRESSING SYSTEM
17
Patent #:
5801437
Issue Dt:
09/01/1998
Application #:
08514294
Filing Dt:
08/11/1995
Title:
THREE-DIMENSIONAL WARP-RESISTANT INTEGRATED CIRCUIT MODULE METHOD AND APPARATUS
18
Patent #:
5654877
Issue Dt:
08/05/1997
Application #:
08516848
Filing Dt:
08/18/1995
Title:
LEAD-ON-CHIP INTEGRATED CIRCUIT APPARATUS
19
Patent #:
5615475
Issue Dt:
04/01/1997
Application #:
08517485
Filing Dt:
08/21/1995
Title:
METHOD OF MANUFACTURING AN INTEGRATED PACKAGE HAVING A PAIR OF DIE ON A COMMON LEAD FRAME
20
Patent #:
5541812
Issue Dt:
07/30/1996
Application #:
08526470
Filing Dt:
09/11/1995
Title:
BUS COMMUNICATION SYSTEM FOR STACKED HIGH DENSITY INTEGRATED CIRCUIT PACKAGES HAVING AN INTERMEDIATE LEAD FRAME
21
Patent #:
5585668
Issue Dt:
12/17/1996
Application #:
08601880
Filing Dt:
02/15/1996
Title:
INTEGRATED CIRCUIT PACKAGE WITH OVERLAPPED DIE ON A COMMON LEAD FRAME
22
Patent #:
5864175
Issue Dt:
01/26/1999
Application #:
08644491
Filing Dt:
05/10/1996
Title:
WARP-RESISTENT ULTRA-THIN INTEGRATED CIRCUIT PACKAGE FABRICATION METHOD
23
Patent #:
5778522
Issue Dt:
07/14/1998
Application #:
08650721
Filing Dt:
05/20/1996
Title:
METHOD OF MANUFACTURING A HIGH DENSITY INTEGRATED CIRCUIT MODULE WITH COMPLEX ELECTRICAL INTERCONNECT RAILS HAVING ELECTRICAL INTERCONNECT STRAIN RELIEF
24
Patent #:
5843807
Issue Dt:
12/01/1998
Application #:
08686985
Filing Dt:
07/25/1996
Title:
METHOD OF MANUFACTURING AN UKTRA-HIGH DENSITY WARP-RESISTANT MEMORY MODULE
25
Patent #:
5828125
Issue Dt:
10/27/1998
Application #:
08758839
Filing Dt:
12/02/1996
Title:
ULTRA-HIGH DENSITY WARP-RESISTANT MEMORY MODULE
26
Patent #:
5783464
Issue Dt:
07/21/1998
Application #:
08798556
Filing Dt:
02/11/1997
Title:
METHOD OF FORMING A HERMETICALLY SEALED CIRCUIT LEAD-ON PACKAGE
27
Patent #:
5895232
Issue Dt:
04/20/1999
Application #:
08888850
Filing Dt:
07/07/1997
Title:
THREE-DIMENSIONAL WARP-RESISTANT INTEGRATED CIRCUIT MODULE METHOD AND APPARATUS
28
Patent #:
5869353
Issue Dt:
02/09/1999
Application #:
08971499
Filing Dt:
11/17/1997
Title:
MODULAR PANEL STACKING PROCESS
29
Patent #:
6190939
Issue Dt:
02/20/2001
Application #:
09115293
Filing Dt:
07/14/1998
Title:
METHOD OF MANUFACTURING A WARP RESISTANT THERMALLY CONDUCTIVE CIRCUIT PACKAGE
30
Patent #:
6282210
Issue Dt:
08/28/2001
Application #:
09133297
Filing Dt:
08/12/1998
Title:
CLOCK DRIVER WITH INSTANTANEOUSLY SELECTABLE PHASE AND METHOD FOR USE IN DATA COMMUNICATION SYSTEM
31
Patent #:
6194247
Issue Dt:
02/27/2001
Application #:
09159120
Filing Dt:
09/23/1998
Title:
WARP-RESISTENT ULTRA-THIN INTEGRATED CIRCUIT PACKAGE FABRICATION METHOD
32
Patent #:
6310392
Issue Dt:
10/30/2001
Application #:
09221350
Filing Dt:
12/28/1998
Title:
STACKED MICRO BALL GRID ARRAY PACKAGES
33
Patent #:
6205654
Issue Dt:
03/27/2001
Application #:
09222263
Filing Dt:
12/28/1998
Title:
METHOD OF MANUFACTURING A SURFACE MOUNT PACKAGE
34
Patent #:
6222737
Issue Dt:
04/24/2001
Application #:
09298664
Filing Dt:
04/23/1999
Title:
UNIVERSAL PACKAGE AND METHOD OF FORMING THE SAME
35
Patent #:
6323060
Issue Dt:
11/27/2001
