Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 030770/0132 | |
| Pages: | 5 |
| | Recorded: | 07/10/2013 | | |
| Attorney Dkt #: | MEGICA I (092967C1C1) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
8
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Patent #:
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Issue Dt:
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11/20/2007
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Application #:
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10794472
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Filing Dt:
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03/05/2004
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Publication #:
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Pub Dt:
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09/02/2004
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Title:
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METHOD FOR FABRICATING CIRCUITRY COMPONENT
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Patent #:
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Issue Dt:
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12/21/2010
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Application #:
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12127794
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Filing Dt:
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05/27/2008
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Publication #:
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Pub Dt:
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09/18/2008
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Title:
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CHIP STRUCTURE WITH BUMPS AND TESTING PADS
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Patent #:
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Issue Dt:
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09/20/2011
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Application #:
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12128644
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Filing Dt:
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05/29/2008
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Publication #:
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Pub Dt:
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09/18/2008
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Title:
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METHOD OF JOINING CHIPS UTILIZING COPPER PILLAR
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Patent #:
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Issue Dt:
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11/18/2014
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Application #:
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12132628
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Filing Dt:
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06/04/2008
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Publication #:
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Pub Dt:
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12/04/2008
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Title:
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CYLINDRICAL BONDING STRUCTURE AND METHOD OF MANUFACTURE
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Patent #:
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Issue Dt:
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03/01/2011
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Application #:
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12172275
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Filing Dt:
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07/14/2008
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Publication #:
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Pub Dt:
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10/30/2008
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Title:
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INTEGRATED CHIP PACKAGE STRUCTURE USING ORGANIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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07/12/2011
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Application #:
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12941069
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Filing Dt:
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11/07/2010
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Publication #:
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Pub Dt:
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03/03/2011
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Title:
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CHIP STRUCTURE WITH BUMPS AND TESTING PADS
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Patent #:
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Issue Dt:
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10/01/2013
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Application #:
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13191356
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Filing Dt:
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07/26/2011
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Publication #:
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Pub Dt:
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11/17/2011
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Title:
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CHIP STRUCTURE AND PROCESS FOR FORMING THE SAME
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Patent #:
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Issue Dt:
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02/05/2013
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Application #:
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13277142
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Filing Dt:
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10/19/2011
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Publication #:
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Pub Dt:
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04/26/2012
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Title:
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CHIP STRUCTURE AND PROCESS FOR FORMING THE SAME
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Assignee
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| ROOM 301/302, NO. 47, PARK 2ND RD. |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN ROC |
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Correspondence name and address
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QUALCOMM INCORPORATED
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5775 MOREHOUSE DRIVE
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SAN DIEGO, CA 92121-1714
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