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Patent #:
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Issue Dt:
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04/10/2012
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Application #:
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10662248
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Filing Dt:
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09/15/2003
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Publication #:
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Pub Dt:
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03/25/2004
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Title:
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NEAR CHIP SIZE SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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12/15/2009
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Application #:
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10766101
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Filing Dt:
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01/28/2004
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Title:
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DOUBLE MOLD MEMORY CARD AND ITS MANUFACTURING METHOD
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Patent #:
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Issue Dt:
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10/06/2009
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Application #:
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10910089
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Filing Dt:
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08/03/2004
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Title:
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OFFSET ETCHED CORNER LEADS FOR SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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12/06/2011
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Application #:
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10972686
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Filing Dt:
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10/25/2004
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Publication #:
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Pub Dt:
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02/19/2009
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Title:
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SEMICONDUCTOR PACKAGE HAVING A PLURALITY INPUT/OUTPUT MEMBERS
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Patent #:
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Issue Dt:
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12/08/2009
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Application #:
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10992036
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Filing Dt:
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11/17/2004
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Title:
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SHIELDED PACKAGE HAVING SHIELD FENCE
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Patent #:
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Issue Dt:
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07/13/2010
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Application #:
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11111316
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Filing Dt:
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04/21/2005
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Title:
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DIE-MOUNTING SUBSTRATE AND METHOD INCORPORATING DUMMY TRACES FOR IMPROVING MOUNTING FILM PLANARITY
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Patent #:
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Issue Dt:
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06/29/2010
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Application #:
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11168168
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Filing Dt:
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06/27/2005
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Title:
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PACKAGE IN PACKAGE (PIP)
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Patent #:
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Issue Dt:
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08/18/2009
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Application #:
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11177904
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Filing Dt:
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07/07/2005
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Title:
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DIRECT GLASS ATTACHED ON DIE OPTICAL MODULE
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Patent #:
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Issue Dt:
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10/12/2010
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Application #:
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11228791
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Filing Dt:
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09/16/2005
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Publication #:
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Pub Dt:
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12/28/2006
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Title:
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WIRE BONDING MACHINE CAPABLE OF REMOVING PARTICLES FROM CAPILLARY AND CLEANING METHOD OF CAPILLARY BOTTOM TIP
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Patent #:
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Issue Dt:
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11/23/2010
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Application #:
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11288906
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Filing Dt:
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11/29/2005
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Title:
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MODULAR MEMORY CARD AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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12/15/2009
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Application #:
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11293999
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Filing Dt:
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12/05/2005
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Title:
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SEMICONDUCTOR PACKAGE INCLUDING A TOP-SURFACE METAL LAYER FOR IMPLEMENTING CIRCUIT FEATURES
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Patent #:
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Issue Dt:
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08/11/2009
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Application #:
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11298016
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Filing Dt:
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12/08/2005
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Title:
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EMBEDDED ELECTRONIC COMPONENT PACKAGE
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Patent #:
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Issue Dt:
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10/27/2009
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Application #:
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11315994
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Filing Dt:
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12/21/2005
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Title:
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OPTICAL MODULE HAVING CAVITY SUBSTRATE
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Patent #:
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Issue Dt:
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03/09/2010
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Application #:
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11356921
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Filing Dt:
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02/17/2006
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Title:
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STACKED ELECTRONIC COMPONENT PACKAGE HAVING FILM-ON-WIRE SPACER
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Patent #:
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Issue Dt:
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07/21/2009
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Application #:
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11365246
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Filing Dt:
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03/01/2006
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Publication #:
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Pub Dt:
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02/14/2008
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD OF MAKING USING LEADFRAME HAVING LEAD LOCKS TO SECURE LEADS TO ENCAPSULANT
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Patent #:
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Issue Dt:
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01/26/2010
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Application #:
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11367171
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Filing Dt:
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03/03/2006
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Title:
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LAND PATTERNS FOR A SEMICONDUCTOR STACKING STRUCTURE AND METHOD THEREFOR
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Patent #:
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Issue Dt:
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05/18/2010
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Application #:
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11379550
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Filing Dt:
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04/20/2006
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Title:
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CHAMFERED MEMORY CARD MODULE AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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05/19/2009
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Application #:
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11408521
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Filing Dt:
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04/21/2006
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Publication #:
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Pub Dt:
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08/24/2006
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Title:
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SEMICONDUCTOR PACKAGE HAVING IMPROVED ADHESIVENESS AND GROUND BONDING
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Patent #:
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Issue Dt:
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07/07/2009
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Application #:
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11425502
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Filing Dt:
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06/21/2006
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Title:
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TAPE SUPPORTED MEMORY CARD LEADFRAME STRUCTURE
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Patent #:
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Issue Dt:
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06/28/2011
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Application #:
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11425505
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Filing Dt:
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06/21/2006
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Title:
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SIDE LEADED, BOTTOM EXPOSED PAD AND BOTTOM EXPOSED LEAD FUSION QUAD FLAT SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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03/08/2011
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Application #:
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11440548
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Filing Dt:
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05/24/2006
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Title:
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SUBSTRATE FOR SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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Patent #:
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Issue Dt:
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12/15/2009
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Application #:
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11440662
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Filing Dt:
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05/24/2006
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Title:
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SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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07/13/2010
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Application #:
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11472874
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Filing Dt:
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06/21/2006
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Title:
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CAPACITOR AND RESISTOR HAVING ANODIC METAL AND ANODIC METAL OXIDE STRUCTURE
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Patent #:
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Issue Dt:
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06/16/2009
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Application #:
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11497617
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Filing Dt:
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08/01/2006
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Title:
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BUILDUP DIELECTRIC AND METALLIZATION PROCESS AND SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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04/21/2009
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Application #:
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11510544
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Filing Dt:
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08/25/2006
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Publication #:
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Pub Dt:
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12/28/2006
| | | | |
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Title:
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LEAD FRAME FOR SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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09/15/2009
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Application #:
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11543540
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Filing Dt:
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10/04/2006
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Title:
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EMBEDDED METAL FEATURES STRUCTURE
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Patent #:
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Issue Dt:
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06/30/2009
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Application #:
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11557884
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Filing Dt:
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11/08/2006
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Publication #:
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Pub Dt:
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05/29/2008
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Title:
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THERMALLY ENHANCED SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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06/23/2009
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Application #:
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11560496
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Filing Dt:
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11/16/2006
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Title:
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STACKED REDISTRIBUTION LAYER (RDL) DIE ASSEMBLY PACKAGE
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Patent #:
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Issue Dt:
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08/24/2010
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Application #:
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11566731
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Filing Dt:
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12/05/2006
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Title:
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MEMBRANE DIE ATTACH CIRCUIT ELEMENT PACKAGE AND METHOD THEREFOR
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Patent #:
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Issue Dt:
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03/01/2011
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Application #:
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11592889
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Filing Dt:
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11/02/2006
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Title:
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EXPOSED DIE OVERMOLDED FLIP CHIP PACKAGE AND FABRICATION METHOD
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Patent #:
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Issue Dt:
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03/02/2010
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Application #:
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11595411
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Filing Dt:
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11/09/2006
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Title:
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SEMICONDUCTOR PACKAGE INCLUDING TOP-SURFACE TERMINALS FOR MOUNTING ANOTHER SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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05/11/2010
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Application #:
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11605740
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Filing Dt:
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11/28/2006