Application #:
09305584
Filing Dt:
05/05/1999
Title:
STACKABLE FLEX CIRCUIT IC PACKAGE AND METHOD OF MAKING SAME
36
Patent #:
6288907
Issue Dt:
09/11/2001
Application #:
09343432
Filing Dt:
06/30/1999
Title:
HIGH DENSITY INTEGRATED CIRCUIT MODULE WITH COMPLEX ELECTRICAL INTERCONNECT RAILS HAVING ELECTRICAL INTERCONNECT STRAIN RELIEF
37
Patent #:
6262895
Issue Dt:
07/17/2001
Application #:
09482294
Filing Dt:
01/13/2000
Title:
STACKABLE CHIP PACKAGE WITH FLEX CARRIER
38
Patent #:
6437433
Issue Dt:
08/20/2002
Application #:
09535641
Filing Dt:
03/24/2000
Title:
CSP STACKING TECHNOLOGY USING RIGID/FLEX CONSTRUCTION
39
Patent #:
6351029
Issue Dt:
02/26/2002
Application #:
09574321
Filing Dt:
05/19/2000
Title:
Stackable flex circuit chip package and method of making same
40
Patent #:
6236565
Issue Dt:
05/22/2001
Application #:
09594363
Filing Dt:
06/15/2000
Title:
Chip stack with active cooling system
41
Patent #:
6404043
Issue Dt:
06/11/2002
Application #:
09598343
Filing Dt:
06/21/2000
Title:
PANEL STACKING OF BGA DEVICES TO FORM THREE-DIMENSIONAL MODULES
42
Patent #:
6608763
Issue Dt:
08/19/2003
Application #:
09663753
Filing Dt:
09/15/2000
Title:
STACKING SYSTEM AND METHOD
43
Patent #:
6360433
Issue Dt:
03/26/2002
Application #:
09664938
Filing Dt:
09/19/2000
Title:
method of forming universal package
44
Patent #:
6426549
Issue Dt:
07/30/2002
Application #:
09706015
Filing Dt:
11/03/2000
Title:
STACKABLE FLEX CIRCUIT IC PACKAGE AND METHOD OF MAKING SAME
45
Patent #:
6919626
Issue Dt:
07/19/2005
Application #:
09761210
Filing Dt:
01/16/2001
Publication #:
US20010005042
Pub Dt:
06/28/2001
Title:
HIGH DENSITY INTEGRATED CIRCUIT MODULE
46
Patent #:
6462408
Issue Dt:
10/08/2002
Application #:
09819171
Filing Dt:
03/27/2001
Publication #:
US20020140074
Pub Dt:
10/03/2002
Title:
CONTACT MEMBER STACKING SYSTEM AND METHOD
47
Patent #:
6472735
Issue Dt:
10/29/2002
Application #:
09826621
Filing Dt:
04/05/2001
Publication #:
US20010054758
Pub Dt:
12/27/2001
Title:
THREE-DIMENSIONAL MEMORY STACKING USING ANISOTROPIC EPOXY INTERCONNECTIONS
48
Patent #:
6473308
Issue Dt:
10/29/2002
Application #:
09838773
Filing Dt:
04/19/2001
Publication #:
US20010015487
Pub Dt:
08/23/2001
Title:
STACKABLE CHIP PACKAGE WITH FLEX CARRIER
49
Patent #:
6426240
Issue Dt:
07/30/2002
Application #:
09888785
Filing Dt:
06/25/2001
Publication #:
US20010035572
Pub Dt:
11/01/2001
Title:
STACKABLE FLEX CIRCUIT CHIP PACKAGE AND METHOD OF MAKING SAME
50
Patent #:
6514793
Issue Dt:
02/04/2003
Application #:
09888792
Filing Dt:
06/25/2001
Publication #:
US20020048849
Pub Dt:
04/25/2002
Title:
STACKABLE FLEX CIRCUIT IC PACKAGE AND METHOD OF MAKING SAME
51
Patent #:
6627984
Issue Dt:
09/30/2003
Application #:
09912010
Filing Dt:
07/24/2001
Publication #:
US20030020153
Pub Dt:
01/30/2003
Title:
CHIP STACK WITH DIFFERING CHIP PACKAGE TYPES
52
Patent #:
6618257
Issue Dt:
09/09/2003
Application #:
09916625
Filing Dt:
07/27/2001
Title:
WIDE DATA PATH STACKING SYSTEM AND METHOD
53
Patent #:
6544815
Issue Dt:
04/08/2003
Application #:
09922977
Filing Dt:
08/06/2001
Publication #:
US20010054770
Pub Dt:
12/27/2001
Title:
PANEL STACKING OF BGA DEVICES TO FORM THREE-DIMENSIONAL MODULES
54
Patent #:
6573460
Issue Dt:
06/03/2003
Application #:
09957190
Filing Dt:
09/20/2001
Publication #:
US20030051906
Pub Dt:
03/20/2003
Title:
POST IN RING INTERCONNECT USING FOR 3-D STACKING
55
Patent #:
6576992
Issue Dt:
06/10/2003
Application #:
10005581
Filing Dt:
10/26/2001
Title:
CHIP SCALE STACKING SYSTEM AND METHOD
56
Patent #:
7081373
Issue Dt:
07/25/2006
Application #:
10016939
Filing Dt:
12/14/2001
Publication #:
US20030111736
Pub Dt:
06/19/2003
Title:
CSP CHIP STACK WITH FLEX CIRCUIT
57
Patent #:
6566746
Issue Dt:
05/20/2003
Application #:
10017553
Filing Dt:
12/14/2001
Publication #:
US20020053728
Pub Dt:
05/09/2002
Title:
PANEL STACKING OF BGA DEVICES TO FORM THREE-DIMENSIONAL MODULES
58
Patent #:
6806120
Issue Dt:
10/19/2004
Application #:
10092104
Filing Dt:
03/06/2002
Publication #:
US20020142515
Pub Dt:
10/03/2002
Title:
CONTACT MEMBER STACKING SYSTEM AND METHOD
59
Patent #:
6572387
Issue Dt:
06/03/2003
Application #:
10101039
Filing Dt:
03/19/2002
Publication #:
US20020102870
Pub Dt:
08/01/2002
Title:
FLEXIBLE CIRCUIT CONNECTOR FOR STACKED CHIP MODULE
60
Patent #:
6940729
Issue Dt:
09/06/2005
Application #:
10136890
Filing Dt:
05/02/2002
Publication #:
US20030081392
Pub Dt:
05/01/2003
Title:
INTEGRATED CIRCUIT STACKING SYSTEM AND METHOD
61
Patent #:
6908792
Issue Dt:
06/21/2005
Application #:
10263859
Filing Dt:
10/03/2002
Publication #:
US20030025211
Pub Dt:
02/06/2003
Title:
CHIP STACK WITH DIFFERING CHIP PACKAGE TYPES
62
Patent #:
6878571
Issue Dt:
04/12/2005
Application #:
10316566
Filing Dt:
12/11/2002
Publication #:
US20030127746
Pub Dt:
07/10/2003
Title:
PANEL STACKING OF BGA DEVICES TO FORM THREE-DIMENSIONAL MODULES
63
Patent #:
7485951
Issue Dt:
02/03/2009
Application #:
10435192
Filing Dt:
05/09/2003
Publication #:
US20040000707
Pub Dt:
01/01/2004
Title:
MODULARIZED DIE STACKING SYSTEM AND METHOD
64
Patent #:
7066741
Issue Dt:
06/27/2006
Application #:
10449242
Filing Dt:
05/30/2003
Publication #:
US20030203663
Pub Dt:
10/30/2003
Title:
FLEXIBLE CIRCUIT CONNECTOR FOR STACKED CHIP MODULE
65
Patent #:
6914324
Issue Dt:
07/05/2005
Application #:
10453398
Filing Dt:
06/03/2003
Publication #:
US20040000708
Pub Dt:
01/01/2004
Title:
MEMORY EXPANSION AND CHIP SCALE STACKING SYSTEM AND METHOD
66
Patent #:
6856010
Issue Dt:
02/15/2005
Application #:
10620157
Filing Dt:
07/14/2003
Publication #:
US20040108584
Pub Dt:
06/10/2004
Title:
THIN SCALE OUTLINE PACKAGE
67
Patent #:
7026708
Issue Dt:
04/11/2006
Application #:
10631886
Filing Dt:
07/11/2003
Publication #:
US20040052060
Pub Dt:
03/18/2004
Title:
LOW PROFILE CHIP SCALE STACKING SYSTEM AND METHOD
68
Patent #:
6955945
Issue Dt:
10/18/2005
Application #:
10709732
Filing Dt:
05/25/2004
Publication #:
US20040197956
Pub Dt:
10/07/2004
Title:
MEMORY EXPANSION AND CHIP SCALE STACKING SYSTEM AND METHOD
69
Patent #:
6992501
Issue Dt:
01/31/2006
Application #:
10800816
Filing Dt:
03/15/2004
Publication #:
US20050200380
Pub Dt:
09/15/2005
Title:
REFLECTION-CONTROL SYSTEM AND METHOD
70
Patent #:
7542304
Issue Dt:
06/02/2009
Application #:
10804452
Filing Dt:
03/19/2004
Publication #:
US20050057911
Pub Dt:
03/17/2005
Title:
MEMORY EXPANSION AND INTEGRATED CIRCUIT STACKING SYSTEM AND METHOD
71
Patent #:
6893899
Issue Dt:
05/17/2005
Application #:
10814531
Filing Dt:
03/31/2004
Publication #:
US20040183206
Pub Dt:
09/23/2004
Title:
CONTACT MEMBER STACKING SYSTEM AND METHOD
72
Patent #:
6956284
Issue Dt:
10/18/2005
Application #:
10814532
Filing Dt:
03/31/2004
Publication #:
US20040183183
Pub Dt:
09/23/2004
Title:
INTEGRATED CIRCUIT STACKING SYSTEM AND METHOD
73
Patent #:
7371609
Issue Dt:
05/13/2008
Application #:
10836855
Filing Dt:
04/30/2004
Publication #:
US20040201091
Pub Dt:
10/14/2004
Title:
STACKED MODULE SYSTEMS AND METHODS
74
Patent #:
7094632
Issue Dt:
08/22/2006
Application #:
10873847
Filing Dt:
06/22/2004
Publication #:
US20040229402
Pub Dt:
11/18/2004
Title:
LOW PROFILE CHIP SCALE STACKING SYSTEM AND METHOD
75
Patent #:
RE39628
Issue Dt:
05/15/2007
Application #:
10900073
Filing Dt:
07/27/2004
Title:
STACKABLE FLEX CIRCUIT IC PACKAGE AND METHOD OF MAKING SAME
76
Patent #:
7053478
Issue Dt:
05/30/2006
Application #:
10914483
Filing Dt:
08/09/2004
Publication #:
US20050018412
Pub Dt:
01/27/2005
Title:
PITCH CHANGE AND CHIP SCALE STACKING SYSTEM
77
Patent #:
7606048
Issue Dt:
10/20/2009
Application #:
10958584
Filing Dt:
10/05/2004
Publication #:
US20050041402
Pub Dt:
02/24/2005
Title:
INTEGRATED CIRCUIT STACKING SYSTEM
78
Patent #:
7586758
Issue Dt:
09/08/2009
Application #:
10958924
Filing Dt:
10/05/2004
Publication #:
US20050041403
Pub Dt:
02/24/2005
Title:
INTEGRATED CIRCUIT STACKING SYSTEM
79
Patent #:
7335975
Issue Dt:
02/26/2008
Application #:
10958934
Filing Dt:
10/05/2004
Publication #:
US20050041404
Pub Dt:
02/24/2005
Title:
INTEGRATED CIRCUIT STACKING SYSTEM AND METHOD
80
Patent #:
RE41039
Issue Dt:
12/15/2009
Application #:
10974046
Filing Dt:
10/26/2004
Title:
STACKABLE CHIP PACKAGE WITH FLEX CARRIER
81
Patent #:
7480152
Issue Dt:
01/20/2009
Application #:
11005992
Filing Dt:
12/07/2004
Publication #:
US20060050496
Pub Dt:
03/09/2006
Title:
THIN MODULE SYSTEM AND METHOD
82
Patent #:
7511968
Issue Dt:
03/31/2009
Application #:
11007551
Filing Dt:
12/08/2004
Publication #:
US20060050497
Pub Dt:
03/09/2006
Title:
BUFFERED THIN MODULE SYSTEM AND METHOD
83
Patent #:
7180167
Issue Dt:
02/20/2007
Application #:
11011469
Filing Dt:
12/14/2004
Publication #:
US20050146031
Pub Dt:
07/07/2005
Title:
LOW PROFILE STACKING SYSTEM AND METHOD
84
Patent #:
7309914
Issue Dt:
12/18/2007
Application #:
11039615
Filing Dt:
01/20/2005
Publication #:
US20060157842
Pub Dt:
07/20/2006
Title:
INVERTED CSP STACKING SYSTEM AND METHOD
85
Patent #:
7468893
Issue Dt:
12/23/2008
Application #:
11058979
Filing Dt:
02/16/2005
Publication #:
US20060049500
Pub Dt:
03/09/2006
Title:
THIN MODULE SYSTEM AND METHOD
86
Patent #:
7202555
Issue Dt:
04/10/2007
Application #:
11074026
Filing Dt:
03/08/2005
Publication #:
US20050146011
Pub Dt:
07/07/2005
Title:
PITCH CHANGE AND CHIP SCALE STACKING SYSTEM AND METHOD
87
Patent #:
7606040
Issue Dt:
10/20/2009
Application #:
11077952
Filing Dt:
03/11/2005
Publication #:
US20080278901
Pub Dt:
11/13/2008
Title:
MEMORY MODULE SYSTEM AND METHOD
88
Patent #:
7606049
Issue Dt:
10/20/2009
Application #:
11125018
Filing Dt:
05/09/2005
Publication #:
US20060049502
Pub Dt:
03/09/2006
Title:
MODULE THERMAL MANAGEMENT SYSTEM AND METHOD
89
Patent #:
7033861
Issue Dt:
04/25/2006
Application #:
11131812
Filing Dt:
05/18/2005
Title:
STACKED MODULE SYSTEMS AND METHOD
90
Patent #:
7423885
Issue Dt:
09/09/2008
Application #:
11157565
Filing Dt:
06/21/2005
Publication #:
US20060050498
Pub Dt:
03/09/2006
Title:
DIE MODULE SYSTEM
91
Patent #:
7595550
Issue Dt:
09/29/2009
Application #:
11173445
Filing Dt:
07/01/2005
Publication #:
US20050263872
Pub Dt:
12/01/2005
Title:
FLEX-BASED CIRCUIT MODULE
92
Patent #:
7606050
Issue Dt:
10/20/2009
Application #:
11187269
Filing Dt:
07/22/2005
Publication #:
US20060050592
Pub Dt:
03/09/2006
Title:
COMPACT MODULE SYSTEM AND METHOD
93
Patent #:
7495334
Issue Dt:
02/24/2009
Application #:
11197267
Filing Dt:
08/04/2005
Publication #:
US20050280135
Pub Dt:
12/22/2005
Title:
STACKING SYSTEM AND METHOD
94
Patent #:
7524703
Issue Dt:
04/28/2009
Application #:
11221597
Filing Dt:
09/07/2005
Publication #:
US20060008945
Pub Dt:
01/12/2006
Title:
INTEGRATED CIRCUIT STACKING SYSTEM AND METHOD
95
Patent #:
7443023
Issue Dt:
10/28/2008
Application #:
11231418
Filing Dt:
09/21/2005
Publication #:
US20060091529
Pub Dt:
05/04/2006
Title:
HIGH CAPACITY THIN MODULE SYSTEM
96
Patent #:
7259452
Issue Dt:
08/21/2007
Application #:
11248662
Filing Dt:
10/11/2005
Publication #:
US20070080470
Pub Dt:
04/12/2007
Title:
LEADED PACKAGE INTEGRATED CIRCUIT STACKING
97
Patent #:
7542297
Issue Dt:
06/02/2009
Application #:
11255061
Filing Dt:
10/19/2005
Publication #:
US20060050489
Pub Dt:
03/09/2006
Title:
OPTIMIZED MOUNTING AREA CIRCUIT MODULE SYSTEM AND METHOD
98
Patent #:
7310458
Issue Dt:
12/18/2007
Application #:
11258438
Filing Dt:
10/25/2005
Publication #:
US20060108572
Pub Dt:
05/25/2006
Title:
STACKED MODULE SYSTEMS AND METHODS
99
Patent #:
7656678
Issue Dt:
02/02/2010
Application #:
11263627
Filing Dt:
10/31/2005
Publication #:
US20060092614
Pub Dt:
05/04/2006
Title:
STACKED MODULE SYSTEMS
100
Patent #:
7576995
Issue Dt:
08/18/2009
Application #:
11267476
Filing Dt:
11/04/2005
Publication #:
US20070103877
Pub Dt:
05/10/2007
Title:
FLEX CIRCUIT APPARATUS AND METHOD FOR ADDING CAPACITANCE WHILE CONSERVING CIRCUIT BOARD SURFACE AREA
Assignor
1
ENTORIAN TECHNOLOGIES INC.
Exec Dt:
10/31/2012
Assignee
1
OVID DATA CO. LLC
2711 CENTERVILLE RD
SUITE 400
WILMINGTON, DELAWARE 19808
Correspondence name and address
DAWN DELUCA
1120 SOUTH CAPITAL OF TEXAS HIGHWAY
BUILDING 2, SUITE 300
AUSTIN, TX 78746

Search Results as of: 05/11/2024 06:19 AM
If you have any comments or questions concerning the data displayed, contact PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified: August 25, 2017 v.2.6
| .HOME | INDEX| SEARCH | eBUSINESS | CONTACT US | PRIVACY STATEMENT