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Reel/Frame:	029597/0452			Pages:	9
		Recorded:	01/09/2013
Attorney Dkt #:	AMKOR TECHNOLOGY, INC.
Conveyance:	NUNC PRO TUNC ASSIGNMENT (SEE DOCUMENT FOR DETAILS). EFFECTIVE 11/01/2012

Total properties: 44

Patent #:	5162257	Issue Dt:	11/10/1992	Application #:	07759450	Filing Dt:	09/13/1991
Title:	SOLDER BUMP FABRICATION METHOD AND SOLDER BUMPS FORMED THEREBY

Patent #:	5289631	Issue Dt:	03/01/1994	Application #:	07845996	Filing Dt:	03/04/1992
Title:	METHOD FOR TESTING, BURN-IN, AND/OR PROGRAMMING OF INTEGRATED CIRCUIT CHIPS

Patent #:	5293006	Issue Dt:	03/08/1994	Application #:	07927069	Filing Dt:	08/07/1992
Title:	SOLDER BUMP INCLUDING CIRCULAR LIP

Patent #:	5374893	Issue Dt:	12/20/1994	Application #:	08127784	Filing Dt:	09/27/1993
Title:	METHOD AND APPARATUS FOR TESTING, BURN-IN, AND/OR PROGRAMMING OF INTEGRATED CIRCUIT CHIPS, AND FOR PLACING SOLDER BUMPS THEREON

Patent #:	5381946	Issue Dt:	01/17/1995	Application #:	08127785	Filing Dt:	09/27/1993
Title:	METHOD OF FORMING DIFFERING VOLUME SOLDER BUMPS

Patent #:	5447264	Issue Dt:	09/05/1995	Application #:	08270166	Filing Dt:	07/01/1994
Title:	RECESSED VIA APPARATUS FOR TESTING, BURN-IN, AND/OR PROGRAMMING OF INTEGRATED CIRCUIT CHIPS, AND FOR PLACING SOLDER BUMPS THEREON

Patent #:	5793116	Issue Dt:	08/11/1998	Application #:	08654539	Filing Dt:	05/29/1996
Title:	MICROELECTRONIC PACKAGING USING ARCHED SOLDER COLUMNS

Patent #:	5767010	Issue Dt:	06/16/1998	Application #:	08744122	Filing Dt:	11/05/1996
Title:	SOLDER BUMP FABRICATION METHODS AND STRUCTURE INCLUDING A TITANIUM BARRIER LAYER

Patent #:	5902686	Issue Dt:	05/11/1999	Application #:	08754637	Filing Dt:	11/21/1996
Title:	METHODS FOR FORMING AN INTERMETALLIC REGION BETWEEN A SOLDER BUMP AND AN UNDER BUMP METALLURGY LAYER AND RELATED STRUCTURES

Patent #:	6117299	Issue Dt:	09/12/2000	Application #:	08854075	Filing Dt:	05/09/1997
Title:	METHODS OF ELECTROPLATING SOLDER BUMPS OF UNIFORM HEIGHT ON INTEGRATED CIRCUIT SUBSTRATES

Patent #:	5892179	Issue Dt:	04/06/1999	Application #:	08977258	Filing Dt:	11/24/1997
Title:	METHODS FOR FORMING INTEGRATED REDISTRIBUTION ROUTING CONDUCTORS AND STRUCTURES FORMED THEREBY

Patent #:	6222279	Issue Dt:	04/24/2001	Application #:	09063422	Filing Dt:	04/20/1998
Title:	SOLDER BUMP FABRICATION METHODS AND STRUCTURES INCLUDING A TITANIUM BARRIER LAYER

Patent #:	5963793	Issue Dt:	10/05/1999	Application #:	09096754	Filing Dt:	06/12/1998
Title:	MICROELECTRONIC PACKAGING USING ARCHED SOLDER COLUMNS

Patent #:	6388203	Issue Dt:	05/14/2002	Application #:	09122285	Filing Dt:	07/24/1998
Title:	CONTROLLED-SHAPED SOLDER RESERVOIRS FOR INCREASING THE VOLUME OF SOLDER BUMPS, AND STRUCTURES FORMED THEREBY

Patent #:	6389691	Issue Dt:	05/21/2002	Application #:	09286015	Filing Dt:	04/05/1999
Title:	METHODS FOR FORMING INTEGRATED REDISTRIBUTION ROUTING CONDUCTORS AND SOLDER BUMPS

Patent #:	6329608	Issue Dt:	12/11/2001	Application #:	09286143	Filing Dt:	04/05/1999
Title:	KEY-SHAPED SOLDER BUMPS AND UNDER BUMP METALLURGY