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Title:
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ELECTRONIC COMPONENT PACKAGE COMPRISING FAN-OUT AND FAN-IN TRACES
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Patent #:
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Issue Dt:
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07/06/2010
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Application #:
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11615467
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Filing Dt:
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12/22/2006
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Title:
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BLIND VIA CAPTURE PAD STRUCTURE
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Patent #:
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Issue Dt:
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12/28/2010
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Application #:
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11616069
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Filing Dt:
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12/26/2006
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Title:
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EXPOSED METAL BEZEL FOR USE IN SENSOR DEVICES AND METHOD THEREFOR
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Patent #:
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Issue Dt:
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03/30/2010
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Application #:
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11616747
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Filing Dt:
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12/27/2006
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Publication #:
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Pub Dt:
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07/03/2008
| | | | |
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Title:
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SEMICONDUCTOR PACKAGE HAVING LEADFRAME WITH EXPOSED ANCHOR PADS
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Patent #:
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Issue Dt:
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07/13/2010
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Application #:
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11621402
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Filing Dt:
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01/09/2007
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Title:
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METHOD OF FABRICATING AN EMBEDDED CIRCUIT PATTERN
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Patent #:
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Issue Dt:
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01/18/2011
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Application #:
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11621630
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Filing Dt:
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01/10/2007
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Publication #:
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Pub Dt:
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07/12/2007
| | | | |
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Title:
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METHODS OF FORMING BACK SIDE LAYERS FOR THINNED WAFERS
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Patent #:
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Issue Dt:
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11/09/2010
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Application #:
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11624648
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Filing Dt:
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01/18/2007
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Title:
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STACKABLE SEMICONDUCTOR PACKAGE INCLUDING LAMINATE INTERPOSER
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Patent #:
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Issue Dt:
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03/09/2010
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Application #:
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11671018
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Filing Dt:
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02/05/2007
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Publication #:
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Pub Dt:
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08/09/2007
| | | | |
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Title:
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METHODS OF FORMING METAL LAYERS USING MULTI-LAYER LIFT-OFF PATTERNS
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Patent #:
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Issue Dt:
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04/26/2011
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Application #:
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11671026
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Filing Dt:
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02/05/2007
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Publication #:
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Pub Dt:
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08/09/2007
| | | | |
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Title:
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ELECTRONIC DEVICES INCLUDING SOLDER BUMPS ON COMPLIANT DIELECTRIC LAYERS
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Patent #:
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|
Issue Dt:
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07/19/2011
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Application #:
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11682666
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Filing Dt:
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03/06/2007
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Title:
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STACKABLE SEMICONDUCTOR PACKAGE HAVING PARTIALLY EXPOSED SEMICONDUCTOR DIE AND METHOD OF FABRICATING THE SAME
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Patent #:
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Issue Dt:
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10/05/2010
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Application #:
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11734999
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Filing Dt:
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04/13/2007
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Title:
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SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
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Patent #:
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Issue Dt:
|
03/01/2011
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Application #:
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11754209
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Filing Dt:
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05/25/2007
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Title:
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A SEMICONDUCTOR DEVICE HAVING EMI SHIELDING AND METHOD THEREFOR
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Patent #:
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Issue Dt:
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04/12/2011
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Application #:
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11765806
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Filing Dt:
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06/20/2007
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Title:
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METAL ETCH STOP FABRICATION METHOD AND STRUCTURE
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Patent #:
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Issue Dt:
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05/31/2011
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Application #:
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11765828
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Filing Dt:
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06/20/2007
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Title:
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EMBEDDED DIE METAL ETCH STOP FABRICATION METHOD AND STRUCTURE
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Patent #:
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Issue Dt:
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06/29/2010
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Application #:
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11775492
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Filing Dt:
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07/10/2007
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Title:
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SEMICONDUCTOR DEVICE HAVING RF SHIELDING AND METHOD THEREFOR
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Patent #:
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Issue Dt:
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07/12/2011
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Application #:
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11775566