Patent #:	6492197	Issue Dt:	12/10/2002	Application #:	09576477	Filing Dt:	05/23/2000
Title:	TRILAYER/BILAYER SOLDER BUMPS AND FABRICATION METHODS THEREFOR

Patent #:	6418033	Issue Dt:	07/09/2002	Application #:	09714311	Filing Dt:	11/16/2000
Title:	MICROELECTRONIC PACKAGES IN WHICH SECOND MICROELECTRONIC SUBSTRATES ARE ORIENTED RELATIVE TO FIRST MICROELECTRONIC SUBSTRATES AT ACUTE ANGLES

Patent #:	6392163	Issue Dt:	05/21/2002	Application #:	09790421	Filing Dt:	02/22/2001
Publication #:	US20020020551	Pub Dt:	02/21/2002
Title:	CONTROLLED-SHAPED SOLDER RESERVOIRS FOR INCREASING THE VOLUME OF SOLDER BUMPS

Patent #:	6762122	Issue Dt:	07/13/2004	Application #:	09966316	Filing Dt:	09/27/2001
Publication #:	US20030057559	Pub Dt:	03/27/2003
Title:	METHODS OF FORMING METALLURGY STRUCTURES FOR WIRE AND SOLDER BONDING

Patent #:	7032806	Issue Dt:	04/25/2006	Application #:	10008466	Filing Dt:	11/09/2001
Publication #:	US20020153092	Pub Dt:	10/24/2002
Title:	METHODS OF POSITIONING COMPONENTS USING LIQUID PRIME MOVERS AND RELATED STRUCTURES

Patent #:	6666368	Issue Dt:	12/23/2003	Application #:	10016270	Filing Dt:	11/02/2001
Publication #:	US20020109000	Pub Dt:	08/15/2002
Title:	METHODS AND SYSTEMS FOR POSITIONING SUBSTRATES USING SPRING FORCE OF PHASE-CHANGEABLE BUMPS THEREBETWEEN

Patent #:	6863209	Issue Dt:	03/08/2005	Application #:	10017350	Filing Dt:	12/14/2001
Publication #:	US20020074381	Pub Dt:	06/20/2002
Title:	LOW TEMPERATURE METHODS OF BONDING COMPONENTS AND RELATED STRUCTURES

Patent #:	6793792	Issue Dt:	09/21/2004	Application #:	10044387	Filing Dt:	01/11/2002
Publication #:	US20020092771	Pub Dt:	07/18/2002
Title:	ELECTROPLATING METHODS INCLUDING MAINTAINING A DETERMINED ELECTROPLATING VOLTAGE AND RELATED SYSTEMS

Patent #:	6960828	Issue Dt:	11/01/2005	Application #:	10601938	Filing Dt:	06/23/2003
Publication #:	US20040053483	Pub Dt:	03/18/2004
Title:	ELECTRONIC STRUCTURES INCLUDING CONDUCTIVE SHUNT LAYERS

Patent #:	7495326	Issue Dt:	02/24/2009	Application #:	10689976	Filing Dt:	10/21/2003
Publication #:	US20040124520	Pub Dt:	07/01/2004
Title:	STACKED ELECTRONIC STRUCTURES INCLUDING OFFSET SUBSTRATES

Patent #:	7081404	Issue Dt:	07/25/2006	Application #:	10780529	Filing Dt:	02/17/2004
Publication #:	US20040209406	Pub Dt:	10/21/2004
Title:	METHODS OF SELECTIVELY BUMPING INTEGRATED CIRCUIT SUBSTRATES AND RELATED STRUCTURES

Patent #:	7156284	Issue Dt:	01/02/2007	Application #:	10790967	Filing Dt:	03/02/2004
Publication #:	US20040169064	Pub Dt:	09/02/2004
Title:	LOW TEMPERATURE METHODS OF BONDING COMPONENTS AND RELATED STRUCTURES

Patent #:	7665652	Issue Dt:	02/23/2010	Application #:	10837830	Filing Dt:	05/03/2004
Publication #:	US20040206801	Pub Dt:	10/21/2004
Title:	ELECTRONIC DEVICES INCLUDING METALLURGY STRUCTURES FOR WIRE AND SOLDER BONDING

Patent #:	7244671	Issue Dt:	07/17/2007	Application #:	10879411	Filing Dt:	06/29/2004
Publication #:	US20050020047	Pub Dt:	01/27/2005
Title:	METHODS OF FORMING CONDUCTIVE STRUCTURES INCLUDING TITANIUM-TUNGSTEN BASE LAYERS AND RELATED STRUCTURES

Patent #:	7049216	Issue Dt:	05/23/2006	Application #:	10965640	Filing Dt:	10/13/2004
Publication #:	US20050136641	Pub Dt:	06/23/2005
Title:	METHODS OF PROVIDING SOLDER STRUCTURES FOR OUT PLANE CONNECTIONS