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Filing Dt:
|
07/10/2007
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Publication #:
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Pub Dt:
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01/15/2009
| | | | |
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Title:
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FUSION QUAD FLAT SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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05/25/2010
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Application #:
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11810799
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Filing Dt:
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06/06/2007
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Publication #:
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Pub Dt:
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10/18/2007
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Title:
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DIRECT-WRITE WAFER LEVEL CHIP SCALE PACKAGE
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Patent #:
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Issue Dt:
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12/07/2010
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Application #:
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11832571
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Filing Dt:
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08/01/2007
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Publication #:
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Pub Dt:
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02/05/2009
| | | | |
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Title:
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SEMICONDUCTOR DEVICE HAVING A STACKED BUMP TO REDUCE KIRKENDALL VOIDS AND OR CRACKS AND METHOD OF MANUFACTURING
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Patent #:
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Issue Dt:
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03/30/2010
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Application #:
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11835235
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Filing Dt:
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08/07/2007
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Title:
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DUAL LAMINATE PACKAGE STRUCTURE WITH EMBEDDED ELEMENTS
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Patent #:
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Issue Dt:
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08/17/2010
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Application #:
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11865617
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Filing Dt:
|
10/01/2007
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Title:
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THIN STACKED INTERPOSER PACKAGE
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Patent #:
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Issue Dt:
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01/03/2012
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Application #:
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11866886
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Filing Dt:
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10/03/2007
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Title:
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SEMICONDUCTOR PACKAGE WITH INCREASED I/O DENSITY AND METHOD OF MAKING THE SAME
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Patent #:
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Issue Dt:
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12/15/2009
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Application #:
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11867293
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Filing Dt:
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10/04/2007
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Title:
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WAFER LEVEL PACKAGE UTILIZING LASER-ACTIVATED DIELECTRIC MATERIAL
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Patent #:
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Issue Dt:
|
05/18/2010
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Application #:
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11875597
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Filing Dt:
|
10/19/2007
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Title:
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SOLDER ATTACH FILM AND METHOD OF FORMING SOLDER BALL USING THE SAME
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Patent #:
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Issue Dt:
|
03/02/2010
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Application #:
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11903002
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Filing Dt:
|
09/19/2007
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Publication #:
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Pub Dt:
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01/24/2008
| | | | |
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Title:
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SUBSTRATE HAVING STIFFENER FABRICATION METHOD
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Patent #:
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Issue Dt:
|
06/14/2011
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Application #:
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11924156
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Filing Dt:
|
10/25/2007
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Title:
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EMBEDDED PASSIVE COMPONENT NETWORK SUBSTRATE FABRICATION METHOD
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Patent #:
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Issue Dt:
|
04/05/2011
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Application #:
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11933908
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Filing Dt:
|
11/01/2007
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Title:
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SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
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Patent #:
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Issue Dt:
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12/07/2010
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Application #:
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11935314
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Filing Dt:
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11/05/2007
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Title:
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REDUCED SIZE STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME
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Patent #:
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Issue Dt:
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09/13/2011
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Application #:
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11953680
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Filing Dt:
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12/10/2007
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Title:
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THIN SUBSTRATE FABRICATION METHOD AND STRUCTURE
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Patent #:
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Issue Dt:
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07/14/2009
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Application #:
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11970712
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Filing Dt:
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01/08/2008
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Title:
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INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING THE SAME
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Patent #:
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Issue Dt:
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06/07/2011
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Application #:
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12015428
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Filing Dt:
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01/16/2008
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Title:
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SEMICONDUCTOR PACKAGE WITH PATTERNING LAYER AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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05/25/2010
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Application #:
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12017266
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Filing Dt:
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01/21/2008
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Title:
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STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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11/16/2010
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Application #:
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12018435
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Filing Dt:
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01/23/2008
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Title:
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SHIELDED TRACE STRUCTURE AND FABRICATION METHOD
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Patent #:
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Issue Dt:
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07/19/2011
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Application #:
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12025336
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Filing Dt:
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02/04/2008
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Title:
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SEMICONDUCTOR PACKAGE HAVING A LAND TO ABSORB THERMAL AND MECHANICAL STRESS AND FABRICATING METHOD THEREOF
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Patent #:
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Issue Dt:
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11/29/2011
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Application #:
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12100886
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Filing Dt:
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04/10/2008
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Title:
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FLAT SEMICONDUCTOR PACKAGE WITH HALF PACKAGE MOLDING
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Patent #:
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Issue Dt:
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08/03/2010
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Application #:
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12105196
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Filing Dt:
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04/17/2008
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Title:
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SEMICONDUCTOR PACKAGE WITH FAST POWER-UP CYCLE AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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08/30/2011
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Application #:
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12107478
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Filing Dt:
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04/22/2008
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Title:
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SYSTEM AND METHOD TO REDUCE SHORTING OF RADIO FREQUENCY (RF) SHIELDING
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Patent #:
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Issue Dt:
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03/15/2011
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Application #:
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12108419
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Filing Dt:
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04/23/2008
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Title:
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SEMICONDUCTOR DEVICE HAVING REDUCED THERMAL INTERFACE MATERIAL (TIM) DEGRADATION AND METHOD THEREFOR
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Patent #:
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Issue Dt:
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08/09/2011
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Application #:
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12108909
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Filing Dt:
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04/24/2008
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Title:
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LEAD FREE ALLOY BUMP STRUCTURE AND FABRICATION METHOD
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Patent #:
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Issue Dt:
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10/05/2010
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Application #:
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12116127
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Filing Dt:
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05/06/2008
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Title:
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SEMICONDUCTOR PACKAGE WITH HALF-ETCHED LOCKING FEATURES
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Patent #:
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Issue Dt:
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11/15/2011
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Application #:
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12116695
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Filing Dt:
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05/07/2008
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Title:
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SEMICONDUCTOR DEVICE HAVING REDISTRIBUTION LAYER
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Patent #:
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Issue Dt:
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04/26/2011
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Application #:
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12144145
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Filing Dt:
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06/23/2008
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Title:
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FLIP CHIP BUMP STRUCTURE AND FABRICATION METHOD
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Patent #:
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Issue Dt:
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05/17/2011
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Application #:
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12169151
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Filing Dt:
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07/08/2008
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Title:
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SEMICONDUCTOR DEVICE HAVING IMPROVED CONTACT INTERFACE RELIABILITY AND METHOD THEREFOR
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Patent #:
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Issue Dt:
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02/28/2012
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Application #:
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12181256
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Filing Dt:
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07/28/2008
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Title:
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INCREASED I/O SEMICONDUCTOR PACKAGE AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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05/22/2012
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Application #:
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12183979
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Filing Dt:
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07/31/2008
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Title:
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INCREASED CAPACITY SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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04/06/2010
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Application #:
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12187578
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Filing Dt:
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08/07/2008
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Title:
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LAND PATTERNS FOR A SEMICONDUCTOR STACKING STRUCTURE AND METHOD THEREFOR
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Patent #:
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Issue Dt:
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11/30/2010
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Application #:
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12190039
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Filing Dt:
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08/12/2008
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Title:
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SEMICONDUCTOR PACKAGE HAVING THROUGH HOLES
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Patent #:
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Issue Dt:
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04/06/2010
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Application #:
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12221797
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Filing Dt:
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08/05/2008
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Title:
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TWO-SIDED FAN-OUT WAFER ESCAPE PACKAGE
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Patent #:
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Issue Dt:
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08/31/2010
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Application #:
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12221948
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Filing Dt:
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08/08/2008
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Publication #:
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Pub Dt:
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12/18/2008
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Title:
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CAMERA MODULE WITH WINDOW MECHANICAL ATTACHMENT
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Patent #:
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Issue Dt:
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11/30/2010
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Application #:
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12237173
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Filing Dt:
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09/24/2008
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Title:
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ULTRA THIN PACKAGE AND FABRICATION METHOD
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Patent #:
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Issue Dt:
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12/07/2010
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Application #:
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12242603
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Filing Dt:
|
09/30/2008
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Title:
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SEMICONDUCTOR DEVICE INCLUDING LEADFRAME WITH INCREASED I/O
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Patent #:
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Issue Dt:
|
08/02/2011
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Application #:
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12246226
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Filing Dt:
|
10/06/2008
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Title:
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INCREASED I/O LEADFRAME AND SEMICONDUCTOR DEVICE INCLUDING SAME
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Patent #:
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Issue Dt:
|
08/30/2011
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Application #:
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12259096
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Filing Dt:
|
10/27/2008
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Title:
|
SEMICONDUCTOR DEVICE WITH INCREASED I/O LEADFRAME
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Patent #:
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Issue Dt:
|
09/20/2011
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Application #:
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12269357
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Filing Dt:
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11/12/2008
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Title:
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PACKAGE FAILURE PROGNOSTIC STRUCTURE AND METHOD
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Patent #:
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Issue Dt:
|
11/30/2010
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Application #:
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12270690
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Filing Dt:
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11/13/2008
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Title:
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SEMICONDUCTOR DEVICES AND FABRICATION METHODS THEREOF
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Patent #:
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Issue Dt:
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01/03/2012
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Application #:
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12272606
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Filing Dt:
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11/17/2008
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Title:
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SEMICONDUCTOR DEVICE INCLUDING INCREASED CAPACITY LEADFRAME
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Patent #:
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Issue Dt:
|
12/06/2011
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Application #:
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12273500
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Filing Dt:
|
11/18/2008
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Title:
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SEMICONDUCTOR DEVICE WITH INCREASED I/O LEADFRAME INCLUDING PASSIVE DEVICE
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Patent #:
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Issue Dt:
|
01/25/2011
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Application #:
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12276121
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Filing Dt:
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11/21/2008
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Title:
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SEMICONDUCTOR DEVICE INCLUDING LEADFRAME HAVING POWER BARS AND INCREASED I/O
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Patent #:
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Issue Dt:
|
06/15/2010
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Application #:
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12291119
|
Filing Dt:
|
11/05/2008
|
|
Title:
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STACKABLE SEMICONDUCTOR PACKAGE
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|
|
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Patent #:
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Issue Dt:
|
12/28/2010
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Application #:
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12291767
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Filing Dt:
|
11/12/2008
|
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Title:
|
STACKED FLIP CHIP DIE ASSEMBLY
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|
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Patent #:
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Issue Dt:
|
01/04/2011
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Application #:
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12317649
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Filing Dt:
|
12/23/2008
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Publication #:
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Pub Dt:
|
05/28/2009
| | | | |
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Title:
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ADHESIVE ON WIRE STACKED SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
|
03/29/2011
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Application #:
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12323124
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Filing Dt:
|
11/25/2008
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Publication #:
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Pub Dt:
|
05/27/2010
| | | | |
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Title:
|
SYSTEM AND METHOD TO PROVIDE RF SHIELDING FOR A MEMS MICROPHONE PACKAGE
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|
|
|
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Patent #:
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|
Issue Dt:
|
03/06/2012
|
Application #:
|
12327716
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Filing Dt:
|
12/03/2008
|
|
Title:
|
SHIELDING FOR A SEMICONDUCTOR PACKAGE
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|
|
|
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Patent #:
|
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Issue Dt:
|
07/19/2011
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Application #:
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12327763
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Filing Dt:
|
12/03/2008
|
|
Title:
|
PACKAGE IN PACKAGE SEMICONDUCTOR DEVICE
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|
|
|
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Patent #:
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|
Issue Dt:
|
01/24/2012
|
Application #:
|
12330769
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Filing Dt:
|
12/09/2008
|
|
Title:
|
SYSTEM AND METHOD FOR COMPARTMENTAL SHIELDING OF STACKED PACKAGES
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|
|
|
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Patent #:
|
|
Issue Dt:
|
09/06/2011
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Application #:
|
12335365
|
Filing Dt:
|
12/15/2008
|
|
Title:
|
SEMICONDUCTOR DEVICE HAVING EMI SHIELDING AND METHOD THEREFOR
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/13/2011
|
Application #:
|
12342386
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Filing Dt:
|
12/23/2008
|
|
Title:
|
SEMICONDUCTOR PACKAGE HAVING A HEAT SPREADER WITH AN EXPOSED EXTERIOR SURFACE AND A TOP MOLD GATE
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|
|
|
Patent #:
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|
Issue Dt:
|
12/14/2010
|
Application #:
|
12342829
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Filing Dt:
|
12/23/2008
|
|
Title:
|
SYSTEM AND METHOD FOR SHIELDING OF PACKAGE ON PACKAGE (POP) ASSEMBLIES
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/15/2012
|
Application #:
|
12342839
|
Filing Dt:
|
12/23/2008
|
|
Title:
|
PROTRUDING POST SUBSTRATE PACKAGE STRUCTURE AND METHOD
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/03/2011
|
Application #:
|
12345421
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Filing Dt:
|
12/29/2008
|
|
Publication #:
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Pub Dt:
|
07/01/2010
| | | | |
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Title:
|
MICRO-OPTICAL DEVICE PACKAGING SYSTEM
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|