Patent #:	7427557	Issue Dt:	09/23/2008	Application #:	11075474	Filing Dt:	03/09/2005
Publication #:	US20050215045	Pub Dt:	09/29/2005
Title:	METHODS OF FORMING BUMPS USING BARRIER LAYERS AS ETCH MASKS

Patent #:	7547623	Issue Dt:	06/16/2009	Application #:	11170220	Filing Dt:	06/29/2005
Publication #:	US20060030139	Pub Dt:	02/09/2006
Title:	METHODS OF FORMING LEAD FREE SOLDER BUMPS

Patent #:	7213740	Issue Dt:	05/08/2007	Application #:	11213414	Filing Dt:	08/26/2005
Publication #:	US20050279809	Pub Dt:	12/22/2005
Title:	OPTICAL STRUCTURES INCLUDING LIQUID BUMPS AND RELATED METHODS

Patent #:	7297631	Issue Dt:	11/20/2007	Application #:	11226569	Filing Dt:	09/14/2005
Publication #:	US20060009023	Pub Dt:	01/12/2006
Title:	METHODS OF FORMING ELECTRONIC STRUCTURES INCLUDING CONDUCTIVE SHUNT LAYERS AND RELATED STRUCTURES

Patent #:	7531898	Issue Dt:	05/12/2009	Application #:	11270366	Filing Dt:	11/09/2005
Publication #:	US20060076679	Pub Dt:	04/13/2006
Title:	NON-CIRCULAR VIA HOLES FOR BUMPING PADS AND RELATED STRUCTURES

Patent #:	7659621	Issue Dt:	02/09/2010	Application #:	11362964	Filing Dt:	02/27/2006
Publication #:	US20060138675	Pub Dt:	06/29/2006
Title:	SOLDER STRUCTURES FOR OUT OF PLANE CONNECTIONS

Patent #:	7579694	Issue Dt:	08/25/2009	Application #:	11446341	Filing Dt:	06/02/2006
Publication #:	US20060231951	Pub Dt:	10/19/2006
Title:	ELECTRONIC DEVICES INCLUDING OFFSET CONDUCTIVE BUMPS

Patent #:	7550849	Issue Dt:	06/23/2009	Application #:	11765648	Filing Dt:	06/20/2007
Publication #:	US20070241460	Pub Dt:	10/18/2007
Title:	CONDUCTIVE STRUCTURES INCLUDING TITANIUM-TUNGSTEN BASE LAYERS

Patent #:	7879715	Issue Dt:	02/01/2011	Application #:	11868785	Filing Dt:	10/08/2007
Publication #:	US20080026560	Pub Dt:	01/31/2008
Title:	METHODS OF FORMING ELECTRONIC STRUCTURES INCLUDING CONDUCTIVE SHUNT LAYERS AND RELATED STRUCTURES

Patent #:	7834454	Issue Dt:	11/16/2010	Application #:	12194999	Filing Dt:	08/20/2008
Publication #:	US20080308931	Pub Dt:	12/18/2008
Title:	ELECTRONIC STRUCTURES INCLUDING BARRIER LAYERS DEFINING LIPS

Patent #:	7839000	Issue Dt:	11/23/2010	Application #:	12437632	Filing Dt:	05/08/2009
Publication #:	US20090212427	Pub Dt:	08/27/2009
Title:	SOLDER STRUCTURES INCLUDING BARRIER LAYERS WITH NICKEL AND/OR COPPER

Patent #:	8487432	Issue Dt:	07/16/2013	Application #:	12907430	Filing Dt:	10/19/2010
Publication #:	US20110037171	Pub Dt:	02/17/2011
Title:	ELECTRONIC STRUCTURES INCLUDING BARRIER LAYERS AND/OR OXIDATION BARRIERS DEFINING LIPS AND RELATED METHODS

Patent #:	8294269	Issue Dt:	10/23/2012	Application #:	12963005	Filing Dt:	12/08/2010
Publication #:	US20110084392	Pub Dt:	04/14/2011
Title:	ELECTRONIC STRUCTURES INCLUDING CONDUCTIVE LAYERS COMPRISING COPPER AND HAVING A THICKNESS OF AT LEAST 0.5 MICROMETERS

Assignor

UNITIVE INTERNATIONAL, LTD.

Exec Dt:

12/19/2012

Assignee

AMKOR TECHNOLOGY, INC.

1900 SOUTH PRICE ROAD

CHANDLER, ARIZONA 85286

Correspondence name and address
	CHRISTOPHER C. WINSLADE
	500 W. MADISON STREET
	34TH FLOOR
	CHICAGO, IL 60661

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